LFXP20E-5FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA |
|---|---|
| Quantity | 922 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-5FN388C – XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA
The LFXP20E-5FN388C is a non-volatile FPGA from the LatticeXP family, offering approximately 20,000 logic elements and roughly 405,504 bits of on-chip RAM. It combines instant-on configuration, flexible I/O, and in-field reconfiguration capabilities in a compact 388-ball FPBGA (23 × 23 mm) surface-mount package.
Designed for commercial applications that need high I/O density and embedded memory, this device supports a broad set of serial and parallel interfaces and provides system-level features such as multiple PLLs, sleep mode for static current reduction, and internal logic analysis and configuration ports.
Key Features
- Logic and Capacity — Approximately 20,000 logic elements with a total of 405,504 bits of embedded RAM for mixed logic and memory-intensive designs.
- High I/O Count — 268 user I/Os to support complex interface requirements and high-pin-count system designs.
- Non-volatile, Instant-on Architecture — LatticeXP family non-volatile technology enables instant-on operation without external configuration memory and supports secure configuration.
- In-field Reconfiguration (TransFR) — Supports reconfiguration of SRAM-based logic while the system operates for field updates and feature upgrades.
- Flexible I/O Standards — Programmable I/O buffer supports a wide range of standards including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Dedicated DDR Support — Implements interfaces up to DDR333 for memory subsystem integration.
- Clocking and Timing — Up to four analog PLLs per device for clock multiplication, division and phase shifting.
- Power and Sleep — Core supply range 1.14 V to 1.26 V and a Sleep Mode that enables significant static current reduction for lower-power standby states.
- Package and Mounting — 388-ball FPBGA (23 × 23 mm) supplier package, surface-mount mounting type for compact board-level integration.
- Operating Range and Compliance — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- System Support — IEEE 1149.1 boundary-scan and internal logic analysis capability (ispTRACY), plus JTAG configuration access.
Typical Applications
- Embedded Systems — Integration of custom logic, memory controllers and protocol bridges in compact commercial embedded products benefiting from instant-on and reconfigurability.
- Communications Equipment — High I/O count and flexible I/O standards enable interface aggregation, protocol conversion and DDR memory interfacing for networking modules.
- Prototyping and In-field Upgrades — Non-volatile configuration and TransFR reconfiguration permit rapid prototyping and in-field feature updates without external configuration memory.
- Industrial Control (Commercial Grade) — Control and I/O aggregation in commercial-grade industrial applications where the device’s operating range and I/O flexibility meet system requirements.
Unique Advantages
- Highly Integrated Logic and Memory: Approximately 20,000 logic elements combined with ~405,504 bits of embedded RAM reduce external component count and simplify board design.
- Instant-On, Secure Configuration: Non-volatile architecture eliminates the need for external configuration memory and enables rapid startup with secure configuration storage.
- Flexible Interface Support: Programmable sysIO buffers and a large I/O count let a single device handle multiple interface standards and high pin-density designs.
- Field Update Capability: TransFR reconfiguration allows in-field logic updates while the system is running, enabling feature upgrades and bug fixes without device removal.
- Low-Voltage Core: Narrow core supply range (1.14–1.26 V) supports integration into low-voltage power domains and predictable power budgeting.
- Compact, Surface-Mount Package: 388-ball FPBGA (23 × 23 mm) offers high pin count in a compact footprint for dense PCB layouts.
Why Choose LFXP20E-5FN388C?
The LFXP20E-5FN388C is positioned for commercial designs that require a balance of logic capacity, substantial embedded memory, and extensive I/O connectivity in a single, non-volatile FPGA. Its instant-on behavior, in-field reconfiguration, and flexible I/O support make it suitable for projects that demand rapid system bring-up and ongoing feature evolution.
Choose this device when you need a compact, RoHS-compliant FPGA solution with predictable low-voltage operation, multiple PLLs for clock management, and the ability to interface to a wide range of memory and I/O standards while maintaining a small BOM and simplified system architecture.
Request a quote or submit a product inquiry to obtain pricing, availability and further technical details for the LFXP20E-5FN388C.

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