LFXP20E-5F484C

The LFXP20E-5F484C is a LatticeXP-series FPGA from Lattice Semiconductor, offering a non-volatile, reconfigurable logic platform in a 484-ball BGA package. It delivers approximately 20,000 logic elements, up to 340 user I/Os and roughly 405,504 bits of on-chip RAM, making it suitable for compact, I/O-dense designs that require in-field reconfiguration and fast start-up behavior.

Engineered for commercial-temperature designs, this surface-mount FPGA targets applications that need high I/O density, flexible memory resources and advanced system-level features such as low-power sleep mode and in-system reconfiguration.

Key Features

• Logic Capacity  Approximately 20,000 logic elements and 2,464 logic blocks provide the fabric needed for medium-to-high complexity designs.
• Embedded Memory  Total on-chip RAM of 405,504 bits (approximately 0.4 Mbits) with support for distributed and block memory use across the device.
• High I/O Density  Up to 340 I/Os support dense interfacing and multi-protocol connectivity from a single device.
• Non-volatile, Reconfigurable Architecture  Series-level features include instant-on capability and reconfiguration options for in-field updates and system flexibility.
• Power and Voltage  Specified core supply range 1.14 V to 1.26 V; device supports surface-mount deployment for compact board layouts.
• Clocking and System Support  Family-level support includes multiple PLLs for clock multiply/divide and phase control and system-level features for boundary scan and internal logic analysis.
• Package and Mounting  484-ball FBGA package (23 × 23 mm) with surface-mount assembly simplifies placement in space-constrained systems.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• DDR Memory Interface and Controllers  On-chip memory and series-level DDR support make the device suitable for implementing DDR interface logic and memory controllers.
• High-Density I/O Bridging  Up to 340 I/Os enable protocol bridging and multi-channel interface aggregation in communications and connectivity modules.
• In-Field Updatable Systems  Non-volatile architecture and reconfiguration capabilities support systems that require field updates or rapid reprogramming.

Unique Advantages

• Instant-on Non‑volatile Operation:  Non-volatile architecture enables rapid power-up without external configuration memory.
• High I/O Count:  340 user I/Os reduce the need for external multiplexing or additional interface ICs in I/O-heavy designs.
• Integrated Memory Resources:  Approximately 0.4 Mbits of embedded RAM combined with distributed memory capabilities supports local buffering and on-chip storage.
• Flexible Clocking:  Multiple PLLs available at the family level permit versatile clock management for complex timing domains.
• Low-Power Options:  Series-level sleep mode provides substantial static current reduction for energy-sensitive applications.
• Compact BGA Packaging:  484-ball FBGA (23 × 23 mm) balances high pin count with a small PCB footprint for space-constrained designs.

Why Choose LFXP20E-5F484C?

The LFXP20E-5F484C positions itself as a versatile, mid-to-high density FPGA for commercial applications that require substantial I/O resources, meaningful embedded memory, and reconfigurable non-volatile operation. Its combination of roughly 20,000 logic elements, approximately 0.4 Mbits of on-chip RAM and up to 340 I/Os provides a balanced platform for bridging, control and memory interface tasks.

Designed for teams needing in-field reconfiguration, instant-on behavior and compact packaging, this FPGA offers the system-level capabilities and commercial-temperature operation required for many embedded and connectivity-focused designs, while conforming to RoHS environmental requirements.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LFXP20E-5F484C. Our team can assist with volume pricing and integration questions to help accelerate your design cycle.