LFXP3C-3QN208I

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 1,049 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O136Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-3QN208I – XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

The LFXP3C-3QN208I is a LatticeXP family FPGA providing non-volatile, instantly available programmable logic in a 208-pin BFQFP package. It integrates approximately 3,000 logic elements and on-chip embedded memory with up to 136 user I/Os to address compact embedded and industrial system designs.

Key architectural advantages include instant-on non-volatile configuration (no external configuration memory required), in-field reconfiguration, multiple PLLs and flexible I/O support — all within an industrial-grade operating range.

Key Features

  • Logic Capacity  Approximately 3,000 logic elements with 384 logic blocks to implement combinational and sequential designs.
  • Embedded Memory  Approximately 55 Kbits (55,296 bits) of on-chip RAM and support for distributed RAM resources for state, buffering and small data storage.
  • I/O & Interfaces  Up to 136 user I/O pins with programmable sysIO buffer support for a wide range of standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI and others as defined by the LatticeXP family).
  • Configuration & Security  Non-volatile ispXP™ based architecture with instant-on behavior and no external configuration memory; supports in-system reconfiguration and JTAG-based programming.
  • Clocking  Includes device PLL resources (LFXP3 devices include 2 PLLs) for clock multiplication, division and phase shifting.
  • Power & Low-Power Modes  Support for a sleep mode that can reduce static current by up to 1000×, enabling lower power standby states.
  • Voltage & Temperature  Operates across a 1.71 V to 3.465 V supply range and rated for industrial temperatures from −40 °C to 100 °C.
  • Package  208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) for surface-mount PCB assemblies.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use the LFXP3C-3QN208I for compact control logic, I/O aggregation and real-time decision-making in industrial equipment, benefiting from the industrial temperature rating.
  • Embedded Systems  Instant-on configuration and integrated memory make it suitable for embedded controllers and small form-factor systems that require fast startup and in-field updates.
  • Interface Bridging & Protocol Conversion  Flexible I/O standards and ample I/O count support translating between different bus and signaling standards in communication and instrument applications.
  • Memory & Bus Controllers  On-chip memory resources and PLLs enable implementation of local buffering, memory controllers and timing-critical interfaces.

Unique Advantages

  • Instant-on, Non-volatile Configuration:  No external configuration memory required, enabling fast power-up and simplified system BOM.
  • In-field Reconfigurability:  SRAM-based logic can be reconfigured in milliseconds and supports system-level updates without external storage.
  • Flexible I/O Support:  Programmable I/O buffers accommodate a broad range of signaling standards, easing interface integration across modules.
  • Low-power Standby:  Sleep mode capability can dramatically reduce static current for energy-sensitive systems.
  • Industrial Temperature Range:  Rated −40 °C to 100 °C for deployment in industrial environments where extended temperature tolerance is required.
  • Compact, High-I/O Package:  208-pin BFQFP package provides a balance of I/O density and PCB footprint for space-constrained designs.

Why Choose LFXP3C-3QN208I?

The LFXP3C-3QN208I positions itself as a compact, industrial-grade FPGA option delivering non-volatile instant-on behavior, approximately 3,000 logic elements and embedded memory within a 208-pin package. Its combination of flexible I/O support, low-power sleep capability and in-field reconfiguration addresses designs that need fast startup, field updates and robust thermal performance.

Designers targeting embedded and industrial systems will find the LFXP3C-3QN208I useful for consolidating discrete logic, implementing protocol interfaces and adding reconfigurable subsystems while benefiting from LatticeXP family tools and IP resources referenced in the device documentation.

Request a quote or submit a parts inquiry to get pricing and availability for the LFXP3C-3QN208I. Our team can provide technical and purchasing information to support your design evaluation.

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