LFXP3C-3QN208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 1,049 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-3QN208I – XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP
The LFXP3C-3QN208I is a LatticeXP family FPGA providing non-volatile, instantly available programmable logic in a 208-pin BFQFP package. It integrates approximately 3,000 logic elements and on-chip embedded memory with up to 136 user I/Os to address compact embedded and industrial system designs.
Key architectural advantages include instant-on non-volatile configuration (no external configuration memory required), in-field reconfiguration, multiple PLLs and flexible I/O support — all within an industrial-grade operating range.
Key Features
- Logic Capacity Approximately 3,000 logic elements with 384 logic blocks to implement combinational and sequential designs.
- Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM and support for distributed RAM resources for state, buffering and small data storage.
- I/O & Interfaces Up to 136 user I/O pins with programmable sysIO buffer support for a wide range of standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI and others as defined by the LatticeXP family).
- Configuration & Security Non-volatile ispXP™ based architecture with instant-on behavior and no external configuration memory; supports in-system reconfiguration and JTAG-based programming.
- Clocking Includes device PLL resources (LFXP3 devices include 2 PLLs) for clock multiplication, division and phase shifting.
- Power & Low-Power Modes Support for a sleep mode that can reduce static current by up to 1000×, enabling lower power standby states.
- Voltage & Temperature Operates across a 1.71 V to 3.465 V supply range and rated for industrial temperatures from −40 °C to 100 °C.
- Package 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) for surface-mount PCB assemblies.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Use the LFXP3C-3QN208I for compact control logic, I/O aggregation and real-time decision-making in industrial equipment, benefiting from the industrial temperature rating.
- Embedded Systems Instant-on configuration and integrated memory make it suitable for embedded controllers and small form-factor systems that require fast startup and in-field updates.
- Interface Bridging & Protocol Conversion Flexible I/O standards and ample I/O count support translating between different bus and signaling standards in communication and instrument applications.
- Memory & Bus Controllers On-chip memory resources and PLLs enable implementation of local buffering, memory controllers and timing-critical interfaces.
Unique Advantages
- Instant-on, Non-volatile Configuration: No external configuration memory required, enabling fast power-up and simplified system BOM.
- In-field Reconfigurability: SRAM-based logic can be reconfigured in milliseconds and supports system-level updates without external storage.
- Flexible I/O Support: Programmable I/O buffers accommodate a broad range of signaling standards, easing interface integration across modules.
- Low-power Standby: Sleep mode capability can dramatically reduce static current for energy-sensitive systems.
- Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in industrial environments where extended temperature tolerance is required.
- Compact, High-I/O Package: 208-pin BFQFP package provides a balance of I/O density and PCB footprint for space-constrained designs.
Why Choose LFXP3C-3QN208I?
The LFXP3C-3QN208I positions itself as a compact, industrial-grade FPGA option delivering non-volatile instant-on behavior, approximately 3,000 logic elements and embedded memory within a 208-pin package. Its combination of flexible I/O support, low-power sleep capability and in-field reconfiguration addresses designs that need fast startup, field updates and robust thermal performance.
Designers targeting embedded and industrial systems will find the LFXP3C-3QN208I useful for consolidating discrete logic, implementing protocol interfaces and adding reconfigurable subsystems while benefiting from LatticeXP family tools and IP resources referenced in the device documentation.
Request a quote or submit a parts inquiry to get pricing and availability for the LFXP3C-3QN208I. Our team can provide technical and purchasing information to support your design evaluation.

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