LFXP6C-3F256I

The LFXP6C-3F256I is a non-volatile LatticeXP-series FPGA combining reconfigurable logic, on-chip memory and flexible I/O in a compact 256-ball fpBGA package. It provides 6,000 logic elements, 73,728 bits of on-chip RAM (embedded block RAM reported as 72 Kbits for the LFXP6 device), and up to 188 I/Os—making it suitable for industrial embedded and system-level designs that require instant-on, in-field reconfiguration and a wide operating voltage and temperature range.

Designed for applications needing deterministic boot behavior and in-system updates, this device offers instant-on operation without external configuration memory, sleep-mode power reduction and in-field reconfiguration capability.

Key Features

• Core architecture  Non-volatile LatticeXP family FPGA with instant-on capability and infinitely reconfigurable logic; no external configuration memory required.
• Logic resources  Approximately 6,000 logic elements (6K LUTs) and 720 configurable PFU/PFF blocks for mid-range logic density.
• On-chip memory  73,728 bits of on-chip RAM (embedded block RAM ≈72 Kbits for LFXP6). The LatticeXP family also provides distributed RAM resources (LFXP6 family entry: 23 Kbits distributed RAM).
• I/O and interface flexibility  Up to 188 I/Os in a 256-ball fpBGA (17×17 mm) package with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling standards.
• Clocking  Analog sysCLOCK PLL resources (LFXP6 devices provide 2 PLLs) for clock multiply, divide and phase shifting.
• Reconfiguration and system tools  TransFR™ in-field reconfiguration for logic updates while the system is operating; supports ispTRACY™ internal logic analysis and IEEE 1149.1 boundary-scan.
• Power and supply  Operates across a 1.71 V to 3.465 V supply window for board-level flexibility; includes a Sleep Mode enabling significant static current reduction.
• Package, mounting and environmental  256-FPBGA (17×17 mm) surface-mount package, industrial grade operation from –40 °C to 100 °C, RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade temperature range and 188 I/Os allow robust interfacing to sensors, actuators and field I/O in control systems.
• Memory interface and buffering  Dedicated DDR memory support and flexible I/O standards provide a platform for DDR front-end interfaces and memory bridging.
• Protocol bridging and I/O aggregation  Programmable sysIO buffers and wide signaling support enable protocol conversion, bus bridging and multi-standard interfacing.
• Embedded system instant-on designs  Non-volatile architecture with no external configuration memory and microsecond power-up supports systems that require deterministic boot and secure bitstream handling.

Unique Advantages

• Non-volatile instant-on: Powers up in microseconds without external configuration memory, simplifying system boot and reducing BOM.
• In-field reconfiguration (TransFR): Allows updates to SRAM-based logic while the system remains operational, reducing service downtime.
• Flexible, high-density I/O: 188 I/Os in a 256-FPBGA package with programmable buffer standards for broad interface compatibility.
• Balanced logic and memory: ~6,000 logic elements with approximately 72 Kbits of embedded block RAM and family-distributed RAM for mid-range embedded designs.
• Low-power modes: Sleep Mode provides major static current reduction for power-sensitive applications.
• Industrial-ready packaging and range: Surface-mount 256-FPBGA (17×17 mm) package and operating range of –40 °C to 100 °C support demanding environments.

Why Choose LFXP6C-3F256I?

The LFXP6C-3F256I delivers a practical balance of logic density, embedded memory and extensive I/O in a compact, industrial-grade fpBGA package. Its non-volatile instant-on architecture, in-field reconfiguration features and flexible voltage and I/O support make it well suited for embedded systems, industrial control, memory interface and protocol bridging designs that require secure, deterministic boot and in-system update capability.

Backed by the LatticeXP family architecture and system-level features such as PLLs, boundary-scan and internal logic analysis support, this device provides a scalable platform for mid-range FPGA designs where fast startup, reconfigurability and interface flexibility are priorities.

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