LFXP6C-3FN256I

The LFXP6C-3FN256I is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It integrates approximately 6000 logic elements, on-chip memory, and a flexible I/O fabric in a compact 256-ball fpBGA package, making it suitable for industrial applications that require reconfigurable logic and robust operating ranges.

Key design points include instant-on non-volatile configuration, a wide supply voltage range (1.71 V to 3.465 V), and an extended operating temperature range of –40°C to 100°C, all in a surface-mount 256-FPBGA (17 × 17 mm) package with 188 I/Os.

Key Features

• Core Logic  Approximately 6000 logic elements and 720 logic block units provide a balanced resource set for mid-density applications.
• Embedded Memory  Approximately 73,728 bits of on-chip RAM (embedded and distributed memory resources) for data buffering, small SRAM blocks, and state storage.
• Flexible I/O  Up to 188 I/Os in a 256-FPBGA package, supporting a wide range of signaling and board-level interfacing.
• Non-volatile, Instant-on Configuration  LatticeXP family characteristics include non-volatile configuration with instant-on capability and reconfiguration support without external configuration memory requirements.
• Voltage and Clocking  Operates across a supply range of 1.71 V to 3.465 V and includes system clock PLL capability as described for the LatticeXP family.
• Package and Mounting  Surface-mount 256-FPBGA (17 × 17 mm) package for high I/O density in a compact footprint.
• Industrial Temperature Grade  Rated for operation from –40°C to 100°C for industrial deployment scenarios.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation  Use the device’s reconfigurable logic, abundant I/Os, and industrial temperature rating for system-level control, interface bridging, and custom protocol handling.
• Memory Interface and Buffering  On-chip RAM and the family’s DDR memory support capabilities make the device suitable for memory interface functions and intermediate buffering.
• Communications and I/O Aggregation  High I/O count and flexible signaling support enable protocol translation, glue logic, and aggregation of peripheral interfaces.

Unique Advantages

• Instant-on Non-volatile Architecture: Reduces system boot time and eliminates the need for external configuration memory.
• Balanced Mid-density Resources: Approximately 6000 logic elements and 73,728 bits of embedded RAM provide a compact platform for moderate-complexity designs.
• Broad Supply Voltage Support: Operates from 1.71 V to 3.465 V, allowing flexible power-domain integration on mixed-voltage boards.
• Industrial Temperature Range: Rated for –40°C to 100°C to meet industrial deployment requirements.
• High I/O Density in a Small Footprint: 188 I/Os in a 256-FPBGA (17 × 17 mm) package simplify board-level routing while preserving I/O flexibility.
• RoHS Compliance: Supports lead-free manufacturing and regulatory expectations for modern electronics assembly.

Why Choose LFXP6C-3FN256I?

The LFXP6C-3FN256I delivers a practical combination of reconfigurable logic, on-chip memory, and a high I/O count in a compact 256-FPBGA package, designed for industrial environments. Its non-volatile instant-on behavior, flexible supply voltage range, and extended temperature operation make it an appropriate choice for designs that require reliable in-field reconfiguration and stable operation across harsh conditions.

This part is suited to engineers and procurement teams building mid-density FPGA solutions for industrial control, communications interface logic, and embedded systems where on-chip RAM, substantial I/O, and reconfigurability are required.

If you would like pricing, availability, or a formal quote for the LFXP6C-3FN256I, please request a quote or submit an inquiry through the vendor channel.