LFXP6C-3Q208C

The LFXP6C-3Q208C is a non-volatile LatticeXP family FPGA offered in a 208-BFQFP surface-mount package. It integrates approximately 6,000 logic elements, on-chip RAM, and flexible I/O to address mid-density embedded logic, interface bridging, and system control applications.

Designed for commercial-temperature systems, the device supports instant-on operation without external configuration memory, programmable I/O voltage ranges, and reconfiguration capabilities for field updates and system-level flexibility.

Key Features

• Core Capacity — 6,000 logic elements suitable for mid-density logic and glue-logic integration.
• On‑chip Memory — Approximately 72 Kbits of embedded RAM for distributed and block memory needs within the device.
• I/O and Packaging — 142 user I/Os in a 208-BFQFP (28 × 28 mm) surface-mount package to support a wide range of external interfaces and board-level connectivity.
• Voltage Flexibility — Supported supply range from 1.71 V to 3.465 V for mixed-voltage system integration.
• Non-volatile, Instant-on Architecture — Powers up quickly with no external configuration memory required and supports in-system reconfiguration.
• Low-power Mode — Sleep mode capability for significant static current reduction during low-activity periods.
• Clocking — Device family supports on-chip PLLs for clock multiply/divide and phase shifting (LFXP6 family PLL count applies).
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded Control — Replace multiple discrete logic parts in mid-complexity controllers and state machines, leveraging 6,000 logic elements and on-chip RAM.
• Interface Bridging — Implement protocol translation and interface logic with 142 I/Os and programmable sysIO buffer options for a range of voltage standards.
• Memory and Bus Interfaces — Support DDR and other memory interfaces using the device's memory resources and on-chip clocking.
• In-field Upgrades — Use reconfiguration features to update logic while deployed, enabling feature upgrades and bug fixes without hardware replacement.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables rapid system start-up.
• Mid-density integration: 6,000 logic elements and embedded RAM reduce BOM complexity by consolidating glue logic and small processors into a single device.
• Flexible I/O and voltage support: 142 I/Os and a wide supply range (1.71 V–3.465 V) simplify integration with mixed-voltage subsystems.
• Field reconfiguration: Reconfigure SRAM-based logic in-system for updates and feature changes without board swaps.
• Low-power standby: Sleep mode capability provides large static current reduction for energy-sensitive applications.
• Design ecosystem support: The LatticeXP family is supported by vendor tools and IP to accelerate implementation and verification.

Why Choose LFXP6C-3Q208C?

The LFXP6C-3Q208C positions itself as a practical, mid-density FPGA option for designers who need non-volatile, reconfigurable logic with substantial I/O and on-chip memory in a compact 208‑pin BFQFP package. Its combination of approximately 6,000 logic elements, roughly 72 Kbits of embedded RAM, and flexible supply voltage support makes it suitable for embedded controllers, interface bridging, and in-field upgradable systems operating in commercial-temperature environments.

Supported by Lattice design tools and IP for the LatticeXP family, this device offers a balance of integration, configurability, and system-level features for product developers focused on reducing board-level complexity while retaining the ability to update logic after deployment.

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