LFXP6C-3T144I

The LFXP6C-3T144I is an industrial-grade, non-volatile LatticeXP field programmable gate array in a 144‑LQFP package designed for embedded system integration. It combines reconfigurable logic, on-chip embedded memory, flexible I/O and system-level features to support applications that require instant-on behavior, field reconfiguration and a compact surface-mount footprint.

With 6000 logic elements, approximately 72 Kbits of embedded RAM and 100 I/Os, this device targets control, interface and mid-density processing functions where integration, configurability and industrial operating range matter.

Key Features

• Core Architecture – Non-volatile, infinitely reconfigurable LatticeXP architecture with instant-on capability and no external configuration memory required.
• Logic Capacity – 6000 logic elements suitable for mid-density FPGA implementations and integration of custom logic and glue functions.
• Embedded Memory – Total on-chip RAM of 73,728 bits (approximately 72 Kbits) distributed between block and distributed memory resources.
• I/O Flexibility – 100 programmable I/Os with sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and related interfaces (as supported by the LatticeXP family).
• Clocking – Up to 2 analog PLLs for clock multiply, divide and phase shifting to simplify clock-tree design.
• Configuration & Security – Instant-on non-volatile configuration, reconfigurable SRAM logic in milliseconds, and design security with no external configuration bitstream to intercept.
• In-field Reconfiguration – TransFR™ capability for in-field logic updates while the system operates and ISP/JTAG programmability.
• Low-Power Modes – Sleep mode support for significant static current reduction during standby.
• Supply & Temperature – Wide supply voltage range of 1.71 V to 3.465 V and industrial operating temperature range from −40°C to 100°C.
• Package & Mounting – Surface-mount 144‑LQFP package (144‑TQFP, 20×20 mm supplier package) for compact board-level integration; RoHS compliant.
• System Support – Onboard oscillator for configuration, IEEE 1149.1 boundary-scan support and internal logic analysis capabilities as provided by the family.

Typical Applications

• Industrial Control – Implement motor-control interfaces, real-time glue logic and custom control functions that require industrial temperature operation and robust I/O.
• Communications & Interfaces – Bridge and protocol adaptors using flexible I/O standards and PLL-based clocking for synchronous interfaces.
• Embedded System Integration – Replace discrete glue logic and small microcontroller tasks with a single reconfigurable device featuring instant-on and non-volatile configuration.
• In-field Updatable Systems – Systems that benefit from TransFR™ reconfiguration to deploy firmware updates or feature changes without removing the device from service.

Unique Advantages

• Highly Integrated Solution: Combines 6000 logic elements, on-chip RAM and 100 I/Os in a single 144‑LQFP package to reduce BOM and PCB area.
• Instant-on, Secure Configuration: Non-volatile architecture eliminates the need for external configuration memory and protects the design from bitstream read-back.
• Field Reconfigurability: TransFR™ and JTAG support allow in-field updates and rapid development iterations without hardware replacement.
• Flexible I/O and Clocking: Programmable I/O standards plus up to 2 PLLs enable interfacing to a wide range of peripherals and optimized clock domains.
• Industrial Ready: Wide supply voltage range and −40°C to 100°C operating range make the part suitable for industrial applications.
• Power Management: Sleep mode capability provides substantial static current reduction for power-sensitive designs.

Why Choose LFXP6C-3T144I?

The LFXP6C-3T144I offers a balanced mid-density FPGA option for designs that require a compact, industrial-grade, non-volatile programmable device. Its combination of 6000 logic elements, approximately 72 Kbits of embedded RAM, 100 I/Os, and flexible voltage support provides designers with the building blocks to consolidate functions, reduce component count and enable in-field updates.

Engineers seeking a reconfigurable solution with instant-on behavior, programmable I/O standards and sleep-mode power savings will find this device well suited to control, interface and embedded applications where reliability and long-term configurability are priorities.

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