LFXP6C-3T144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 566 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-3T144I – XP FPGA, 100 I/O, 6K Logic Elements, 144‑LQFP
The LFXP6C-3T144I is an industrial-grade, non-volatile LatticeXP field programmable gate array in a 144‑LQFP package designed for embedded system integration. It combines reconfigurable logic, on-chip embedded memory, flexible I/O and system-level features to support applications that require instant-on behavior, field reconfiguration and a compact surface-mount footprint.
With 6000 logic elements, approximately 72 Kbits of embedded RAM and 100 I/Os, this device targets control, interface and mid-density processing functions where integration, configurability and industrial operating range matter.
Key Features
- Core Architecture – Non-volatile, infinitely reconfigurable LatticeXP architecture with instant-on capability and no external configuration memory required.
- Logic Capacity – 6000 logic elements suitable for mid-density FPGA implementations and integration of custom logic and glue functions.
- Embedded Memory – Total on-chip RAM of 73,728 bits (approximately 72 Kbits) distributed between block and distributed memory resources.
- I/O Flexibility – 100 programmable I/Os with sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and related interfaces (as supported by the LatticeXP family).
- Clocking – Up to 2 analog PLLs for clock multiply, divide and phase shifting to simplify clock-tree design.
- Configuration & Security – Instant-on non-volatile configuration, reconfigurable SRAM logic in milliseconds, and design security with no external configuration bitstream to intercept.
- In-field Reconfiguration – TransFR™ capability for in-field logic updates while the system operates and ISP/JTAG programmability.
- Low-Power Modes – Sleep mode support for significant static current reduction during standby.
- Supply & Temperature – Wide supply voltage range of 1.71 V to 3.465 V and industrial operating temperature range from −40°C to 100°C.
- Package & Mounting – Surface-mount 144‑LQFP package (144‑TQFP, 20×20 mm supplier package) for compact board-level integration; RoHS compliant.
- System Support – Onboard oscillator for configuration, IEEE 1149.1 boundary-scan support and internal logic analysis capabilities as provided by the family.
Typical Applications
- Industrial Control – Implement motor-control interfaces, real-time glue logic and custom control functions that require industrial temperature operation and robust I/O.
- Communications & Interfaces – Bridge and protocol adaptors using flexible I/O standards and PLL-based clocking for synchronous interfaces.
- Embedded System Integration – Replace discrete glue logic and small microcontroller tasks with a single reconfigurable device featuring instant-on and non-volatile configuration.
- In-field Updatable Systems – Systems that benefit from TransFR™ reconfiguration to deploy firmware updates or feature changes without removing the device from service.
Unique Advantages
- Highly Integrated Solution: Combines 6000 logic elements, on-chip RAM and 100 I/Os in a single 144‑LQFP package to reduce BOM and PCB area.
- Instant-on, Secure Configuration: Non-volatile architecture eliminates the need for external configuration memory and protects the design from bitstream read-back.
- Field Reconfigurability: TransFR™ and JTAG support allow in-field updates and rapid development iterations without hardware replacement.
- Flexible I/O and Clocking: Programmable I/O standards plus up to 2 PLLs enable interfacing to a wide range of peripherals and optimized clock domains.
- Industrial Ready: Wide supply voltage range and −40°C to 100°C operating range make the part suitable for industrial applications.
- Power Management: Sleep mode capability provides substantial static current reduction for power-sensitive designs.
Why Choose LFXP6C-3T144I?
The LFXP6C-3T144I offers a balanced mid-density FPGA option for designs that require a compact, industrial-grade, non-volatile programmable device. Its combination of 6000 logic elements, approximately 72 Kbits of embedded RAM, 100 I/Os, and flexible voltage support provides designers with the building blocks to consolidate functions, reduce component count and enable in-field updates.
Engineers seeking a reconfigurable solution with instant-on behavior, programmable I/O standards and sleep-mode power savings will find this device well suited to control, interface and embedded applications where reliability and long-term configurability are priorities.
Request a quote or submit a product inquiry to receive pricing, availability and ordering information for the LFXP6C-3T144I.

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