LFXP6C-4F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 1,542 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-4F256C – XP Field Programmable Gate Array, 6,000 logic elements, 73,728-bit RAM, 188 I/O, 256-FPBGA
The LFXP6C-4F256C is a member of the LatticeXP family of non-volatile FPGAs, providing a mid-density reconfigurable logic solution with instant-on capability and in-field reconfiguration. It combines approximately 6,000 logic elements, about 73,728 bits of on-chip RAM and a 188-pin I/O count in a compact 256-ball FPBGA (17 × 17 mm) package.
Designed for commercial-temperature embedded applications, this device targets use cases that require flexible I/O, moderate embedded memory, and fast start-up or field updates while operating from a wide supply range of 1.71 V to 3.465 V.
Key Features
- Core logic: Approximately 6,000 logic elements organized across 720 PFU/PFF logic blocks, delivering mid-range programmable capacity for control, glue-logic and peripheral offload tasks.
- Embedded memory: Approximately 73,728 bits of on-chip RAM (embedded block and distributed memory) to support FIFOs, small buffers and data-path storage without immediate external SRAM.
- I/O flexibility: 188 user I/Os in a 256-ball FPBGA package (17 × 17 mm) for dense signal routing and perimeter I/O requirements.
- Non-volatile, instant-on architecture: LatticeXP family non-volatile configuration enables fast power-up without external configuration memory and supports in-field reconfiguration.
- Clocking and timing: Device-level PLL support consistent with the LatticeXP family (LFXP6 devices include 2 PLLs) for clock multiply/divide and phase adjustments.
- Power and voltage: Operates across a supply range of 1.71 V to 3.465 V and supports sleep-mode operation to dramatically reduce static current.
- Package and mounting: Surface-mount 256-FPBGA (17 × 17 mm) package providing a compact footprint with high I/O density.
- Commercial operating range: Specified for 0 °C to 85 °C operation, suitable for commercial-grade embedded products.
- Tool and IP ecosystem: Supported by the Lattice ispLEVER design tools and available ispLeverCORE IP modules for rapid implementation (family-level support).
Typical Applications
- Embedded control systems: Offload peripheral logic, implement custom control state machines or integrate multiple serial interfaces in compact embedded products.
- Interface bridging and protocol adaptation: Translate or aggregate signals between subsystems using the device’s flexible I/O and on-chip memory for buffering.
- Communications and data buffering: Implement medium-speed data-paths, FIFOs and protocol logic leveraging embedded RAM and PLL-based clocking.
- Consumer and commercial electronics: Add reconfigurable logic for custom I/O handling, display controllers or user-interface functions in products within a commercial temperature range.
Unique Advantages
- Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and allows immediate device availability at power-up.
- Compact, high-density I/O package: 188 I/Os in a 256-FPBGA (17 × 17 mm) delivers substantial signal count in a small board area, reducing PCB complexity.
- Balanced logic and memory resources: Around 6,000 logic elements with approximately 73,728 bits of on-chip RAM supports mixed control and buffering needs without large external memory.
- Flexible voltage operation: Wide supply range (1.71 V to 3.465 V) enables designs that span multiple I/O voltage domains.
- Low-power sleep mode: Family-level sleep capability reduces static current for energy-sensitive commercial applications.
- Design ecosystem: Support from ispLEVER tools and pre-designed IP modules streamlines development and shortens time to prototype.
Why Choose LFXP6C-4F256C?
The LFXP6C-4F256C positions itself as a versatile, mid-density FPGA for commercial embedded systems that require non-volatile instant-on behavior, a compact high-I/O package, and a practical balance of logic and embedded memory. Its support for multiple supply voltages, two on-chip PLLs and family-level features such as in-field reconfiguration and low-power sleep make it suitable for designers who need reliable reprogrammable logic without external configuration components.
This device is well suited for teams building compact, reconfigurable hardware where board area, I/O count and start-up behavior matter. Combined with Lattice design tools and IP, it provides a predictable development path for commercial embedded applications.
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