LFXP6C-4F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,542 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4F256C – XP Field Programmable Gate Array, 6,000 logic elements, 73,728-bit RAM, 188 I/O, 256-FPBGA

The LFXP6C-4F256C is a member of the LatticeXP family of non-volatile FPGAs, providing a mid-density reconfigurable logic solution with instant-on capability and in-field reconfiguration. It combines approximately 6,000 logic elements, about 73,728 bits of on-chip RAM and a 188-pin I/O count in a compact 256-ball FPBGA (17 × 17 mm) package.

Designed for commercial-temperature embedded applications, this device targets use cases that require flexible I/O, moderate embedded memory, and fast start-up or field updates while operating from a wide supply range of 1.71 V to 3.465 V.

Key Features

  • Core logic: Approximately 6,000 logic elements organized across 720 PFU/PFF logic blocks, delivering mid-range programmable capacity for control, glue-logic and peripheral offload tasks.
  • Embedded memory: Approximately 73,728 bits of on-chip RAM (embedded block and distributed memory) to support FIFOs, small buffers and data-path storage without immediate external SRAM.
  • I/O flexibility: 188 user I/Os in a 256-ball FPBGA package (17 × 17 mm) for dense signal routing and perimeter I/O requirements.
  • Non-volatile, instant-on architecture: LatticeXP family non-volatile configuration enables fast power-up without external configuration memory and supports in-field reconfiguration.
  • Clocking and timing: Device-level PLL support consistent with the LatticeXP family (LFXP6 devices include 2 PLLs) for clock multiply/divide and phase adjustments.
  • Power and voltage: Operates across a supply range of 1.71 V to 3.465 V and supports sleep-mode operation to dramatically reduce static current.
  • Package and mounting: Surface-mount 256-FPBGA (17 × 17 mm) package providing a compact footprint with high I/O density.
  • Commercial operating range: Specified for 0 °C to 85 °C operation, suitable for commercial-grade embedded products.
  • Tool and IP ecosystem: Supported by the Lattice ispLEVER design tools and available ispLeverCORE IP modules for rapid implementation (family-level support).

Typical Applications

  • Embedded control systems: Offload peripheral logic, implement custom control state machines or integrate multiple serial interfaces in compact embedded products.
  • Interface bridging and protocol adaptation: Translate or aggregate signals between subsystems using the device’s flexible I/O and on-chip memory for buffering.
  • Communications and data buffering: Implement medium-speed data-paths, FIFOs and protocol logic leveraging embedded RAM and PLL-based clocking.
  • Consumer and commercial electronics: Add reconfigurable logic for custom I/O handling, display controllers or user-interface functions in products within a commercial temperature range.

Unique Advantages

  • Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and allows immediate device availability at power-up.
  • Compact, high-density I/O package: 188 I/Os in a 256-FPBGA (17 × 17 mm) delivers substantial signal count in a small board area, reducing PCB complexity.
  • Balanced logic and memory resources: Around 6,000 logic elements with approximately 73,728 bits of on-chip RAM supports mixed control and buffering needs without large external memory.
  • Flexible voltage operation: Wide supply range (1.71 V to 3.465 V) enables designs that span multiple I/O voltage domains.
  • Low-power sleep mode: Family-level sleep capability reduces static current for energy-sensitive commercial applications.
  • Design ecosystem: Support from ispLEVER tools and pre-designed IP modules streamlines development and shortens time to prototype.

Why Choose LFXP6C-4F256C?

The LFXP6C-4F256C positions itself as a versatile, mid-density FPGA for commercial embedded systems that require non-volatile instant-on behavior, a compact high-I/O package, and a practical balance of logic and embedded memory. Its support for multiple supply voltages, two on-chip PLLs and family-level features such as in-field reconfiguration and low-power sleep make it suitable for designers who need reliable reprogrammable logic without external configuration components.

This device is well suited for teams building compact, reconfigurable hardware where board area, I/O count and start-up behavior matter. Combined with Lattice design tools and IP, it provides a predictable development path for commercial embedded applications.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LFXP6C-4F256C.

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