LFXP6C-4FN256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 1,516 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-4FN256I – XP FPGA, 6000 logic elements, 188 I/Os, 256-BGA
The LFXP6C-4FN256I is a Lattice Semiconductor LatticeXP family FPGA offering non-volatile, infinitely reconfigurable logic with integrated memory and high-performance I/Os. It provides 6000 logic elements, approximately 72 Kbits of embedded RAM, and 188 user I/Os in a 256-ball fpBGA package optimized for industrial temperature ranges.
This device targets embedded and system applications that require instant-on configuration, flexible I/O standards, in-field reconfiguration, and a compact, surface-mount BGA footprint for space-constrained designs.
Key Features
- Core Logic 6000 logic elements for implementing control, glue-logic, and mid-density programmable logic functions.
- Embedded Memory Approximately 72 Kbits (73,728 bits) of on-chip RAM for distributed and block memory requirements.
- I/O Flexibility 188 I/Os with programmable sysIO buffer support for a wide range of interfaces including LVCMOS (1.2/1.5/1.8/2.5/3.3V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS as documented for the LatticeXP family.
- Non-Volatile, Instant-On Architecture ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure, reprogrammable configurations.
- Reconfiguration and Power Modes Supports fast in-field reconfiguration (TransFR) and a Sleep Mode that can reduce static current by up to 1000× as specified for the family.
- Clocking and Memory Interfaces Device-level support includes dedicated PLLs (LFXP6 devices include 2 PLLs) and dedicated DDR memory interface capability up to DDR333 as described for the family.
- Package and Mounting 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for compact board designs.
- Industrial Temperature Range Rated for operation from −40°C to 100°C and a supply voltage range of 1.71 V to 3.465 V.
- System-Level Tools and Features Family-level support includes IEEE 1149.1 boundary scan, ispTRACY internal logic analyzer capability, and an onboard oscillator to aid configuration and debug workflows.
Typical Applications
- Embedded control and glue logic — Implement system control, protocol bridging, and custom peripheral logic using the device’s 6000 logic elements and flexible I/O.
- Systems requiring instant-on configuration — Non-volatile architecture removes the need for external configuration memory and enables rapid power-up behavior.
- In-field upgradable systems — TransFR reconfiguration supports logic updates while the system operates, enabling field upgrades and feature additions.
- Memory-interfacing designs — Dedicated DDR interface support and on-chip RAM provide the building blocks for designs that require external memory interfaces or internal buffering.
Unique Advantages
- Non-volatile instant-on — Eliminates external configuration memory and enables immediate device availability at power-up.
- Flexible multi-standard I/O — Broad sysIO support reduces the need for external level translators and simplifies mixed-voltage board designs.
- Compact BGA package — 256-ball fpBGA (17×17 mm) conserves PCB space while delivering 188 I/Os for dense connectivity.
- Low-power modes — Family-level Sleep Mode provides significant static current reduction for energy-sensitive applications.
- Field-proven system features — Boundary scan, internal logic analysis, and onboard oscillator support accelerate development and production test.
- Design ecosystem — Family tooling and available ispLeverCORE IP blocks streamline implementation of common functions and speed time to market.
Why Choose LFXP6C-4FN256I?
The LFXP6C-4FN256I combines mid-range logic capacity with flexible I/O and non-volatile, instant-on operation to address a wide range of embedded and system-level designs. Its industrial operating range, compact 256-BGA package, and integrated memory make it suitable for applications that demand robustness, fast startup, and compact form factors.
Engineers benefit from device-level PLLs, dedicated DDR support, and family-level development tools and IP to accelerate development and deliver scalable, field-upgradable systems with reduced BOM complexity.
Request a quote or submit an RFQ to get pricing and availability for the LFXP6C-4FN256I. Our team can provide technical details and support to evaluate this device for your next design.