LFXP6C-4FN256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,516 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4FN256I – XP FPGA, 6000 logic elements, 188 I/Os, 256-BGA

The LFXP6C-4FN256I is a Lattice Semiconductor LatticeXP family FPGA offering non-volatile, infinitely reconfigurable logic with integrated memory and high-performance I/Os. It provides 6000 logic elements, approximately 72 Kbits of embedded RAM, and 188 user I/Os in a 256-ball fpBGA package optimized for industrial temperature ranges.

This device targets embedded and system applications that require instant-on configuration, flexible I/O standards, in-field reconfiguration, and a compact, surface-mount BGA footprint for space-constrained designs.

Key Features

  • Core Logic 6000 logic elements for implementing control, glue-logic, and mid-density programmable logic functions.
  • Embedded Memory Approximately 72 Kbits (73,728 bits) of on-chip RAM for distributed and block memory requirements.
  • I/O Flexibility 188 I/Os with programmable sysIO buffer support for a wide range of interfaces including LVCMOS (1.2/1.5/1.8/2.5/3.3V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS as documented for the LatticeXP family.
  • Non-Volatile, Instant-On Architecture ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure, reprogrammable configurations.
  • Reconfiguration and Power Modes Supports fast in-field reconfiguration (TransFR) and a Sleep Mode that can reduce static current by up to 1000× as specified for the family.
  • Clocking and Memory Interfaces Device-level support includes dedicated PLLs (LFXP6 devices include 2 PLLs) and dedicated DDR memory interface capability up to DDR333 as described for the family.
  • Package and Mounting 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for compact board designs.
  • Industrial Temperature Range Rated for operation from −40°C to 100°C and a supply voltage range of 1.71 V to 3.465 V.
  • System-Level Tools and Features Family-level support includes IEEE 1149.1 boundary scan, ispTRACY internal logic analyzer capability, and an onboard oscillator to aid configuration and debug workflows.

Typical Applications

  • Embedded control and glue logic — Implement system control, protocol bridging, and custom peripheral logic using the device’s 6000 logic elements and flexible I/O.
  • Systems requiring instant-on configuration — Non-volatile architecture removes the need for external configuration memory and enables rapid power-up behavior.
  • In-field upgradable systems — TransFR reconfiguration supports logic updates while the system operates, enabling field upgrades and feature additions.
  • Memory-interfacing designs — Dedicated DDR interface support and on-chip RAM provide the building blocks for designs that require external memory interfaces or internal buffering.

Unique Advantages

  • Non-volatile instant-on — Eliminates external configuration memory and enables immediate device availability at power-up.
  • Flexible multi-standard I/O — Broad sysIO support reduces the need for external level translators and simplifies mixed-voltage board designs.
  • Compact BGA package — 256-ball fpBGA (17×17 mm) conserves PCB space while delivering 188 I/Os for dense connectivity.
  • Low-power modes — Family-level Sleep Mode provides significant static current reduction for energy-sensitive applications.
  • Field-proven system features — Boundary scan, internal logic analysis, and onboard oscillator support accelerate development and production test.
  • Design ecosystem — Family tooling and available ispLeverCORE IP blocks streamline implementation of common functions and speed time to market.

Why Choose LFXP6C-4FN256I?

The LFXP6C-4FN256I combines mid-range logic capacity with flexible I/O and non-volatile, instant-on operation to address a wide range of embedded and system-level designs. Its industrial operating range, compact 256-BGA package, and integrated memory make it suitable for applications that demand robustness, fast startup, and compact form factors.

Engineers benefit from device-level PLLs, dedicated DDR support, and family-level development tools and IP to accelerate development and deliver scalable, field-upgradable systems with reduced BOM complexity.

Request a quote or submit an RFQ to get pricing and availability for the LFXP6C-4FN256I. Our team can provide technical details and support to evaluate this device for your next design.

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