LFXP6C-4Q208I

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 1,153 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O142Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4Q208I – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6C-4Q208I is a non-volatile LatticeXP-series FPGA optimized for industrial applications that require instant-on reconfigurable logic and flexible I/O. Based on the LatticeXP family architecture, this device integrates approximately 6000 logic elements, on-chip embedded memory, and programmable I/O to support system-level functions such as interface bridging, memory control and embedded logic acceleration.

Designed for surface-mount deployment in a 208-pin PQFP (28 × 28 mm) package, the device delivers system-level convenience through on-chip configuration, low-power sleep mode, and reconfiguration capabilities suitable for industrial operating ranges.

Key Features

  • Non‑volatile, instant‑on architecture – Powers up in microseconds with no external configuration memory required, simplifying system boot and secure configuration management.
  • Logic capacity – Approximately 6000 logic elements and 720 logic blocks, enabling mid-range FPGA designs and logic consolidation.
  • Embedded memory – Approximately 73,728 bits (≈72 Kbits) of on‑chip RAM for distributed and block memory usage in embedded designs.
  • Flexible I/O – 142 user I/Os with family-level support for a wide range of interfaces (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and others) to simplify integration with diverse peripherals.
  • Dedicated DDR support – Family-level support for DDR memory interfaces (up to DDR333) for designs that require external memory bandwidth.
  • Clocking and PLLs – On-chip clock management with multiple PLLs; LFXP6 devices provide 2 PLLs for clock multiply/divide and phase shifting.
  • Low‑power modes – Sleep mode capability allows significant static current reduction (up to 1000× according to family specification) for energy-sensitive applications.
  • Voltage and temperature – Operates across a broad supply range (1.71 V to 3.465 V) and industrial temperature range (−40 °C to 100 °C).
  • Package and mounting – 208-BFQFP (supplier package listed as 208‑PQFP, 28 × 28 mm), surface mount; RoHS compliant.
  • System-level support – Family-level features include IEEE 1149.1 boundary-scan, internal logic analysis capability, and on-chip configuration support via JTAG and system ports.

Typical Applications

  • Industrial control – Implement motor control logic, deterministic interface handling and real-time processing within industrial systems that require an extended operating temperature range.
  • Embedded system glue logic – Consolidate discrete logic, protocol bridging and custom interface functions into a single FPGA to reduce BOM and board complexity.
  • Memory interface and buffering – Use the device’s embedded RAM and DDR interface support for external memory buffering, data staging and interface timing management.
  • High‑I/O protocol bridging – Leverage 142 I/Os and flexible sysIO buffer support to connect and translate between diverse voltage and signalling standards.

Unique Advantages

  • Instant system availability: Non‑volatile FPGA architecture eliminates external configuration memory and enables microsecond power-up for fast system start.
  • In-field reconfiguration: TransFR reconfiguration and JTAG-based programming permit updates to logic while deployed, supporting iterative development and field upgrades.
  • Power management flexibility: Sleep mode provides dramatic static current reduction for lower standby power in energy-sensitive deployments.
  • Broad I/O versatility: Wide voltage range and family-level support for many interface standards simplify integration across modern mixed-voltage systems.
  • Industrial-ready temperature range: Rated for −40 °C to 100 °C operation, suitable for many industrial deployment scenarios.
  • Compact surface-mount package: 208-pin PQFP (28 × 28 mm) enables reasonably high I/O count in a board-friendly form factor.

Why Choose LFXP6C-4Q208I?

The LFXP6C-4Q208I combines a non‑volatile, instant‑on FPGA architecture with mid-range logic capacity, embedded memory and extensive I/O flexibility—making it a strong choice for industrial system designs that need reconfigurable logic, fast boot, and robust I/O interfacing. Its surface-mount 208‑pin package and wide supply/temperature ranges support practical deployment across a variety of embedded and industrial use cases.

Supported by the LatticeXP family design ecosystem— including on-chip configuration, boundary-scan, and available ISP/CORE design IP—this device offers a straightforward upgrade path and development flow for teams consolidating logic, implementing custom interfaces, or adding in-field reconfiguration capabilities.

Request a quote or submit a sourcing inquiry to receive pricing and availability information for the LFXP6C-4Q208I.

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