LFXP6C-4Q208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,153 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-4Q208I – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6C-4Q208I is a non-volatile LatticeXP-series FPGA optimized for industrial applications that require instant-on reconfigurable logic and flexible I/O. Based on the LatticeXP family architecture, this device integrates approximately 6000 logic elements, on-chip embedded memory, and programmable I/O to support system-level functions such as interface bridging, memory control and embedded logic acceleration.
Designed for surface-mount deployment in a 208-pin PQFP (28 × 28 mm) package, the device delivers system-level convenience through on-chip configuration, low-power sleep mode, and reconfiguration capabilities suitable for industrial operating ranges.
Key Features
- Non‑volatile, instant‑on architecture – Powers up in microseconds with no external configuration memory required, simplifying system boot and secure configuration management.
- Logic capacity – Approximately 6000 logic elements and 720 logic blocks, enabling mid-range FPGA designs and logic consolidation.
- Embedded memory – Approximately 73,728 bits (≈72 Kbits) of on‑chip RAM for distributed and block memory usage in embedded designs.
- Flexible I/O – 142 user I/Os with family-level support for a wide range of interfaces (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and others) to simplify integration with diverse peripherals.
- Dedicated DDR support – Family-level support for DDR memory interfaces (up to DDR333) for designs that require external memory bandwidth.
- Clocking and PLLs – On-chip clock management with multiple PLLs; LFXP6 devices provide 2 PLLs for clock multiply/divide and phase shifting.
- Low‑power modes – Sleep mode capability allows significant static current reduction (up to 1000× according to family specification) for energy-sensitive applications.
- Voltage and temperature – Operates across a broad supply range (1.71 V to 3.465 V) and industrial temperature range (−40 °C to 100 °C).
- Package and mounting – 208-BFQFP (supplier package listed as 208‑PQFP, 28 × 28 mm), surface mount; RoHS compliant.
- System-level support – Family-level features include IEEE 1149.1 boundary-scan, internal logic analysis capability, and on-chip configuration support via JTAG and system ports.
Typical Applications
- Industrial control – Implement motor control logic, deterministic interface handling and real-time processing within industrial systems that require an extended operating temperature range.
- Embedded system glue logic – Consolidate discrete logic, protocol bridging and custom interface functions into a single FPGA to reduce BOM and board complexity.
- Memory interface and buffering – Use the device’s embedded RAM and DDR interface support for external memory buffering, data staging and interface timing management.
- High‑I/O protocol bridging – Leverage 142 I/Os and flexible sysIO buffer support to connect and translate between diverse voltage and signalling standards.
Unique Advantages
- Instant system availability: Non‑volatile FPGA architecture eliminates external configuration memory and enables microsecond power-up for fast system start.
- In-field reconfiguration: TransFR reconfiguration and JTAG-based programming permit updates to logic while deployed, supporting iterative development and field upgrades.
- Power management flexibility: Sleep mode provides dramatic static current reduction for lower standby power in energy-sensitive deployments.
- Broad I/O versatility: Wide voltage range and family-level support for many interface standards simplify integration across modern mixed-voltage systems.
- Industrial-ready temperature range: Rated for −40 °C to 100 °C operation, suitable for many industrial deployment scenarios.
- Compact surface-mount package: 208-pin PQFP (28 × 28 mm) enables reasonably high I/O count in a board-friendly form factor.
Why Choose LFXP6C-4Q208I?
The LFXP6C-4Q208I combines a non‑volatile, instant‑on FPGA architecture with mid-range logic capacity, embedded memory and extensive I/O flexibility—making it a strong choice for industrial system designs that need reconfigurable logic, fast boot, and robust I/O interfacing. Its surface-mount 208‑pin package and wide supply/temperature ranges support practical deployment across a variety of embedded and industrial use cases.
Supported by the LatticeXP family design ecosystem— including on-chip configuration, boundary-scan, and available ISP/CORE design IP—this device offers a straightforward upgrade path and development flow for teams consolidating logic, implementing custom interfaces, or adding in-field reconfiguration capabilities.
Request a quote or submit a sourcing inquiry to receive pricing and availability information for the LFXP6C-4Q208I.

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