LFXP6C-4T144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 770 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4T144C – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

The LFXP6C-4T144C is a member of the LatticeXP FPGA family — a non-volatile, infinitely reconfigurable FPGA optimized for commercial embedded and I/O-dense designs. This device integrates approximately 6,000 logic elements, approximately 72 Kbits of on-chip RAM (73,728 total bits), and 100 user I/Os in a 144-pin LQFP package.

Designed for compact, surface-mount applications, the LFXP6C-4T144C supports a wide supply range (1.71 V to 3.465 V), operates across a commercial temperature range (0 °C to 85 °C), and is RoHS compliant. The LatticeXP family features instant-on, non-volatile configuration and system-level capabilities such as PLLs, flexible I/O standards and in-field reconfiguration.

Key Features

  • Core Logic: Approximately 6,000 logic elements and 720 logic blocks provide mid-range logic density for embedded control, glue-logic and interface tasks.
  • Embedded Memory: Approximately 72 Kbits of on-chip RAM (73,728 bits total) for data buffering, FIFOs and small on-chip storage.
  • I/O Capacity and Flexibility: 100 I/Os with programmable sysIO™ buffer support for a wide range of interfaces, including multiple LVCMOS voltages, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS as documented for the LatticeXP family.
  • Clocking: Family-level sysCLOCK™ PLL support (LFXP6 devices provide 2 analog PLLs) for clock multiplication, division and phase shifting.
  • Non-volatile, Instant-on Configuration: ispXP™ non-volatile technology enables instant-on operation with no external configuration memory required and secure configuration storage.
  • In-field Reconfiguration and Low Power: TransFR™ Reconfiguration enables in-field logic updates; sleep mode can reduce static current significantly as described in the LatticeXP data sheet.
  • Package and Mounting: 144-pin LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm) suitable for surface-mount assembly.
  • Commercial Grade and Environmental Compliance: Commercial-grade device with operating range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Embedded and Control Systems: Use the LFXP6C-4T144C for compact control logic, user interface management and sensor aggregation where instant-on behavior and reconfigurability accelerate development.
  • Interface Bridging and Protocol Conversion: Programmable I/O buffers and a wide set of supported I/O standards enable protocol translation and interface consolidation between heterogeneous peripherals.
  • Memory Interface and Data Buffering: On-chip RAM combined with PLLs and dedicated DDR support in the family make the device suitable for buffering and interfacing with external memory subsystems.
  • Field Upgradeable Systems: TransFR™ in-field reconfiguration lets you update logic while the system operates, supporting feature updates and bug fixes without full hardware replacement.
  • Prototyping and IP-based Designs: ispLEVER design tool support and available ispLeverCORE™ IP blocks in the LatticeXP family speed implementation of common functions and shorten development cycles.

Unique Advantages

  • Non-volatile Instant-on Operation: Eliminates the need for external configuration memory and reduces boot-time complexity in product designs.
  • Flexible, High-density I/O: Wide-ranging programmable I/O standards allow a single device to serve multiple interface roles, reducing BOM count.
  • In-field Reconfigurability: TransFR™ enables updates and feature expansion in deployed systems without full system downtime.
  • Balanced Integration: Mid-range logic density with embedded RAM and PLLs provides a compact solution for common embedded and interface tasks.
  • Commercial-ready Packaging: 144-pin surface-mount package and RoHS compliance suit production prototypes and volume commercial products.
  • Design Ecosystem Support: Family-level support for synthesis, placement and routing tools and pre-designed IP blocks helps accelerate time to market.

Why Choose LFXP6C-4T144C?

The LFXP6C-4T144C delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact 144-pin package, tailored for commercial embedded systems and interface-intensive applications. Its non-volatile, instant-on architecture and in-field reconfiguration capabilities reduce system complexity and enable post-deployment updates.

Engineers developing mid-density FPGA designs will find the LFXP6C-4T144C suitable for consolidating functions, simplifying BOMs and leveraging available LatticeXP design tools and IP to shorten development cycles and support scalability across related device densities.

Request a quote or submit an RFQ to receive pricing and availability information for the LFXP6C-4T144C.

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