LFXP6C-5F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 976 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-5F256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

The LFXP6C-5F256C is a non-volatile FPGA in a compact 256-ball fpBGA (17 × 17 mm) package, offering 6,000 logic elements and approximately 72 Kbits of on-chip RAM (73,728 bits). Built on the LatticeXP family architecture, this device targets designs that require instant-on non-volatile logic, flexible I/O support and on-device reconfiguration for in-field updates. Typical use cases include memory interface logic, protocol bridging, embedded control and applications that benefit from reconfigurable hardware with a commercial temperature range.

Key Features

  • Logic Capacity — 6,000 logic elements suitable for moderate-complexity FPGA functions and system glue logic.
  • Embedded Memory — 73,728 bits of on-chip RAM (approximately 72 Kbits) for distributed and block memory needs within the design.
  • I/O Density & Package — 188 I/Os in a 256-ball fpBGA (17 × 17 mm) surface-mount package provides high pin-count connectivity in a compact footprint.
  • Non-volatile, Reconfigurable Architecture — Family-level capabilities include non-volatile, instant-on operation and in-field reconfiguration for rapid deployment and secure designs.
  • Power & Voltage — Supports a supply range of 1.71 V to 3.465 V and includes low-power features such as a sleep mode for significant static current reduction.
  • Clocking — Family datasheet documents analog PLLs and sysCLOCK features; the LFXP6 family includes multiple PLL resources to support clock multiplication, division and phase shifting.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
  • Surface Mount Package — 256-FPBGA supplier package (17 × 17 mm) for PCB designs where board space and reliable BGA connectivity are required.

Typical Applications

  • Memory Interface Logic — Implement DDR interface controllers and related timing logic using on-chip memory and PLL resources.
  • Protocol Bridging & I/O Translation — 188 I/Os and flexible I/O buffer support enable bridging between subsystems and multiple signaling standards.
  • In-Field Reconfigurable Systems — Non-volatile logic and in-system reconfiguration capabilities support field updates and iterative feature deployment.
  • Embedded Control & Glue Logic — Compact logic capacity and embedded RAM make the device well suited for control tasks, peripheral aggregation and custom datapath functions.

Unique Advantages

  • Non-volatile Instant-On: Powers up immediately without external configuration memory, simplifying system boot and increasing security by avoiding external bitstreams.
  • Reconfigurability in the Field: Supports in-field logic updates to adapt functionality or fix issues without hardware replacement.
  • High I/O Count in a Small Package: 188 I/Os in a 17 × 17 mm fpBGA reduce board area while providing broad connectivity options.
  • Balanced On-chip Resources: 6,000 logic elements together with ~72 Kbits of embedded RAM support a wide range of mid-density designs without external memory for some use cases.
  • Power Flexibility: Wide supply range (1.71 V to 3.465 V) and sleep mode capability help accommodate varied system power architectures and low-power states.
  • RoHS Compliant: Environmentally compliant for commercial production and assembly processes.

Why Choose LFXP6C-5F256C?

The LFXP6C-5F256C delivers a practical balance of logic capacity, embedded memory and I/O density in a compact fpBGA package, making it a fit for commercial embedded systems that require non-volatile, reconfigurable logic and robust interface support. Its sleep mode and broad supply range give designers flexibility for power-managed systems while the LatticeXP family features (instant-on, in-field reconfiguration and PLL-based clocking) support designs that require secure, updatable hardware.

This device is suitable for engineering teams building mid-density FPGA designs—such as memory controllers, protocol bridges and embedded control logic—who need a compact package, solid I/O count and on-chip memory while operating within a commercial temperature range.

Request a quote or submit a quotation to inquire about pricing and availability for the LFXP6C-5F256C.

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