LFXP6C-5F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 976 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-5F256C – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA
The LFXP6C-5F256C is a non-volatile FPGA in a compact 256-ball fpBGA (17 × 17 mm) package, offering 6,000 logic elements and approximately 72 Kbits of on-chip RAM (73,728 bits). Built on the LatticeXP family architecture, this device targets designs that require instant-on non-volatile logic, flexible I/O support and on-device reconfiguration for in-field updates. Typical use cases include memory interface logic, protocol bridging, embedded control and applications that benefit from reconfigurable hardware with a commercial temperature range.
Key Features
- Logic Capacity — 6,000 logic elements suitable for moderate-complexity FPGA functions and system glue logic.
- Embedded Memory — 73,728 bits of on-chip RAM (approximately 72 Kbits) for distributed and block memory needs within the design.
- I/O Density & Package — 188 I/Os in a 256-ball fpBGA (17 × 17 mm) surface-mount package provides high pin-count connectivity in a compact footprint.
- Non-volatile, Reconfigurable Architecture — Family-level capabilities include non-volatile, instant-on operation and in-field reconfiguration for rapid deployment and secure designs.
- Power & Voltage — Supports a supply range of 1.71 V to 3.465 V and includes low-power features such as a sleep mode for significant static current reduction.
- Clocking — Family datasheet documents analog PLLs and sysCLOCK features; the LFXP6 family includes multiple PLL resources to support clock multiplication, division and phase shifting.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
- Surface Mount Package — 256-FPBGA supplier package (17 × 17 mm) for PCB designs where board space and reliable BGA connectivity are required.
Typical Applications
- Memory Interface Logic — Implement DDR interface controllers and related timing logic using on-chip memory and PLL resources.
- Protocol Bridging & I/O Translation — 188 I/Os and flexible I/O buffer support enable bridging between subsystems and multiple signaling standards.
- In-Field Reconfigurable Systems — Non-volatile logic and in-system reconfiguration capabilities support field updates and iterative feature deployment.
- Embedded Control & Glue Logic — Compact logic capacity and embedded RAM make the device well suited for control tasks, peripheral aggregation and custom datapath functions.
Unique Advantages
- Non-volatile Instant-On: Powers up immediately without external configuration memory, simplifying system boot and increasing security by avoiding external bitstreams.
- Reconfigurability in the Field: Supports in-field logic updates to adapt functionality or fix issues without hardware replacement.
- High I/O Count in a Small Package: 188 I/Os in a 17 × 17 mm fpBGA reduce board area while providing broad connectivity options.
- Balanced On-chip Resources: 6,000 logic elements together with ~72 Kbits of embedded RAM support a wide range of mid-density designs without external memory for some use cases.
- Power Flexibility: Wide supply range (1.71 V to 3.465 V) and sleep mode capability help accommodate varied system power architectures and low-power states.
- RoHS Compliant: Environmentally compliant for commercial production and assembly processes.
Why Choose LFXP6C-5F256C?
The LFXP6C-5F256C delivers a practical balance of logic capacity, embedded memory and I/O density in a compact fpBGA package, making it a fit for commercial embedded systems that require non-volatile, reconfigurable logic and robust interface support. Its sleep mode and broad supply range give designers flexibility for power-managed systems while the LatticeXP family features (instant-on, in-field reconfiguration and PLL-based clocking) support designs that require secure, updatable hardware.
This device is suitable for engineering teams building mid-density FPGA designs—such as memory controllers, protocol bridges and embedded control logic—who need a compact package, solid I/O count and on-chip memory while operating within a commercial temperature range.
Request a quote or submit a quotation to inquire about pricing and availability for the LFXP6C-5F256C.

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