LFXP6C-5Q208C

The LFXP6C-5Q208C is a LatticeXP-family FPGA in a 208-pin PQFP package that integrates reprogrammable logic, on-chip RAM and flexible I/O for commercial embedded applications. This device provides 6,000 logic elements, 142 I/O pins and 73,728 bits of on-chip RAM, making it suitable for mid-density logic, control and interface tasks where compact packaging and instant-on non-volatile behavior are valued.

As a member of the LatticeXP family, the device inherits family-level capabilities such as non-volatile instant-on operation, in-field reconfiguration and programmable I/O standards, combined with a surface-mount 208-BFQFP package and commercial temperature rating for straightforward board-level integration.

Key Features

• Logic Capacity — 6,000 logic elements (cells) to implement mid-density combinational and sequential logic functions.
• On-chip RAM — Total on-chip RAM: 73,728 bits (approximately 72 Kbits) for embedded data buffering, FIFOs and small memory structures.
• I/O Density — 142 user I/O pins in the 208-BFQFP package to support multiple parallel interfaces and external peripherals.
• Non-volatile, Instant-on Architecture — LatticeXP family features non-volatile configuration with instant-on startup and no external configuration memory required.
• Reconfiguration and In-system Update — Family-level support for in-field reconfiguration and rapid SRAM-based logic updates.
• Programmable I/O Buffer Support — Flexible sysIO buffer architecture (family-level) supports a wide range of interface standards for mixed-voltage systems.
• Clocking — PLL resources appropriate to the LFXP6 device class (2 PLLs) for clock multiplication, division and phase adjustments.
• Power and Supply Range — Device supply range: 1.71 V to 3.465 V to accommodate mixed-voltage designs without external level shifters for some interfaces.
• Package and Mounting — 208-BFQFP / 208-PQFP (28 × 28 mm) surface-mount package for standard PCB assembly.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature range; RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement real-time control logic, sensor interfaces and protocol bridging using the device’s mid-range logic and I/O resources.
• Communications & Interface Bridging — Use the 142 I/Os and programmable I/O standards to translate between parallel and serial interfaces or to implement custom protocol engines.
• Embedded System Glue Logic — Replace discrete logic and CPLDs with a single FPGA for compact board designs and reduced part count.
• User Interfaces and Peripherals — Manage displays, buttons, and peripheral control with available logic and on-chip RAM for buffering and state machines.

Unique Advantages

• Instant-on, Non-volatile Operation: Eliminates the need for external configuration memories and enables immediate startup behavior.
• Mid-density Integration: 6,000 logic elements and 73,728 bits of on-chip RAM provide a balanced resource set for many embedded tasks without over‑provisioning.
• Flexible I/O Count in a Compact Package: 142 I/Os in a 208-pin PQFP package allow high signal density while preserving board space and standard assembly.
• In-field Reconfiguration: Support for system reprogramming lets you update logic while deployed, reducing the need for hardware revisions.
• Broad Supply Range: Operates across 1.71 V to 3.465 V to facilitate integration into systems with differing core and I/O voltage domains.
• Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and meets RoHS environmental standards.

Why Choose LFXP6C-5Q208C?

The LFXP6C-5Q208C positions itself as a practical, mid-density FPGA option for designers who need a non-volatile, instant-on solution with a balanced mix of logic, embedded memory and I/O capacity. Its 208-pin surface-mount package and commercial temperature rating make it a straightforward choice for embedded control, interface bridging and user-interface applications where board space and predictable startup behavior are important.

Built on the LatticeXP family architecture, the device delivers reconfiguration flexibility, programmable I/O standards and clocking resources (PLLs) that help minimize external components and simplify system design and maintenance.

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