LFXP6C-4TN144I

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 774 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4TN144I – XP FPGA, 6,000 Logic Elements, ~72 Kbits RAM, 100 I/Os, 144-LQFP

The LFXP6C-4TN144I is a non-volatile LatticeXP family field programmable gate array (FPGA) offered by Lattice Semiconductor Corporation. It combines approximately 6,000 logic elements with on-chip embedded memory and a flexible I/O fabric to address industrial and embedded applications that require configurable logic, on-board memory, and a wide I/O voltage range.

Key hardware attributes include 73,728 bits of on-chip RAM (approximately 72 Kbits), 100 user I/Os in a 144-pin LQFP package, a broad supply voltage window (1.71 V to 3.465 V) and industrial operating temperature (-40 °C to 100 °C), making it suitable for robust system designs that need instant-on reconfigurability and in-field updates.

Key Features

  • Non-volatile, instant-on architecture No external configuration memory is required; the device powers up in microseconds and supports secure configuration without an external bitstream.
  • Reconfiguration and in-field updates Infinitely reconfigurable logic with TransFR™ reconfiguration for in-field logic updates and the ability to reprogram SRAM and non-volatile sections via system configuration and JTAG.
  • Logic density Approximately 6,000 logic elements suitable for mid-density FPGA implementations.
  • Embedded and distributed memory 73,728 total RAM bits (approximately 72 Kbits of embedded SRAM) plus family-level distributed RAM resources.
  • Flexible I/O buffer and standards support Programmable sysIO™ buffer supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS—enabling diverse peripheral and memory interfaces.
  • Dedicated DDR memory support Implements interfaces up to DDR333 (166 MHz) for external memory connectivity.
  • Clocking and PLLs sysCLOCK PLL resources for clock multiply/divide and phase shifting—LFXP6 devices provide two analog PLLs.
  • Low-power modes Sleep mode support provides substantial static current reduction (up to 1000× reduction as specified for the family).
  • Package and operating conditions 144-pin LQFP package (supplier device package noted as 144-TQFP, 20 × 20 mm), operating voltage 1.71–3.465 V, and industrial temperature range of −40 °C to 100 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial control and automation — Configurable logic, industrial temperature rating and flexible I/O allow implementation of motor control, PLC interfaces and custom control logic.
  • Embedded systems and appliances — Instant-on, non-volatile configuration and on-chip memory enable compact embedded controllers and user-interface controllers without external configuration storage.
  • Memory interface bridging — Dedicated DDR support (up to DDR333) and programmable I/O make the part suitable for memory interface logic and buffering tasks.
  • Communications and I/O aggregation — Wide I/O standard support (including LVDS and high-speed signaling options) for protocol bridging, data capture and preprocessing functions.

Unique Advantages

  • Instant-on, secure configuration: Non-volatile architecture removes the need for external configuration memory and protects design bitstreams.
  • In-field reconfiguration: TransFR and JTAG/system configuration ports enable runtime updates and rapid iterative development.
  • Strong I/O flexibility: Broad programmable I/O support reduces the need for additional level-shifting or interface components.
  • Compact package with ample I/O: 100 I/Os in a 144-pin LQFP package balances I/O count with a small footprint for space-constrained PCBs.
  • Industrial robustness: Wide operating temperature range (−40 °C to 100 °C) and RoHS compliance suit industrial deployments.
  • Vendor design ecosystem: Supported by the LatticeISP design flow and pre-designed IP (ispLeverCORE™) to accelerate development.

Why Choose LFXP6C-4TN144I?

The LFXP6C-4TN144I positions itself as a mid-density, non-volatile FPGA option for industrial and embedded designs that require reliable instant-on behavior, flexible I/O interfacing and the ability to update logic in the field. With approximately 6,000 logic elements, roughly 72 Kbits of embedded RAM, and support for DDR memory interfaces, it addresses designs that need on-chip memory and a mix of control and high-speed I/O functions.

Its industrial temperature rating, broad supply-voltage window, and compact 144-LQFP package make it a practical choice for engineers balancing performance, integration and robustness. Integrated low-power modes and the Lattice design ecosystem add development efficiency and deployment flexibility.

Request a quote or submit an inquiry to receive pricing and availability information for the LFXP6C-4TN144I. Please include your required quantity and any procurement or lead-time constraints to expedite your request.

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