LFXP6C-4QN208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 389 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6C-4QN208I – XP Field Programmable Gate Array (FPGA), 6,000 logic elements, ~73 Kbits RAM, 142 I/O, 208-BFQFP
The LFXP6C-4QN208I is a non-volatile LatticeXP family FPGA in a 208‑pin BFQFP/PQFP package designed for industrial applications. It combines on-chip programmable logic, embedded RAM and a flexible I/O subsystem to deliver reconfigurable hardware capability with instant-on behavior and in-field reconfiguration.
Targeted at embedded and industrial designs requiring reprogrammable logic, reliable operation across a wide voltage range, and robust temperature performance, this device emphasizes integration, configurability and system-level flexibility.
Key Features
- Core architecture — Non-volatile, infinitely reconfigurable LatticeXP family technology with instant-on operation and no external configuration memory required.
- Logic capacity — Approximately 6,000 logic elements and 720 logic blocks for mid-range programmable logic implementations.
- Embedded memory — 73,728 bits (~73 Kbits) of on-chip RAM with support for distributed and block memory configurations as provided by the LatticeXP family.
- I/O count and flexibility — 142 user I/Os with programmable sysIO buffers; family-level support for LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interface standards.
- Memory interface support — Family features include dedicated DDR memory interface capability (up to DDR333), enabling direct high‑speed memory connections where required.
- Clocking and system timing — Up to four analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
- Reconfiguration and power modes — In-field TransFR™ reconfiguration for logic updates while running and a sleep mode that can reduce static current significantly.
- Power and supply — Operates across a wide supply range: 1.71 V to 3.465 V.
- Package & mounting — 208‑BFQFP (supplier: 208‑PQFP, 28 × 28 mm), surface-mount package.
- Industrial temperature rating — Specified for operation from -40 °C to 100 °C.
- RoHS compliant — Meets RoHS environmental requirements.
Typical Applications
- Industrial control and automation — Reconfigurable logic and robust I/O make the device suitable for sensor aggregation, protocol bridging and custom control algorithms across the -40 °C to 100 °C industrial range.
- Embedded systems — Instant-on non‑volatile configuration and on-chip memory simplify boot/initialization and reduce BOM by eliminating external configuration memory.
- High‑speed memory interfaces — Dedicated DDR interface support and PLL resources enable memory controller and interface implementations requiring precise clocking.
- Field‑upgradable designs — TransFR reconfiguration enables in-field logic updates without removing the device, useful for long‑lifecycle or remotely serviced equipment.
Unique Advantages
- Non‑volatile instant-on operation: Powers up configured and ready in microseconds without external configuration memory, reducing system complexity.
- Mid-range logic density with compact package: ~6,000 logic elements and 142 I/Os in a 208‑pin BFQFP provide a balance of capability and PCB footprint for compact systems.
- Flexible I/O standards: Programmable sysIO buffers support a wide variety of signaling standards, enabling diverse peripheral and interface connectivity.
- Field reconfiguration capability: TransFR reconfiguration allows updates to logic while the system is running, facilitating feature upgrades and bug fixes in deployed systems.
- Industrial robustness: Rated for -40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
- Integrated clocking resources: Up to four analog PLLs per device support complex clocking and timing architectures without external components.
Why Choose LFXP6C-4QN208I?
The LFXP6C-4QN208I delivers a balanced combination of reconfigurable logic, embedded memory and flexible I/O in a non‑volatile FPGA that fits mid‑range embedded and industrial applications. Its instant-on behavior, in-field reconfiguration capability and industrial temperature rating make it suitable for designs that require reliability, upgradability and compact integration.
Choose this device when you need a robust, reprogrammable hardware element that reduces external component count, supports diverse I/O standards and provides the system-level flexibility of the LatticeXP family.
Request a quote or submit an inquiry to receive pricing, availability and additional technical information for the LFXP6C-4QN208I.

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