LFXP6C-4QN208I

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 389 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O142Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6C-4QN208I – XP Field Programmable Gate Array (FPGA), 6,000 logic elements, ~73 Kbits RAM, 142 I/O, 208-BFQFP

The LFXP6C-4QN208I is a non-volatile LatticeXP family FPGA in a 208‑pin BFQFP/PQFP package designed for industrial applications. It combines on-chip programmable logic, embedded RAM and a flexible I/O subsystem to deliver reconfigurable hardware capability with instant-on behavior and in-field reconfiguration.

Targeted at embedded and industrial designs requiring reprogrammable logic, reliable operation across a wide voltage range, and robust temperature performance, this device emphasizes integration, configurability and system-level flexibility.

Key Features

  • Core architecture — Non-volatile, infinitely reconfigurable LatticeXP family technology with instant-on operation and no external configuration memory required.
  • Logic capacity — Approximately 6,000 logic elements and 720 logic blocks for mid-range programmable logic implementations.
  • Embedded memory — 73,728 bits (~73 Kbits) of on-chip RAM with support for distributed and block memory configurations as provided by the LatticeXP family.
  • I/O count and flexibility — 142 user I/Os with programmable sysIO buffers; family-level support for LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS interface standards.
  • Memory interface support — Family features include dedicated DDR memory interface capability (up to DDR333), enabling direct high‑speed memory connections where required.
  • Clocking and system timing — Up to four analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
  • Reconfiguration and power modes — In-field TransFR™ reconfiguration for logic updates while running and a sleep mode that can reduce static current significantly.
  • Power and supply — Operates across a wide supply range: 1.71 V to 3.465 V.
  • Package & mounting — 208‑BFQFP (supplier: 208‑PQFP, 28 × 28 mm), surface-mount package.
  • Industrial temperature rating — Specified for operation from -40 °C to 100 °C.
  • RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial control and automation — Reconfigurable logic and robust I/O make the device suitable for sensor aggregation, protocol bridging and custom control algorithms across the -40 °C to 100 °C industrial range.
  • Embedded systems — Instant-on non‑volatile configuration and on-chip memory simplify boot/initialization and reduce BOM by eliminating external configuration memory.
  • High‑speed memory interfaces — Dedicated DDR interface support and PLL resources enable memory controller and interface implementations requiring precise clocking.
  • Field‑upgradable designs — TransFR reconfiguration enables in-field logic updates without removing the device, useful for long‑lifecycle or remotely serviced equipment.

Unique Advantages

  • Non‑volatile instant-on operation: Powers up configured and ready in microseconds without external configuration memory, reducing system complexity.
  • Mid-range logic density with compact package: ~6,000 logic elements and 142 I/Os in a 208‑pin BFQFP provide a balance of capability and PCB footprint for compact systems.
  • Flexible I/O standards: Programmable sysIO buffers support a wide variety of signaling standards, enabling diverse peripheral and interface connectivity.
  • Field reconfiguration capability: TransFR reconfiguration allows updates to logic while the system is running, facilitating feature upgrades and bug fixes in deployed systems.
  • Industrial robustness: Rated for -40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Integrated clocking resources: Up to four analog PLLs per device support complex clocking and timing architectures without external components.

Why Choose LFXP6C-4QN208I?

The LFXP6C-4QN208I delivers a balanced combination of reconfigurable logic, embedded memory and flexible I/O in a non‑volatile FPGA that fits mid‑range embedded and industrial applications. Its instant-on behavior, in-field reconfiguration capability and industrial temperature rating make it suitable for designs that require reliability, upgradability and compact integration.

Choose this device when you need a robust, reprogrammable hardware element that reduces external component count, supports diverse I/O standards and provides the system-level flexibility of the LatticeXP family.

Request a quote or submit an inquiry to receive pricing, availability and additional technical information for the LFXP6C-4QN208I.

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