LFXP6C-4F256I

The LFXP6C-4F256I is a member of the LatticeXP family of FPGAs providing a non-volatile, reconfigurable logic platform targeted at industrial applications. It integrates approximately 6,000 logic elements, on-chip memory, and flexible I/O in a compact 256-ball FPBGA (17 × 17 mm) package to support designs that require instant-on behavior, in-field reconfiguration, and extended temperature operation.

This device is suited for market segments such as industrial control, communications and instrumentation where robust temperature range, multi-voltage support and a high I/O count are required. Its combination of embedded RAM, programmable I/O and reconfiguration features enables efficient integration of custom logic and interface functions.

Key Features

• Core Logic Approximately 6,000 logic elements arranged to support complex user logic and control functions.
• Embedded Memory Total on-chip RAM reported as 73,728 bits (approximately 72 Kbits) for use as embedded block and distributed memory.
• I/O Capacity 188 user I/O pins provided in the 256-ball fpBGA package to support rich peripheral connectivity and multiple interfaces.
• Non-volatile, Instant-on Architecture LatticeXP family features include non-volatile, infinitely reconfigurable technology with instant-on startup and no external configuration memory required.
• In-field Reconfiguration and Sleep Mode Supports TransFR™ reconfiguration for in-field logic updates while the system operates and a sleep mode capable of reducing static current by up to 1000×.
• Clocking Resources Device-specific clock resources: 2 PLLs for system clocking, multiply/divide and phase shifting functions (LatticeXP family and LFXP6 configuration).
• Power and Voltage Support Operates across a supply range of 1.71 V to 3.465 V to accommodate mixed-voltage system designs.
• Package & Mounting 256-ball fpBGA (17 × 17 mm) supplier device package, surface-mount mounting type, suitable for space-constrained boards.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for industrial environments.
• Standards and Interface Flexibility (family-level) LatticeXP family supports a wide range of I/O standards (for reference in system design), and dedicated DDR memory support and sysCLOCK PLLs are available in the family architecture.
• RoHS Compliant Device is RoHS compliant.

Typical Applications

• Industrial Control Implement motor control, PLC interfaces and custom timing or state-machine logic using the device’s industrial temperature rating and flexible I/O.
• Communications & Networking Use the 188 I/Os and embedded memory for protocol bridging, packet processing front-ends or custom interface adaptation.
• Instrumentation & Test Equipment Leverage instant-on capability and reconfigurable logic to implement measurement front-ends, data aggregation, and real-time pre-processing.
• Embedded System Glue Logic Replace multiple discrete components with a single FPGA for bus interfacing, peripheral aggregation and custom control logic.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate start-up behavior after power-up.
• In-field reconfiguration (TransFR™): Allows updates to logic while the system remains in operation, reducing system downtime for field updates.
• Compact, high-density package: 256-ball fpBGA (17 × 17 mm) enables a high I/O count and on-chip resources in a small footprint to reduce board area.
• Industrial temperature performance: Rated from −40 °C to 100 °C to meet the needs of industrial deployments.
• Flexible supply voltage range: 1.71 V to 3.465 V operation supports integration into mixed-voltage systems.
• Integrated memory and clocking: Approximately 72 Kbits of on-chip RAM and device clock PLLs simplify local buffering and clock management.

Why Choose LFXP6C-4F256I?

The LFXP6C-4F256I combines a non-volatile LatticeXP family architecture with a compact 256-ball fpBGA package, delivering approximately 6,000 logic elements, substantial on-chip RAM and 188 I/Os for dense, interface-rich designs. Its industrial temperature rating and flexible supply voltage range make it suitable for deployed systems that need reliable, instant-on operation and the ability to be updated in the field.

This device is well suited to engineers and teams building industrial control systems, communications interfaces, instrumentation and embedded glue logic who require a reconfigurable, integrated solution with on-chip memory and configurable I/O.

Request a quote or submit a sales inquiry to evaluate the LFXP6C-4F256I for your next design and learn about availability and pricing.