LFXP6E-3FN256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 1,176 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-3FN256I – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

The LFXP6E-3FN256I is a non-volatile, reconfigurable FPGA from the LatticeXP family, delivering 6,000 logic elements and 73,728 bits of on-chip RAM in a 256-ball fpBGA (17 × 17 mm) package. Built for industrial-temperature operation, the device combines instant-on non-volatile configuration with in-field reconfiguration and low-power sleep modes to support a wide range of embedded system and control applications.

This device provides a high I/O count (188 pins) and flexible I/O buffering for multiple interface standards, together with on-chip system features such as PLLs and boundary-scan support to simplify system integration and debugging.

Key Features

  • Core Logic  6,000 logic elements (approximate) for implementing combinational and sequential logic functions.
  • Embedded Memory  73,728 bits of on-chip RAM (embedded and distributed resources) to support buffers, FIFOs and state storage.
  • I/O Capacity & Flexibility  188 general-purpose I/Os in a 256-ball fpBGA package; programmable sysIO buffer supports a wide range of interface standards.
  • Non-volatile Instant-On  ispXP non-volatile architecture enables instant-on operation with no external configuration memory required and design security without exposed bitstreams.
  • In-field Reconfiguration  TransFR™ reconfiguration enables logic updates while the system operates; SRAM and non-volatile memory are programmable through system configuration and JTAG ports.
  • Low-Power Modes  Sleep mode capability enables up to 1000× static current reduction for power-sensitive designs.
  • Clocking  Up to 2 analog PLLs on the device for clock multiply/divide and phase shifting.
  • Supply & Temperature  Core supply range 1.14 V to 1.26 V; rated for industrial operation from −40 °C to 100 °C.
  • Package & Mounting  256-FP BGA (17 × 17 mm) surface-mount package for compact board footprints and reliable soldered connections.
  • Regulatory  RoHS compliant.

Typical Applications

  • Instant-on Control Systems  Use the non-volatile instant-on capability to power devices that require immediate responsiveness at startup.
  • Field-Upgradeable Embedded Systems  In-field TransFR reconfiguration supports live logic updates without removing the device from service.
  • High-density I/O Interfaces  With 188 I/Os and flexible sysIO buffering, implement multi-protocol interfaces and signal conditioning on a single device.
  • Industrial Automation  Industrial temperature rating and low-power sleep modes make the device suitable for reliable control and monitoring applications.

Unique Advantages

  • Non-volatile, instant-on architecture: Eliminates the need for external configuration memory and enables rapid system startup.
  • In-field reconfiguration (TransFR™): Allows hardware updates while the system remains operational, reducing downtime for upgrades.
  • Compact, high-density package: 256-ball fpBGA (17 × 17 mm) provides substantial logic and I/O capacity in a small footprint to reduce PCB area.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
  • Power management: Sleep mode delivers significant static current reduction for energy-sensitive designs.
  • Integrated clock resources: On-chip PLLs simplify clock management without external components.

Why Choose LFXP6E-3FN256I?

The LFXP6E-3FN256I combines a non-volatile instant-on FPGA architecture with 6,000 logic elements, approximately 73,728 bits of on-chip RAM, and 188 flexible I/Os, providing a balanced platform for embedded, industrial, and interface-dense designs. Its on-chip reconfiguration, sleep modes, and programmable I/O buffering reduce BOM complexity while enabling in-field updates and robust system operation across industrial temperatures.

This device is well suited for engineers and system designers who require a compact, reconfigurable solution with non-volatile configuration, flexible interfacing, and proven system features such as PLLs and boundary-scan support to streamline design, validation, and long-term deployment.

Request a quote or submit a product inquiry to evaluate the LFXP6E-3FN256I for your next design and learn about availability and ordering options.

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