LFXP6E-3FN256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 1,176 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3FN256I – XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA
The LFXP6E-3FN256I is a non-volatile, reconfigurable FPGA from the LatticeXP family, delivering 6,000 logic elements and 73,728 bits of on-chip RAM in a 256-ball fpBGA (17 × 17 mm) package. Built for industrial-temperature operation, the device combines instant-on non-volatile configuration with in-field reconfiguration and low-power sleep modes to support a wide range of embedded system and control applications.
This device provides a high I/O count (188 pins) and flexible I/O buffering for multiple interface standards, together with on-chip system features such as PLLs and boundary-scan support to simplify system integration and debugging.
Key Features
- Core Logic 6,000 logic elements (approximate) for implementing combinational and sequential logic functions.
- Embedded Memory 73,728 bits of on-chip RAM (embedded and distributed resources) to support buffers, FIFOs and state storage.
- I/O Capacity & Flexibility 188 general-purpose I/Os in a 256-ball fpBGA package; programmable sysIO buffer supports a wide range of interface standards.
- Non-volatile Instant-On ispXP non-volatile architecture enables instant-on operation with no external configuration memory required and design security without exposed bitstreams.
- In-field Reconfiguration TransFR™ reconfiguration enables logic updates while the system operates; SRAM and non-volatile memory are programmable through system configuration and JTAG ports.
- Low-Power Modes Sleep mode capability enables up to 1000× static current reduction for power-sensitive designs.
- Clocking Up to 2 analog PLLs on the device for clock multiply/divide and phase shifting.
- Supply & Temperature Core supply range 1.14 V to 1.26 V; rated for industrial operation from −40 °C to 100 °C.
- Package & Mounting 256-FP BGA (17 × 17 mm) surface-mount package for compact board footprints and reliable soldered connections.
- Regulatory RoHS compliant.
Typical Applications
- Instant-on Control Systems Use the non-volatile instant-on capability to power devices that require immediate responsiveness at startup.
- Field-Upgradeable Embedded Systems In-field TransFR reconfiguration supports live logic updates without removing the device from service.
- High-density I/O Interfaces With 188 I/Os and flexible sysIO buffering, implement multi-protocol interfaces and signal conditioning on a single device.
- Industrial Automation Industrial temperature rating and low-power sleep modes make the device suitable for reliable control and monitoring applications.
Unique Advantages
- Non-volatile, instant-on architecture: Eliminates the need for external configuration memory and enables rapid system startup.
- In-field reconfiguration (TransFR™): Allows hardware updates while the system remains operational, reducing downtime for upgrades.
- Compact, high-density package: 256-ball fpBGA (17 × 17 mm) provides substantial logic and I/O capacity in a small footprint to reduce PCB area.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
- Power management: Sleep mode delivers significant static current reduction for energy-sensitive designs.
- Integrated clock resources: On-chip PLLs simplify clock management without external components.
Why Choose LFXP6E-3FN256I?
The LFXP6E-3FN256I combines a non-volatile instant-on FPGA architecture with 6,000 logic elements, approximately 73,728 bits of on-chip RAM, and 188 flexible I/Os, providing a balanced platform for embedded, industrial, and interface-dense designs. Its on-chip reconfiguration, sleep modes, and programmable I/O buffering reduce BOM complexity while enabling in-field updates and robust system operation across industrial temperatures.
This device is well suited for engineers and system designers who require a compact, reconfigurable solution with non-volatile configuration, flexible interfacing, and proven system features such as PLLs and boundary-scan support to streamline design, validation, and long-term deployment.
Request a quote or submit a product inquiry to evaluate the LFXP6E-3FN256I for your next design and learn about availability and ordering options.