LFXP6E-3QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,658 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3QN208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6E-3QN208C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It integrates approximately 6,000 logic elements with on-chip RAM and flexible I/O in a 208-pin BFQFP package, targeting compact system designs that require instant-on capability, in-field reconfiguration and a wide range of interface options.
Designed for commercial-grade applications, this device offers a blend of density, embedded memory and I/O count—142 I/Os—while supporting low-power modes and system-level features useful for control, interface and memory-bridge applications.
Key Features
- Core Logic — Approximately 6,000 logic elements and 720 logic blocks provide mid-range density for control, glue-logic and custom processing tasks.
- Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 72 Kbits) supports distributed and block memory usage for buffers, FIFOs and small data stores.
- I/O Flexibility — 142 I/O pins in a 208-pin BFQFP (28 × 28 mm) package support a broad set of interface options as defined by the LatticeXP family, including LVCMOS, LVTTL, SSTL, HSTL, PCI and differential standards such as LVDS.
- Non-volatile, Instant-on Architecture — Family-level ispXP non-volatile configuration enables instant-on operation without external configuration memory and supports secure bitstream handling.
- In-field Reconfiguration & Debug — Supports reconfiguration of SRAM-based logic in milliseconds and includes system-level support such as IEEE 1149.1 boundary scan and internal logic analyzer capability.
- Power and Low-Power Modes — Sleep mode allows significant static current reduction for power-sensitive designs; operating core voltage specified between 1.14 V and 1.26 V.
- Clocking — Family supports analog PLLs for clock multiply/divide and phase shifting; LFXP6 family devices include up to 2 PLLs.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- System Control and Glue Logic — Use the 6,000 logic elements and abundant I/Os to consolidate discrete logic and implement control state machines or protocol bridging.
- Memory Interface and Buffering — On-chip SRAM and family-level dedicated DDR support enable implementation of memory interfaces and temporary data buffering.
- Interface Conversion — Flexible sysIO buffer support for multiple single-ended and differential standards makes the device suitable for converting between LVTTL/LVCMOS and high-speed differential interfaces.
- In-field Updatable Systems — TransFR reconfiguration and millisecond SRAM updates allow field updates to logic while the system remains in service.
Unique Advantages
- Non-volatile instant-on behavior: No external configuration memory required, enabling rapid power-up and simplified system initialization.
- Balanced mid-range integration: Combines roughly 6,000 logic elements with ~72 Kbits of embedded RAM and 142 I/Os for compact, multifunction designs.
- Flexible I/O standards: Family-level support for a wide range of I/O protocols reduces the need for external level shifters or interface ICs.
- In-field reconfiguration support: Ability to update SRAM-based logic quickly allows for iterative feature upgrades and bug fixes without hardware replacement.
- Power management features: Sleep mode capability reduces static current for energy-sensitive applications while maintaining configuration integrity.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics deployments.
Why Choose LFXP6E-3QN208C?
The LFXP6E-3QN208C provides a practical combination of logic density, embedded memory and extensive I/O in a 208-BFQFP package for commercial designs that need instant-on and reconfigurable capability. Its non-volatile architecture and in-field reconfiguration options make it suitable for designs that require secure configuration storage and the ability to update logic in deployed systems.
Engineers looking to consolidate discrete components, implement custom protocol bridges, or add reprogrammable control logic will find the LFXP6E-3QN208C a well-balanced choice for mid-density FPGA requirements, backed by Lattice-family system features and ecosystem support.
If you would like pricing, availability, or to request a formal quote for LFXP6E-3QN208C, submit an inquiry to receive a quote and further technical information.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016