LFXP6E-3T144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 1,075 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3T144I – XP Field Programmable Gate Array (FPGA) IC 100 I/O 73,728 bits RAM 6,000 LEs 144-LQFP
The LFXP6E-3T144I is a LatticeXP-series FPGA offered in a 144-LQFP (20 × 20 mm) surface-mount package. It combines non-volatile, reconfigurable logic with embedded block RAM and flexible I/O to address industrial embedded and control applications that require instant-on behavior, in-field reconfiguration and a compact package.
Key on-chip resources include 6,000 logic elements, 73,728 bits of total RAM, and 100 user I/Os. The device operates across a supply range of 1.14 V to 1.26 V and is specified for operation from –40 °C to 100 °C. It is RoHS-compliant and supplied in an industrial-grade configuration.
Key Features
- Non-volatile, infinitely reconfigurable architecture Instant-on capability with no external configuration memory required; supports in-system reconfiguration and on-the-fly updates.
- Logic resources Approximately 6,000 logic elements and 720 logic blocks provide the core fabric for custom logic and control functions.
- Embedded memory Total on-chip RAM of 73,728 bits for distributed and block memory use in buffering, state machines and small frame storage.
- Flexible I/O and standards support 100 user I/Os with programmable I/O buffer options and support for multiple signaling standards as provided by the LatticeXP family.
- Clocking and timing Integrated sysCLOCK PLLs (LFXP6 family provides two PLLs) for clock multiplication, division and phase adjustment.
- Memory interface capability Family-level support for dedicated DDR memory interfaces enables implementation of external memory subsystems where required.
- Package and mounting 144-LQFP (supplier package: 144-TQFP 20×20) surface-mount package suited to compact PCB designs.
- Industrial temperature and power Specified operating temperature from –40 °C to 100 °C and a supply range of 1.14 V to 1.26 V to match industrial system requirements.
- Standards and compliance RoHS-compliant manufacturing for environmental and regulatory alignment.
Typical Applications
- Industrial control and automation Use the FPGA for machine control logic, deterministic I/O handling and on-board signal processing within industrial temperature ranges.
- Embedded systems Implement custom peripheral interfaces, protocol conversion and glue logic leveraging the device’s instant-on and reconfiguration capabilities.
- Communications and networking endpoints Utilize flexible I/O and PLL-based clocking to implement interface logic, buffering and timing-critical data paths.
- Consumer and display controllers Integrate user interface control, timing generation and small frame buffers using the device’s logic and on-chip RAM.
Unique Advantages
- Instant-on, secure configuration: Non-volatile architecture eliminates external configuration memory and prevents bitstream interception during power-up.
- Field reconfigurability: In-system and in-field reconfiguration allow design updates and feature additions without hardware replacement.
- Compact, production-ready package: 144-LQFP surface-mount package provides a small footprint for space-constrained PCBs while offering 100 I/Os.
- Deterministic industrial operation: Rated for –40 °C to 100 °C and RoHS-compliant, making it suitable for industrial environments where temperature and compliance matter.
- Integrated clock management: On-chip PLLs provide flexible clocking for synchronized subsystems and timing-critical interfaces.
Why Choose LFXP6E-3T144I?
The LFXP6E-3T144I delivers a balanced mix of logic capacity, embedded memory and flexible I/O in a non-volatile FPGA architecture. With roughly 6,000 logic elements, 73,728 bits of on-chip RAM and 100 user I/Os in a 144-LQFP package, it is positioned for compact industrial and embedded designs that need instant-on behavior, field reconfiguration and robust temperature performance.
Designers benefit from a device that supports in-system updates, integrated clocking and multiple I/O standards as provided by the LatticeXP family, enabling reduced BOM and simplified system integration for mid-density FPGA applications.
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