LFXP6E-3TN144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 308 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3TN144C – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP
The LFXP6E-3TN144C is a commercial-grade LatticeXP family FPGA in a 144-pin LQFP (20 × 20 mm) package. It combines non-volatile, infinitely reconfigurable logic with on-chip memory and flexible I/O to support embedded system designs that require fast startup, in-field reconfiguration and secure configuration without external memory.
Key device attributes include 6,000 logic elements, approximately 0.072 Mbits of on-chip RAM, 100 I/Os and a 1.14 V to 1.26 V core supply window, making it suitable for compact system controllers, interface bridging and on-device logic updates.
Key Features
- Logic Capacity — 6,000 logic elements providing mid-range programmable logic density for control, glue-logic and custom processing.
- Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 0.072 Mbits) for distributed and small block storage.
- I/O Flexibility — 100 user I/Os in a 144-LQFP package enable a wide range of peripherals and interface connections.
- Non‑volatile, Instant‑On Architecture — Built-in non-volatile configuration with instant-on behavior; no external configuration memory required.
- In-field Reconfiguration — Supports reconfiguration while the system operates (TransFR™ style reconfiguration) and JTAG-based programming.
- Power and Low‑Power Modes — Supports a sleep mode that can reduce static current by up to 1000× for low-power applications.
- Clocking — Device family support includes PLLs for clock multiplication, division and phase shifting; LFXP6 family devices provide dedicated PLL resources.
- Package and Thermal — 144-LQFP (144-TQFP, 20 × 20 mm) surface-mount package; commercial operating range 0 °C to 85 °C.
- Manufacturing and Compliance — RoHS compliant and supplied in a 144-pin surface-mount package.
Typical Applications
- Embedded System Control — Mid-density programmable logic for device control, protocol handling and custom state machines in compact systems.
- Interface Bridging — Implements custom I/O mappings and interface conversion using 100 available I/Os in a small footprint package.
- Field Upgradeable Logic — In-field reconfiguration enables firmware and logic updates without removing the device from the system.
- Low-Power Designs — Sleep mode capability supports battery-assisted or power-sensitive applications that need deep static current reduction.
Unique Advantages
- Instant‑on, Secure Configuration: Non-volatile configuration eliminates external boot memory and secures the design from bitstream read-back.
- Compact, Mid‑Density Integration: 6,000 logic elements and 100 I/Os in a 144-LQFP package reduce overall BOM and enable compact board layouts.
- On‑Device Memory Resources: Approximately 73,728 bits of on-chip RAM simplify buffering and small-data storage without external SRAM.
- Field Reconfiguration: Supports reconfiguring SRAM-based logic in milliseconds, allowing in-system feature updates and algorithm changes.
- Power Management: Sleep mode with significant static current reduction helps extend battery life and lower system standby power.
- Commercial Temperature Range: Rated for 0 °C to 85 °C to match a broad set of commercial embedded applications.
Why Choose LFXP6E-3TN144C?
The LFXP6E-3TN144C brings non-volatile, instant-on FPGA capability into a compact 144-LQFP package with a balanced mix of logic, memory and I/O. Its architecture supports secure configurations without external memory, rapid in-field updates, and low-power standby modes—attributes that reduce system complexity and enable robust embedded designs.
This device is well suited to engineers and integrators who need a mid-density, reconfigurable logic solution for compact systems, interface conversion and field-updatable products. The combination of on-chip memory, 100 I/Os, and commercial temperature rating offers a practical platform for designs that require flexibility, compactness and predictable thermal characteristics.
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