LFXP6E-4FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 265 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4FN256C – XP FPGA, 6000 logic elements, 256‑BGA
The LFXP6E-4FN256C is a non-volatile XP Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It combines reconfigurable logic, embedded RAM and flexible I/O in a compact 256-ball fpBGA package, targeting commercial designs that require instant-on, reconfigurable logic with moderate I/O and on-chip memory.
This device implements the LatticeXP family architecture with features for in-field reconfiguration, sleep-mode power reduction and rapid startup, while exposing 188 I/Os and approximately 72 Kbits of embedded RAM for system integration and interface bridging tasks.
Key Features
- Core Logic 6000 logic elements and 720 CLBs provide configurable logic resources for mid-density designs.
- Embedded Memory Total on-chip RAM of 73,728 bits (approximately 72 Kbits) for distributed and block memory use.
- I/O Density & Flexibility Up to 188 I/Os in the 256‑BGA package to support multiple parallel interfaces and board-level signal routing.
- Non‑volatile, Instant‑On Architecture LatticeXP family technology provides non-volatile configuration with instant-on behavior and no external configuration memory required.
- Reconfiguration & Power Modes Support for in-field (SRAM) reconfiguration and a Sleep Mode enabling significant static current reduction.
- Clocking Integrated analog PLLs (device-level PLL count per LatticeXP family characteristics) for clock multiply/divide and phase shifting.
- Power Supply Device supply range specified at 1.14 V to 1.26 V for core operation.
- Package & Mounting 256-ball fpBGA (17 × 17 mm) supplier package, surface-mount mounting for compact board-level integration.
- Temperature & Grade Commercial-grade device with operating range 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Systems Reconfigurable logic and on-chip RAM make the device suitable for control, glue-logic and custom processing blocks in commercial embedded products.
- Interface and I/O Bridging High I/O count and flexible buffer support enable protocol bridging, level translation and board-level interface consolidation.
- Memory Interface Support On-chip memory and clocking resources support designs that require local buffering and DDR-style memory interfacing.
- Test & Measurement Instant-on configuration and reconfigurable logic allow rapid instrumentation and in-field algorithm updates for commercial test equipment.
Unique Advantages
- Non‑volatile, instant startup: Eliminates the need for external configuration memory and enables microsecond-scale power-up availability.
- Reconfigurability in the field: SRAM-based logic can be updated while deployed, enabling post-deployment feature enhancements or bug fixes.
- Compact, high-density packaging: 256-ball fpBGA (17×17 mm) provides 188 I/Os and significant logic in a small footprint to reduce board area.
- Low-voltage core operation: Narrow core supply range (1.14 V to 1.26 V) aligns with modern low-voltage system architectures.
- Power management options: Sleep Mode support permits substantial reductions in static current for lower-power standby states.
- Vendor pedigree: Part of the LatticeXP family with family-level features such as flexible I/O buffers and embedded clock PLLs.
Why Choose LFXP6E-4FN256C?
The LFXP6E-4FN256C offers a balanced combination of reconfigurable logic, embedded RAM and a high I/O count in a compact, RoHS-compliant 256‑BGA package. Its non-volatile LatticeXP architecture delivers instant-on capability and in-field reconfiguration, making it well suited for commercial embedded designs that require flexibility, quick startup and on-board memory.
Choose this device for mid-density FPGA needs where board space, configurable I/O and the ability to update logic in the field are important. It provides a practical platform for designers seeking scalable, reconfigurable logic backed by Lattice Semiconductor’s XP family features.
Request a quote or submit an inquiry to check availability and pricing for the LFXP6E-4FN256C. Our team can provide lead-time and ordering details tailored to your design needs.

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