LFXP6E-3QN208I

The LFXP6E-3QN208I is a LatticeXP family FPGA from Lattice Semiconductor Corporation. It combines non-volatile, reconfigurable logic with embedded memory and flexible I/O in a 208-pin BFQFP surface-mount package, targeted at industrial applications requiring dependable programmable logic.

This device provides 6,000 logic elements, approximately 72 Kbits of embedded RAM, and 142 user I/Os, delivering an integrated platform for control, interface bridging, and system glue logic across a wide operating temperature range.

Key Features

• Core Logic — 6,000 logic elements (as specified) enabling medium-density programmable logic implementations and on-chip routing for custom logic and state machines.
• Embedded Memory — Approximately 72 Kbits of on-chip RAM (73,728 bits) for data buffering, small FIFOs, and state storage.
• I/O Density & Flexibility — 142 user I/Os in a 208-pin package to support multiple peripheral connections and board-level interfaces.
• Non-volatile, Instant-on Architecture — LatticeXP family features non-volatile configuration with instant-on and no external configuration memory required.
• In-field Reconfiguration — Supports TransFR™ reconfiguration for updating logic in-system while operating and JTAG-based configuration pathways.
• Low-power Modes — Sleep mode capability for large reductions in static current during standby.
• Clocking — Device-level PLL support consistent with LatticeXP family architecture (LFXP6 class includes 2 PLLs) for clock multiplication, division and phase shifting.
• Power Supply — Device operates from a primary supply range of 1.14 V to 1.26 V as specified for this part.
• Package & Mounting — 208-BFQFP (28 × 28 mm supplier PQFP footprint), surface-mount package suited for standard PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Flexible I/O Standards (Family) — LatticeXP family supports a wide set of interface standards (including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS) through programmable I/O buffers.

Typical Applications

• Industrial Automation — Use the device’s industrial temperature rating and 142 I/Os to implement sensor interfacing, real-time control logic and I/O aggregation in factory systems.
• Embedded System Glue Logic — Consolidate custom bus bridging, protocol adaptation and peripheral control where medium-density programmable logic and on-chip RAM simplify board design.
• Instrumentation & Test Equipment — Implement custom data acquisition front-ends, timing control and preprocessing using the device’s PLLs and embedded memory.
• Communications & Interface Bridging — Leverage flexible I/O standards and reconfigurability to adapt interfaces and perform protocol conversion at the board level.

Unique Advantages

• Non-volatile instant-on operation: Eliminates external configuration memory and enables rapid startup without external boot sources.
• Reconfigurable in-field updates: TransFR™ reconfiguration and JTAG pathways allow in-system logic updates and iterative development workflows.
• Compact, high-I/O package: 208-BFQFP surface-mount package provides 142 I/Os in a 28 × 28 mm footprint for space-constrained boards.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Integrated memory and clocking: Approximately 72 Kbits of embedded RAM plus device PLLs support local buffering and flexible clocking without external components.
• Reduced BOM and board complexity: On-chip non-volatile configuration, embedded RAM and abundant I/Os reduce the need for external configuration and buffering components.

Why Choose LFXP6E-3QN208I?

The LFXP6E-3QN208I positions itself as an industrial-grade, medium-density FPGA that balances logic capacity, on-chip memory and a broad complement of I/Os in a standard 208-BFQFP package. It is well suited for designers who need reliable, non-volatile programmable logic with in-field reconfiguration and flexible I/O support.

Backed by Lattice’s LatticeXP family architecture and design tool support, the device offers a practical platform for system designers seeking scalable functionality, reduced BOM and the ability to iterate firmware and logic in the field.

Request a quote or submit an inquiry for pricing and availability to evaluate the LFXP6E-3QN208I for your next design project.