LFXP6E-3Q208I

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 1,603 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O142Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-3Q208I – XP Field Programmable Gate Array (FPGA), 142 I/O, 6000 logic elements, 208-BFQFP

The LFXP6E-3Q208I is a Lattice XP family FPGA in a 208-BFQFP (28 × 28 mm) package providing approximately 6,000 logic elements, 73,728 bits of on-chip RAM and 142 general-purpose I/O pins. Built on the LatticeXP architecture, this device combines non-volatile configuration, embedded memory and flexible I/O to address system-level designs that require instant-on behavior, in-field reconfiguration and a compact footprint.

Key Features

  • Core Logic 
    Approximately 6,000 logic elements suitable for mid-density logic integration and glue-logic replacement.
  • Embedded Memory 
    73,728 total RAM bits (approximately 72 Kbits) of on-chip memory for distributed and block storage needs.
  • I/O and Package 
    142 I/Os in a 208-BFQFP (28 × 28 mm) surface-mount package for broad connectivity in space-constrained designs.
  • Non-volatile, Instant-on Architecture 
    Series-level LatticeXP features include non-volatile configuration with no external configuration memory required and instant-on startup behavior.
  • Reconfiguration and In-field Update 
    Supports TransFR™ reconfiguration for in-field logic updates and system-level reprogramming via supported configuration ports.
  • Low-power Modes 
    Series sleep mode capability enables substantial static current reduction for power-sensitive applications.
  • Clocking 
    Series-level sysCLOCK PLL capability (up to 4 PLLs per device) for clock multiply, divide and phase-shifting where required.
  • Power Supply 
    Nominal core voltage range 1.14 V to 1.26 V per device specification.
  • Temperature and Grade 
    Industrial-grade operation from −40 °C to 100 °C for deployments in demanding environments.
  • Compliance 
    RoHS compliant.

Typical Applications

  • Embedded Control and System Glue-Logic 
    Use the LFXP6E-3Q208I to consolidate discrete logic and offload microcontroller I/O handling in compact embedded systems.
  • Industrial Automation 
    Industrial temperature rating and robust I/O count make this device suitable for control, sensor aggregation and protocol bridging in factory and process automation equipment.
  • Communications and Interface Bridging 
    Flexible I/O and on-chip memory support protocol translation, data buffering and interface adaptation tasks in communication endpoints.
  • In-field Upgradeable Systems 
    Non-volatile configuration and TransFR reconfiguration enable field updates to logic without external configuration memory, supporting post-deployment feature upgrades.

Unique Advantages

  • Instant-on Non-volatile Configuration: Eliminates the need for external configuration memory and reduces system boot time by powering up configured in microseconds.
  • In-field Reconfiguration: TransFR reconfiguration allows logic updates while the system remains operational, simplifying maintenance and feature rollouts.
  • Compact, High-I/O Package: 142 I/Os in a 208-BFQFP package provide a high pin count in a standardized surface-mount form factor for easier PCB integration.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the environmental demands of industrial applications.
  • Integrated Memory Resources: Approximately 73,728 bits of embedded RAM reduce external memory requirements for buffering and local storage.
  • Power Management Options: Series sleep mode capability enables significant static current reduction for lower-power standby operation.

Why Choose LFXP6E-3Q208I?

The LFXP6E-3Q208I delivers a balance of mid-range logic capacity, substantial on-chip memory and a high I/O count in a compact 208-BFQFP package, geared toward embedded and industrial system designs that benefit from non-volatile, instant-on configuration and in-field reprogrammability. Its industrial temperature rating and RoHS compliance make it a practical choice for robust, long-life deployments.

Designers seeking a reconfigurable, non-volatile FPGA with flexible I/O and on-chip memory for system-level integration will find the LFXP6E-3Q208I appropriate for applications that require maintainability, reduced external components and reliable operation across temperature extremes.

Request a quote or submit an inquiry to receive pricing, availability and support information for the LFXP6E-3Q208I.

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