LFXP6E-3Q208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,603 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-3Q208I – XP Field Programmable Gate Array (FPGA), 142 I/O, 6000 logic elements, 208-BFQFP
The LFXP6E-3Q208I is a Lattice XP family FPGA in a 208-BFQFP (28 × 28 mm) package providing approximately 6,000 logic elements, 73,728 bits of on-chip RAM and 142 general-purpose I/O pins. Built on the LatticeXP architecture, this device combines non-volatile configuration, embedded memory and flexible I/O to address system-level designs that require instant-on behavior, in-field reconfiguration and a compact footprint.
Key Features
- Core Logic
Approximately 6,000 logic elements suitable for mid-density logic integration and glue-logic replacement. - Embedded Memory
73,728 total RAM bits (approximately 72 Kbits) of on-chip memory for distributed and block storage needs. - I/O and Package
142 I/Os in a 208-BFQFP (28 × 28 mm) surface-mount package for broad connectivity in space-constrained designs. - Non-volatile, Instant-on Architecture
Series-level LatticeXP features include non-volatile configuration with no external configuration memory required and instant-on startup behavior. - Reconfiguration and In-field Update
Supports TransFR™ reconfiguration for in-field logic updates and system-level reprogramming via supported configuration ports. - Low-power Modes
Series sleep mode capability enables substantial static current reduction for power-sensitive applications. - Clocking
Series-level sysCLOCK PLL capability (up to 4 PLLs per device) for clock multiply, divide and phase-shifting where required. - Power Supply
Nominal core voltage range 1.14 V to 1.26 V per device specification. - Temperature and Grade
Industrial-grade operation from −40 °C to 100 °C for deployments in demanding environments. - Compliance
RoHS compliant.
Typical Applications
- Embedded Control and System Glue-Logic
Use the LFXP6E-3Q208I to consolidate discrete logic and offload microcontroller I/O handling in compact embedded systems. - Industrial Automation
Industrial temperature rating and robust I/O count make this device suitable for control, sensor aggregation and protocol bridging in factory and process automation equipment. - Communications and Interface Bridging
Flexible I/O and on-chip memory support protocol translation, data buffering and interface adaptation tasks in communication endpoints. - In-field Upgradeable Systems
Non-volatile configuration and TransFR reconfiguration enable field updates to logic without external configuration memory, supporting post-deployment feature upgrades.
Unique Advantages
- Instant-on Non-volatile Configuration: Eliminates the need for external configuration memory and reduces system boot time by powering up configured in microseconds.
- In-field Reconfiguration: TransFR reconfiguration allows logic updates while the system remains operational, simplifying maintenance and feature rollouts.
- Compact, High-I/O Package: 142 I/Os in a 208-BFQFP package provide a high pin count in a standardized surface-mount form factor for easier PCB integration.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the environmental demands of industrial applications.
- Integrated Memory Resources: Approximately 73,728 bits of embedded RAM reduce external memory requirements for buffering and local storage.
- Power Management Options: Series sleep mode capability enables significant static current reduction for lower-power standby operation.
Why Choose LFXP6E-3Q208I?
The LFXP6E-3Q208I delivers a balance of mid-range logic capacity, substantial on-chip memory and a high I/O count in a compact 208-BFQFP package, geared toward embedded and industrial system designs that benefit from non-volatile, instant-on configuration and in-field reprogrammability. Its industrial temperature rating and RoHS compliance make it a practical choice for robust, long-life deployments.
Designers seeking a reconfigurable, non-volatile FPGA with flexible I/O and on-chip memory for system-level integration will find the LFXP6E-3Q208I appropriate for applications that require maintainability, reduced external components and reliable operation across temperature extremes.
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