LFXP6E-5TN144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 665 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-5TN144C – XP Field Programmable Gate Array (FPGA) IC 100 I/Os, 6000 Logic Elements
The LFXP6E-5TN144C is a non-volatile LatticeXP family FPGA in a 144-pin LQFP package designed for compact, instant-on programmable logic applications. It integrates 6,000 logic elements, approximately 73 Kbits of on-chip RAM, and 100 I/Os in a surface-mount 144-LQFP (20 × 20 mm) footprint, targeting commercial-temperature system designs where fast configuration and flexible I/O support are required.
This device combines reconfigurable logic, embedded memory and flexible I/O options to address control, interfacing and mid-density logic integration needs while supporting low-voltage core operation between 1.14 V and 1.26 V.
Key Features
- Logic Capacity — 6,000 logic elements provide mid-range programmable logic resources suitable for complex glue-logic, protocol bridging and control-state machines.
- Logic Blocks — 720 logic block units (PFU/PFF total) as part of the LatticeXP architecture, enabling structured placement and routing for moderate-density designs.
- On-Chip RAM — 73,728 bits (approximately 73 Kbits) of embedded memory for buffering, FIFOs and small data storage without external SRAM.
- I/O and Packaging — 100 user I/Os in a 144-LQFP surface-mount package (supplier package: 144-TQFP 20×20 mm) for compact board designs and multiple interface options.
- Power Supply — Core voltage support from 1.14 V to 1.26 V, enabling low-voltage operation in power-sensitive systems.
- Clocking — FPGA family-level clock management features include analog PLLs (LFXP6 devices provide 2 PLLs) for clock multiplication, division and phase adjustments.
- Non-volatile, Instant-On Architecture — Series-level non-volatile ispXP™ technology provides instant configuration on power-up and reconfigurability without external configuration memory.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general-purpose commercial electronics.
- Compliance — RoHS-compliant manufacturing to meet common environmental requirements.
Typical Applications
- Embedded Control — Implement state machines, motor-control logic front-ends or interface controllers where 6,000 logic elements and on-chip RAM support responsive control loops and buffering.
- Protocol Bridging — Bridge between legacy and modern buses or convert peripheral interfaces using programmable I/Os and embedded PLL-based clocking.
- User Interfaces — Drive and manage display, keypad or sensor hub logic functions within compact, surface-mount designs.
- Communication Endpoints — Implement custom packet processing, framing or low-to-mid-rate serial interfaces using available I/Os and on-chip memory.
Unique Advantages
- Instant-On Non-Volatile Configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior for time-sensitive systems.
- Balanced Integration: Combines 6,000 logic elements, ~73 Kbits of RAM and 100 I/Os in a 144-LQFP package to reduce board area and BOM complexity.
- Low-Voltage Core Operation: Narrow core voltage range (1.14 V–1.26 V) supports designs targeting low-power core domains and simplified power supply engineering.
- Flexible Clocking: Dedicated PLL resources (2 PLLs for LFXP6) allow on-chip clock generation and phase adjustment without external clock synthesis.
- Compact Surface-Mount Package: 144-LQFP (20 × 20 mm) surface-mount package enables integration into space-constrained PCB layouts while offering ample I/O.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for a wide range of consumer and industrial-adjacent applications.
Why Choose LFXP6E-5TN144C?
The LFXP6E-5TN144C positions itself as a mid-density, non-volatile FPGA optimized for designs that require instant-on reconfigurability, moderate logic capacity and compact packaging. Its combination of 6,000 logic elements, approximately 73 Kbits of embedded RAM and 100 I/Os in a 144-LQFP package makes it a practical choice for embedded control, protocol bridging and interface consolidation where board space and quick startup matter.
With series-level features such as non-volatile configuration, PLL-based clock management and a proven FPGA architecture, the device offers a scalable option for teams looking to standardize on LatticeXP family devices and leverage the available design tools and IP for efficient implementation and future migration.
Request a quote or submit a purchase inquiry to learn about availability, pricing and lead times for the LFXP6E-5TN144C. Our team can provide component sourcing details and help evaluate fit for your application.