LFXP6E-5TN144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 665 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-5TN144C – XP Field Programmable Gate Array (FPGA) IC 100 I/Os, 6000 Logic Elements

The LFXP6E-5TN144C is a non-volatile LatticeXP family FPGA in a 144-pin LQFP package designed for compact, instant-on programmable logic applications. It integrates 6,000 logic elements, approximately 73 Kbits of on-chip RAM, and 100 I/Os in a surface-mount 144-LQFP (20 × 20 mm) footprint, targeting commercial-temperature system designs where fast configuration and flexible I/O support are required.

This device combines reconfigurable logic, embedded memory and flexible I/O options to address control, interfacing and mid-density logic integration needs while supporting low-voltage core operation between 1.14 V and 1.26 V.

Key Features

  • Logic Capacity — 6,000 logic elements provide mid-range programmable logic resources suitable for complex glue-logic, protocol bridging and control-state machines.
  • Logic Blocks — 720 logic block units (PFU/PFF total) as part of the LatticeXP architecture, enabling structured placement and routing for moderate-density designs.
  • On-Chip RAM — 73,728 bits (approximately 73 Kbits) of embedded memory for buffering, FIFOs and small data storage without external SRAM.
  • I/O and Packaging — 100 user I/Os in a 144-LQFP surface-mount package (supplier package: 144-TQFP 20×20 mm) for compact board designs and multiple interface options.
  • Power Supply — Core voltage support from 1.14 V to 1.26 V, enabling low-voltage operation in power-sensitive systems.
  • Clocking — FPGA family-level clock management features include analog PLLs (LFXP6 devices provide 2 PLLs) for clock multiplication, division and phase adjustments.
  • Non-volatile, Instant-On Architecture — Series-level non-volatile ispXP™ technology provides instant configuration on power-up and reconfigurability without external configuration memory.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general-purpose commercial electronics.
  • Compliance — RoHS-compliant manufacturing to meet common environmental requirements.

Typical Applications

  • Embedded Control — Implement state machines, motor-control logic front-ends or interface controllers where 6,000 logic elements and on-chip RAM support responsive control loops and buffering.
  • Protocol Bridging — Bridge between legacy and modern buses or convert peripheral interfaces using programmable I/Os and embedded PLL-based clocking.
  • User Interfaces — Drive and manage display, keypad or sensor hub logic functions within compact, surface-mount designs.
  • Communication Endpoints — Implement custom packet processing, framing or low-to-mid-rate serial interfaces using available I/Os and on-chip memory.

Unique Advantages

  • Instant-On Non-Volatile Configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior for time-sensitive systems.
  • Balanced Integration: Combines 6,000 logic elements, ~73 Kbits of RAM and 100 I/Os in a 144-LQFP package to reduce board area and BOM complexity.
  • Low-Voltage Core Operation: Narrow core voltage range (1.14 V–1.26 V) supports designs targeting low-power core domains and simplified power supply engineering.
  • Flexible Clocking: Dedicated PLL resources (2 PLLs for LFXP6) allow on-chip clock generation and phase adjustment without external clock synthesis.
  • Compact Surface-Mount Package: 144-LQFP (20 × 20 mm) surface-mount package enables integration into space-constrained PCB layouts while offering ample I/O.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for a wide range of consumer and industrial-adjacent applications.

Why Choose LFXP6E-5TN144C?

The LFXP6E-5TN144C positions itself as a mid-density, non-volatile FPGA optimized for designs that require instant-on reconfigurability, moderate logic capacity and compact packaging. Its combination of 6,000 logic elements, approximately 73 Kbits of embedded RAM and 100 I/Os in a 144-LQFP package makes it a practical choice for embedded control, protocol bridging and interface consolidation where board space and quick startup matter.

With series-level features such as non-volatile configuration, PLL-based clock management and a proven FPGA architecture, the device offers a scalable option for teams looking to standardize on LatticeXP family devices and leverage the available design tools and IP for efficient implementation and future migration.

Request a quote or submit a purchase inquiry to learn about availability, pricing and lead times for the LFXP6E-5TN144C. Our team can provide component sourcing details and help evaluate fit for your application.

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