 | | LS1021ASN7HNB | NXP Semiconductors | IC MPU QORIQ 800MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 739 | |
 | | LS1021ASN7KQB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,723 | |
 | | LS1021ASN7MQB | NXP Semiconductors | IC MPU QORIQ 1.2GHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,426 | |
 | | LS1021AXE7KQB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 67 | |
 | | LS1021AXN7HNB | NXP Semiconductors | IC MPU QORIQ 800MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,139 | |
 | | LS1021AXN7KQB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,612 | |
 | | LS1021AXN7MQB | NXP Semiconductors | IC MPU QORIQ 1.2GHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: 2D-ACE Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,096 | |
 | | LS1022ASE7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 17 | |
 | | LS1022ASN7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 229 | |
 | | LS1022AXE7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 703 | |
 | | LS1022AXN7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 525FCPBGA | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 361 | |
| N/A | | LS1023ABE9MQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23×23) | 1,254 | |
| N/A | | LS1023ABE9PQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23×23) | 642 | |
| N/A | | LS1023ACE9MQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23×23) | 1,465 | |
| N/A | | LS1023ACE9PQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23×23) | 395 | |
| N/A | | LS1023ACE9QQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23×23) | 635 | |
 | | LS1023ASE7KNLB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (21x21) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (21×21) | 1,284 | |
 | | LS1023ASE7KQB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (21x21) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (21×21) | 1,719 | |
 | | LS1023ASE7MNLB | NXP Semiconductors | IC MPU QORIQ 1.2GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (21x21) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (21×21) | 818 | |
 | | LS1023ASE7MQB | NXP Semiconductors | IC MPU QORIQ 1.2GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (21x21) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (21×21) | 585 | |