LS1023ACE9QQB

LAYERSCAPE 64-BIT ARM CORTEX-A53
Part Description

ARM® Cortex®-A53 Microprocessor IC QorlQ LS1 2 Core, 64-Bit 1.6GHz 780-FBGA (23x23)

Quantity 1,047 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FBGA (23x23)ECCNN/A
Ethernet1GbE (4), 2.5GbE (2), 10GbE (1)Graphics AccelerationNoHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case780-BFBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 6Gbps (1)Security FeaturesARM TZ, Boot SecuritySpeed1.6GHz
Supplier Device Package780-FBGA (23×23)USBUSB 3.0 + PHY (3)

Overview of LS1023ACE9QQB – LAYERSCAPE 64-BIT ARM CORTEX-A53

The LS1023ACE9QQB is a dual-core, 64-bit microprocessor based on the ARM® Cortex®‑A53 architecture, running at up to 1.6 GHz. It is part of the Layerscape QorIQ family of communications processors and is targeted at embedded networking and industrial infrastructure applications.

Designed for small-form-factor, fanless systems, the device combines general-purpose processing with flexible I/O and hardware security features to address branch routers, edge equipment, industrial control and IoT gateway use cases while supporting industrial temperature operation.

Key Features

  • Core  Dual ARM® Cortex®‑A53 cores at 1.6 GHz providing 64‑bit processing for embedded networking and control tasks.
  • Memory  Integrated memory controller support for DDR3L and DDR4 to match system performance and power requirements.
  • Networking Interfaces  Multiple Ethernet options including 1GbE (4 ports), 2.5GbE (2 ports) and 10GbE (1 port) for flexible network connectivity and deployment scenarios.
  • Storage & USB  Single SATA 6Gbps port and three USB 3.0 + PHY interfaces for high-speed storage and peripheral connectivity.
  • Peripheral & Control  I2C interface and other system interfaces suitable for board management and peripheral integration.
  • Security  Hardware security features including ARM TrustZone (TZ) and boot security to support protected boot and runtime isolation.
  • Package & Mounting  780‑FBGA (23×23) FCBGA package, surface-mount mounting type for compact PCB designs.
  • Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C for harsh-environment applications.
  • Compliance  RoHS compliant to meet common regulatory and environmental requirements.

Typical Applications

  • Branch Office Routers: Use the dual Cortex‑A53 cores and multi-speed Ethernet ports to implement compact, fanless routing platforms for branch and SMB networks.
  • vCPE and Edge Equipment: Deploy as a small-form-factor compute element for virtualized customer premises equipment and edge network functions.
  • Multi‑protocol IoT Gateways: Aggregate and process sensor and protocol traffic with integrated Ethernet, SATA and USB connectivity.
  • Industrial PLC and Control: Support industrial control applications with industrial temperature rating, robust I/O and hardware security for protected operation.
  • Security Appliances: Implement networking security functions using on-chip security features and the Layerscape data path architecture for efficient packet handling.

Unique Advantages

  • Integrated, multi‑speed networking: A mix of 1GbE, 2.5GbE and 10GbE interfaces provides design flexibility for diverse network topologies and bandwidth needs.
  • High‑performance 64‑bit processing: Dual ARM Cortex‑A53 cores at 1.6 GHz deliver ample processing headroom for control plane and application tasks.
  • Flexible memory support: DDR3L and DDR4 controller support enables designers to balance cost and performance per application.
  • Industrial‑grade reliability: Industrial qualification and −40 °C to 105 °C operating range allow deployment in demanding environments.
  • Hardware security primitives: ARM TrustZone and boot security support secure boot and runtime isolation for trusted embedded systems.
  • Compact package for dense designs: 780‑FBGA (23×23) surface‑mount package supports small PCB form factors and high‑density board layouts.

Why Choose LS1023ACE9QQB?

The LS1023ACE9QQB combines 64‑bit dual‑core ARM processing, broad networking I/O and hardware security in a compact, industrially qualified package—making it well suited for small-form-factor networking, edge compute and industrial control systems. Its mix of Ethernet speeds, SATA and USB 3.0 interfaces along with DDR3L/DDR4 memory support gives designers a versatile platform to optimize BOM and board layout for target performance and cost.

Backed by the Layerscape/QorIQ architecture and NXP Semiconductors product family, the LS1023ACE9QQB provides a scalable, robust foundation for embedded networking and industrial applications that require integrated connectivity, secure boot and extended temperature operation.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the LS1023ACE9QQB.

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