LS1023ABE9PQB

LAYERSCAPE 64-BIT ARM CORTEX-A53
Part Description

ARM® Cortex®-A53 Microprocessor IC QorlQ LS1 2 Core, 64-Bit 1.4GHz 780-FBGA (23x23)

Quantity 1,203 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FBGA (23x23)ECCNN/A
Ethernet1GbE (4), 2.5GbE (2), 10GbE (1)Graphics AccelerationNoHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case780-BFBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 6Gbps (1)Security FeaturesARM TZ, Boot SecuritySpeed1.4GHz
Supplier Device Package780-FBGA (23×23)USBUSB 3.0 + PHY (3)

Overview of LS1023ABE9PQB – LAYERSCAPE 64-BIT ARM CORTEX-A53

The LS1023ABE9PQB is an NXP Layerscape communications processor featuring dual ARM® Cortex®-A53 64-bit cores running at 1.4 GHz. It is designed for embedded networking and industrial infrastructure applications that require a compact, highly integrated processor with industrial temperature qualification.

With multi-gigabit networking options, flexible memory support and integrated security capabilities, this device targets small-form-factor routers, edge appliances, IoT gateways and industrial control equipment where integration, deterministic packet handling and wide operating temperature are important.

Key Features

  • Core Dual ARM® Cortex®-A53 64-bit cores at 1.4 GHz, providing multicore general-purpose processing in a value-tier Layerscape device.
  • Memory Integrated DDR3L and DDR4 memory controller support for flexible system memory configurations.
  • Networking Multi-rate Ethernet interfaces including 1 GbE (4), 2.5 GbE (2) and 10 GbE (1); integrated Frame Manager and offload architecture for hardware packet parsing and classification as described in the product series documentation.
  • High-speed SerDes and PCIe Multi-protocol SerDes and support for PCIe interfaces as part of the series' flexible I/O fabric for high-speed peripherals and expansion.
  • Storage and USB Single SATA 6 Gbps port and three USB 3.0 ports with PHY support for high-throughput storage and host/peripheral connectivity.
  • Security Hardware security features including ARM TrustZone and Boot Security, plus integrated security engine support referenced in the series for inline IPsec and cryptographic offload.
  • System Interfaces Additional peripheral interfaces such as I2C and integrated QUICC Engine technology referenced in the family documentation for legacy protocol support.
  • Package & Thermal 780‑ball FCBGA (23 × 23 mm) surface-mount package and industrial operating temperature range of −40 °C to 105 °C.
  • Qualification Industrial qualification for use in demanding embedded and infrastructure applications.
  • Compliance RoHS compliant.

Typical Applications

  • Branch office routers and vCPE Compact networking platforms benefit from integrated multi-port Ethernet, hardware packet processing and security acceleration for managed services and virtual CPE deployments.
  • Edge and gateway appliances Multi-protocol IoT and edge gateways leverage the dual Cortex‑A53 cores and flexible I/O for protocol translation, device aggregation and secure edge processing.
  • Industrial PLC and control Industrial control systems use the industrial temperature range and integrated peripheral support for robust, fanless deployments.
  • Security appliances Inline IPsec and hardware security features enable encrypted throughput and secure boot for network security devices.
  • Integrated services and small-form-factor networking BOM-optimized I/O and a compact BGA package support economical, small-footprint designs with rich connectivity.

Unique Advantages

  • Highly integrated I/O Multiple Ethernet rates, SATA and USB 3.0 support reduce external components and simplify board design.
  • Flexible memory options DDR3L and DDR4 controller support lets designers choose memory technology that matches cost and performance targets.
  • Industrial readiness Industrial temperature qualification (−40 °C to 105 °C) and a compact 780‑FBGA package enable reliable operation in harsh environments.
  • Built-in security primitives ARM TrustZone, boot security and integrated security engine capabilities provide hardware foundations for secure systems and cryptographic offload.
  • Family scalability Part of the Layerscape / QorIQ family (LS1023A series), enabling scalability across dual- and quad-core variants within the same architecture.

Why Choose LS1023ABE9PQB?

The LS1023ABE9PQB combines dual 64-bit ARM Cortex‑A53 cores, broad networking I/O and integrated security features in a compact, industrial-qualified package. It is positioned for designers building small-form-factor networking, edge and industrial systems that require a balance of throughput, integration and thermal robustness.

As a member of the Layerscape/QorIQ family, the device offers design portability across related processors in the series, simplifying upgrades and platform planning while leveraging NXP's documented communications and offload engines for packet processing and security tasks.

Request a quote or submit a pricing inquiry to check availability, lead times and volume pricing for the LS1023ABE9PQB.

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