LS1023ACE9PQB

The LS1023ACE9PQB is a Layerscape communications processor based on dual ARM® Cortex®‑A53 cores running at 1.4 GHz. It is designed for small‑form‑factor embedded networking and industrial infrastructure applications where integration, performance and industrial operating range are required.

Built for edge and industrial use cases, the device pairs a 64‑bit ARM core complex with flexible high‑speed I/O and hardware acceleration to simplify board design and deliver efficient packet and data‑path processing for branch routers, gateways and control equipment.

Key Features

• Core & Performance Dual ARM® Cortex®‑A53 64‑bit processors at 1.4 GHz, offering a balance of processing performance and energy efficiency for embedded networking workloads.
• Memory Support & Cache Integrated controllers for DDR3L and DDR4 memory and the dual‑core complex includes a shared L2 cache for efficient data handling.
• Ethernet & Networking Multi‑rate Ethernet connectivity including four 1GbE, two 2.5GbE and one 10GbE interfaces to address a wide range of WAN/LAN and aggregation needs.
• Storage & USB Single SATA 6 Gbps port and three USB 3.0 ports with PHY support for high‑speed storage and peripheral connectivity.
• High‑Speed SerDes & Peripheral I/O Multi‑protocol SerDes and additional interfaces such as I2C enable flexible board-level integration and support for PCIe and other high‑speed links as part of the series architecture.
• Data Path Acceleration Leverages the QorIQ Data Path Acceleration Architecture (DPAA) and Frame Manager functionality for hardware packet parsing, classification and offload to reduce CPU overhead.
• Security ARM TrustZone and boot security features provide foundation-level hardware security for trusted boot and secure execution.
• Package & Mounting Supplied in a 780‑FBGA surface-mount package (23 × 23 mm) suitable for compact, soldered board designs.
• Industrial Reliability Qualified for industrial use with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

• Branch office routers: Compact routing and WAN aggregation platforms benefiting from multi‑rate Ethernet and packet offload.
• vCPE and edge equipment: Virtualized customer premises equipment and edge platforms that require efficient general‑purpose CPU cores and I/O flexibility.
• Multi‑protocol IoT gateways: Gateways that aggregate sensors and devices and need mixed‑rate Ethernet, USB and storage connectivity.
• Industrial PLC and control: Embedded controllers and small automation systems that require industrial temperature operation and secure boot capabilities.
• Security appliances: Network security appliances leveraging hardware acceleration and security features for inline processing.

Unique Advantages

• Integrated multi‑rate networking: A mix of 1GbE, 2.5GbE and 10GbE interfaces reduces external PHY count and simplifies board design for varied network topologies.
• Packet offload with DPAA and Frame Manager: Hardware packet parsing and classification reduce CPU load and improve effective throughput for networking tasks.
• High‑speed peripheral support: On‑chip SATA 6 Gbps and USB 3.0 PHYs provide direct connections for storage and high‑speed peripherals without additional controllers.
• Industrial temperature operation: −40 °C to 105 °C rating enables deployment in harsh environments and industrial installations.
• Security foundation: ARM TrustZone and boot security features provide hardware support for trusted boot and secure execution models.
• Compact soldered package: 780‑FBGA (23×23 mm) surface‑mount package supports small, low‑profile system designs.

Why Choose LS1023ACE9PQB?

The LS1023ACE9PQB combines dual 64‑bit ARM Cortex‑A53 processing with a comprehensive set of networking and peripheral interfaces to deliver a highly integrated communications processor for industrial and edge networking designs. Its hardware acceleration and DPAA architecture help offload packet processing tasks, while multi‑rate Ethernet and high‑speed I/O reduce system BOM and simplify layout.

This device is well suited to designers building compact routers, gateways, industrial controllers and security appliances who require industrial temperature operation, on‑chip security features and a compact FBGA package. The Layerscape-series architecture provides a clear upgrade path and design continuity for embedded networking platforms.

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