LS1023ACE9MQB
| Part Description |
ARM® Cortex®-A53 Microprocessor IC QorlQ LS1 2 Core, 64-Bit 1.2GHz 780-FBGA (23x23) |
|---|---|
| Quantity | 144 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LS1023A |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53 | Device Package | 780-FBGA (23x23) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 1GbE (4), 2.5GbE (2), 10GbE (1) | Graphics Acceleration | No | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 780-BFBGA, FCBGA | ||
| RAM Controllers | DDR3L, DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 6Gbps (1) | Security Features | ARM TZ, Boot Security | Speed | 1.2GHz | ||
| Supplier Device Package | 780-FBGA (23×23) | USB | USB 3.0 + PHY (3) |
Overview of LS1023ACE9MQB – LAYERSCAPE 64-BIT ARM CORTEX-A53
The LS1023ACE9MQB is a dual-core, 64-bit microprocessor in NXP’s Layerscape LS1023A family, built around ARM® Cortex®‑A53 cores running at 1.2 GHz. It is targeted at embedded networking and industrial applications that require integrated I/O, packet processing capabilities and industrial temperature qualification.
Designed for small-form-factor, fanless designs, the device combines processing performance, multi-protocol networking interfaces and on-chip security to support use cases such as edge routing, industrial control, IoT gateway and security appliances.
Key Features
- Processor Core — Dual ARM® Cortex®‑A53 64‑bit cores at 1.2 GHz for general-purpose application and control tasks.
- Memory — Integrated controllers for DDR3L and DDR4 memory to support system memory needs.
- Networking and SerDes — High‑speed multi‑protocol SerDes and a mix of Ethernet MACs: 1GbE (4), 2.5GbE (2) and 10GbE (1), suitable for multi‑port networking designs and frame management.
- Storage and USB — Single SATA 6 Gbps port and three USB 3.0 ports with PHY for high‑speed storage and peripheral connectivity.
- Security and Boot — ARM TrustZone (ARM TZ) and boot security features for hardware‑assisted trusted boot and secure execution.
- Peripheral Interfaces — I2C and other standard peripheral interfaces for board control and sensor connectivity.
- Industrial Qualification and Temperature Range — Industrial qualification with an operating temperature range of –40 °C to 105 °C for deployment in rugged environments.
- Package and Mounting — 780‑ball FCBGA (23 × 23) package, surface‑mount for compact board designs.
Typical Applications
- Branch and Edge Routers — Used as the processing and I/O hub for small‑form‑factor routers and network edge devices where multiple Ethernet interfaces and packet handling are required.
- vCPE and Edge Appliances — Suitable for virtualized CPE and edge service platforms that need general‑purpose CPU cores with integrated networking and security features.
- Multi‑protocol IoT Gateways — Enables protocol bridging and secure connectivity between field devices and cloud or enterprise networks.
- Industrial PLC and Control — Industrial temperature range and robust I/O options make it applicable for control systems and embedded industrial equipment.
- Security Appliances — On‑chip security features and frame processing capabilities support inline IPsec and other secure networking functions.
Unique Advantages
- Balanced Dual‑Core Performance: Dual 64‑bit Cortex‑A53 cores at 1.2 GHz provide a balance of compute capability and energy efficiency for embedded workloads.
- Comprehensive Networking I/O: Multiple Ethernet speeds (1GbE, 2.5GbE, 10GbE) plus SerDes lane support deliver flexible connectivity options for multi‑port networking designs.
- Integrated Storage and Peripheral Support: SATA 6 Gbps and three USB 3.0 ports simplify integration of high‑speed storage and peripherals, reducing external controller requirements.
- Hardware Security: ARM TrustZone and boot security features enable hardware‑assisted trusted boot and secure execution to help protect device firmware and data.
- Industrial‑Ready: Industrial qualification and a wide operating temperature range (–40 °C to 105 °C) enable deployment in harsh and industrial environments.
- Compact Package: 780‑ball FCBGA (23 × 23) footprint supports small, dense board layouts for space‑constrained designs.
Why Choose LS1023ACE9MQB?
The LS1023ACE9MQB positions itself as a compact, industrial‑qualified embedded processor offering a practical mix of dual‑core 64‑bit compute, extensive networking I/O and on‑chip security. It is well suited to designers building small‑form‑factor networking, industrial control and edge computing products that require integrated interfaces and reliable operation across a wide temperature range.
As part of the Layerscape LS1023A family from NXP Semiconductors, this device brings a focused feature set for edge and industrial applications—helping reduce BOM complexity, simplify board design and provide a clear upgrade path within the LS1023A product line.
Request a quote or submit an inquiry to learn more about availability, pricing and how the LS1023ACE9MQB can fit into your next embedded networking or industrial design.

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