LS1023ACE9MQB

LAYERSCAPE 64-BIT ARM CORTEX-A53
Part Description

ARM® Cortex®-A53 Microprocessor IC QorlQ LS1 2 Core, 64-Bit 1.2GHz 780-FBGA (23x23)

Quantity 144 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FBGA (23x23)ECCNN/A
Ethernet1GbE (4), 2.5GbE (2), 10GbE (1)Graphics AccelerationNoHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case780-BFBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 6Gbps (1)Security FeaturesARM TZ, Boot SecuritySpeed1.2GHz
Supplier Device Package780-FBGA (23×23)USBUSB 3.0 + PHY (3)

Overview of LS1023ACE9MQB – LAYERSCAPE 64-BIT ARM CORTEX-A53

The LS1023ACE9MQB is a dual-core, 64-bit microprocessor in NXP’s Layerscape LS1023A family, built around ARM® Cortex®‑A53 cores running at 1.2 GHz. It is targeted at embedded networking and industrial applications that require integrated I/O, packet processing capabilities and industrial temperature qualification.

Designed for small-form-factor, fanless designs, the device combines processing performance, multi-protocol networking interfaces and on-chip security to support use cases such as edge routing, industrial control, IoT gateway and security appliances.

Key Features

  • Processor Core — Dual ARM® Cortex®‑A53 64‑bit cores at 1.2 GHz for general-purpose application and control tasks.
  • Memory — Integrated controllers for DDR3L and DDR4 memory to support system memory needs.
  • Networking and SerDes — High‑speed multi‑protocol SerDes and a mix of Ethernet MACs: 1GbE (4), 2.5GbE (2) and 10GbE (1), suitable for multi‑port networking designs and frame management.
  • Storage and USB — Single SATA 6 Gbps port and three USB 3.0 ports with PHY for high‑speed storage and peripheral connectivity.
  • Security and Boot — ARM TrustZone (ARM TZ) and boot security features for hardware‑assisted trusted boot and secure execution.
  • Peripheral Interfaces — I2C and other standard peripheral interfaces for board control and sensor connectivity.
  • Industrial Qualification and Temperature Range — Industrial qualification with an operating temperature range of –40 °C to 105 °C for deployment in rugged environments.
  • Package and Mounting — 780‑ball FCBGA (23 × 23) package, surface‑mount for compact board designs.

Typical Applications

  • Branch and Edge Routers — Used as the processing and I/O hub for small‑form‑factor routers and network edge devices where multiple Ethernet interfaces and packet handling are required.
  • vCPE and Edge Appliances — Suitable for virtualized CPE and edge service platforms that need general‑purpose CPU cores with integrated networking and security features.
  • Multi‑protocol IoT Gateways — Enables protocol bridging and secure connectivity between field devices and cloud or enterprise networks.
  • Industrial PLC and Control — Industrial temperature range and robust I/O options make it applicable for control systems and embedded industrial equipment.
  • Security Appliances — On‑chip security features and frame processing capabilities support inline IPsec and other secure networking functions.

Unique Advantages

  • Balanced Dual‑Core Performance: Dual 64‑bit Cortex‑A53 cores at 1.2 GHz provide a balance of compute capability and energy efficiency for embedded workloads.
  • Comprehensive Networking I/O: Multiple Ethernet speeds (1GbE, 2.5GbE, 10GbE) plus SerDes lane support deliver flexible connectivity options for multi‑port networking designs.
  • Integrated Storage and Peripheral Support: SATA 6 Gbps and three USB 3.0 ports simplify integration of high‑speed storage and peripherals, reducing external controller requirements.
  • Hardware Security: ARM TrustZone and boot security features enable hardware‑assisted trusted boot and secure execution to help protect device firmware and data.
  • Industrial‑Ready: Industrial qualification and a wide operating temperature range (–40 °C to 105 °C) enable deployment in harsh and industrial environments.
  • Compact Package: 780‑ball FCBGA (23 × 23) footprint supports small, dense board layouts for space‑constrained designs.

Why Choose LS1023ACE9MQB?

The LS1023ACE9MQB positions itself as a compact, industrial‑qualified embedded processor offering a practical mix of dual‑core 64‑bit compute, extensive networking I/O and on‑chip security. It is well suited to designers building small‑form‑factor networking, industrial control and edge computing products that require integrated interfaces and reliable operation across a wide temperature range.

As part of the Layerscape LS1023A family from NXP Semiconductors, this device brings a focused feature set for edge and industrial applications—helping reduce BOM complexity, simplify board design and provide a clear upgrade path within the LS1023A product line.

Request a quote or submit an inquiry to learn more about availability, pricing and how the LS1023ACE9MQB can fit into your next embedded networking or industrial design.

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