LS1022AXE7EKB

IC MPU QORIQ 600MHZ 525FCPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 600MHz 525-FCPBGA (19x19)

Quantity 969 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1022A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package525-FCPBGA (19x19)
ECCNPENDING ECCNEthernetGbE (2)HTS Code0000.00.0000
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 105°CPackage / Case525-FBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesSecure Boot, TrustZone®Speed600MHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 (1)

Overview of LS1022AXE7EKB – IC MPU QorIQ 600MHz 525-FCPBGA

The LS1022AXE7EKB is an NXP QorIQ Layerscape microprocessor integrating dual ARM® Cortex®-A7 cores running at 600 MHz in a 525-FCPBGA (19×19) package. It is designed for industrial and power-sensitive networking and embedded applications that require a compact, secure, and highly integrated processor.

With dual 32-bit cores, ECC-protected caches, hardware security features and a broad set of high-speed I/O options, this device targets routers, controllers, security appliances, IoT gateways and other industrial networking endpoints where integration, efficiency and robustness are important.

Key Features

  • Core & Cache  Dual ARM® Cortex®-A7 32-bit cores at 600 MHz with ECC-protected L1 and L2 caches. Each core includes 32 KB L1 instruction and 32 KB L1 data cache, sharing up to 512 KB coherent L2 cache.
  • Co-processors  Integrated NEON™ SIMD and dual-precision floating-point unit (FPU) for multimedia and accelerated signal processing.
  • Memory  On-chip memory controllers supporting DDR3L and DDR4; datasheet notes LS1022A operation with DDR3L up to 1,033 MHz.
  • Networking & Storage Interfaces  Two Gigabit Ethernet ports and one SATA 3 Gbps controller provide wired networking and local storage connectivity.
  • USB & Peripheral I/O  One USB 2.0 controller plus multiple serial interfaces; series documentation also indicates multi-channel SPI and I2C availability for common peripheral connectivity.
  • High-speed SerDes  Series-level documentation describes a multi-protocol, multi-lane SerDes for high-speed interconnects and flexible system integration.
  • Security  Secure Boot and ARM TrustZone® support for hardware-backed platform security and trusted execution environments.
  • Reliability & Qualification  Industrial qualification with operating temperature range −40 °C to 105 °C and RoHS compliance.
  • Package & Mounting  525-FCPBGA (19×19) surface-mount package suitable for compact embedded designs.
  • Low-power Operation  Series-level design targets highly integrated, power-efficient operation (series documentation indicates integration under 3 W for the family).

Typical Applications

  • Enterprise and Access Point Routers  Dual-core processing and multiple GbE interfaces enable control-plane and data-plane tasks for 802.11ac/n access points and small routers.
  • I/O Line Cards and Controllers  Compact package and diverse serial/peripheral I/O make the device suitable for line cards, I/O controllers and protocol translation modules.
  • Security Appliances  Hardware security features like Secure Boot and TrustZone® support trusted boot and secure partitioning in network security appliances.
  • IoT Gateways and Edge Nodes  Integrated networking, storage and peripheral interfaces are suited to gateway functions, data aggregation and local edge processing.
  • Industrial Automation  Industrial temperature qualification and flexible connectivity support controllers and automation endpoints in building and energy systems.

Unique Advantages

  • Dual-core ARM Cortex-A7 Architecture: Enables parallel application and networking tasks while keeping power and BOM costs low.
  • ECC-protected Caches: L1 and L2 ECC protection enhances system reliability for industrial and networking deployments.
  • Integrated Security: Secure Boot and TrustZone® provide hardware-assisted mechanisms for secure system initialization and trusted execution.
  • Broad I/O Integration: On-chip GbE, SATA and USB plus serial interfaces reduce external chipset requirements and simplify PCB design.
  • Industrial Temperature Range: Rated −40 °C to 105 °C for deployment in demanding environmental conditions.
  • Compact BGA Package: 525-FCPBGA (19×19) enables space-constrained designs while providing a high pin count for system-level connectivity.

Why Choose LS1022AXE7EKB?

The LS1022AXE7EKB positions itself as a compact, industrial-grade embedded processor that balances dual-core compute, integrated security and a wide set of networking and peripheral interfaces. Its ECC-protected caches, TrustZone® support and industrial temperature rating make it suitable for robust embedded networking and control applications where reliability and secure operation matter.

This part is appropriate for designers building space- and power-conscious systems—such as gateways, routers, controllers and industrial endpoints—who need a tightly integrated processor with proven ARM-based cores and a strong set of connectivity options to minimize BOM and simplify system design.

Request a quote or submit an inquiry to obtain pricing, availability and specification support for LS1022AXE7EKB.

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