Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
RM48L952DPGETRM48L952DPGETTexas InstrumentsIC MCU 16/32BIT 3MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
365
RM48L952DZWTTRM48L952DZWTTTexas InstrumentsIC MCU 16/32B 3MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,666
RM48L952PGETRM48L952PGETTexas InstrumentsIC MCU 16/32BIT 3MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
232
RM48L952ZWTTRM48L952ZWTTTexas InstrumentsIC MCU 16/32B 3MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,341
N/AN/ARM5231A-350P-B002Microchip TechnologyIC MPU 350MHZMicroprocessors-N/A–
Core Processor:
MIPS RISC
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
350MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
744
RM57L843BZWTTRM57L843BZWTTTexas InstrumentsIC MCU 16/32B 4MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
16/32-Bit
Speed:
330MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
145
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 57×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
388
N/ARM7035C-466L-D004Renesas64-Bit MIPS RISC MicroprocessorsMicroprocessorsN/AN/A0 °C – 70 °C
Speed:
466 MHz
Voltage – I/O:
3.3 V
Core Processor:
MIPS RM7000
Number of Cores/Bus Width:
1 Core, 64-Bit
Graphics Acceleration:
No
Qualification:
Consumer
174
N/AN/ARM7035C-600L-D004Microchip TechnologyIC MPU 600MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
36
N/AN/ARM7065C-466G-D004Microchip TechnologyIC MPU 466MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
466MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
673
N/AN/ARM7065C-600G-D004Microchip TechnologyIC MPU 600MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
17
RN-SRL-FTD5V-DGLRN-SRL-FTD5V-DGLMicrochip TechnologyIC CONTROLLER USB MODULEControllersModule5V-40°C ~ 85°C
Protocol:
USB
Function:
Bridge, USB to UART
Interface:
UART
Standards:
USB 2.0
Voltage – Supply:
5V
Operating Temperature:
-40°C ~ 85°C
Supplier Device Package:
Module
600
RN-SRL-PRO3V-DGLRN-SRL-PRO3V-DGLMicrochip TechnologyIC CONTROLLER USB MODULEControllersModule3.3V-40°C ~ 85°C
Protocol:
USB
Function:
Bridge, USB to UART
Interface:
UART
Standards:
USB 2.0
Voltage – Supply:
3.3V
Operating Temperature:
-40°C ~ 85°C
Supplier Device Package:
Module
1,459
N/ARN80532KC041512IntelIC MPU INTEL XEON 2GHZ 603MPGAMicroprocessors603-mPGA (53.34x53.34)N/A70°C (TC)
Core Processor:
Intel® Xeon® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2GHz
Graphics Acceleration:
No
Voltage – I/O:
1.5V
Operating Temperature:
70°C (TC)
Mounting Type:
Through Hole
Package / Case:
603-BFCPGA
Supplier Device Package:
603-mPGA (53.34×53.34)
Grade:
Commercial
712
N/ARN80532KC056512IntelIC MPU INTEL XEON 2.4GHZ 603PPGAMicroprocessors603-PPGAN/A74°C (TC)
Core Processor:
Intel® Xeon® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2.4GHz
Voltage – I/O:
1.475V
Operating Temperature:
74°C (TC)
Mounting Type:
Through Hole
Package / Case:
603-PGA
Supplier Device Package:
603-PPGA
Grade:
Commercial
1,327
RNG90-MAVDA-TRNG90-MAVDA-TMicrochip TechnologyIC AUTHENTICATION CHIP 8UDFNMicroprocessors8-UDFN (2x3)N/A-40 °C – 105 °C (TA)
Speed:
400 kHz
Voltage – I/O:
1.65 V – 5.5 V
Grade:
Industrial
Graphics Acceleration:
No
1,597
N/ARNG90-SSVDA-TMicrochip TechnologyIC AUTHENTICATION CHIP 8-SOICMicroprocessors8-SOICN/A-40 °C – 105 °C (TA)
Speed:
400 kHz
Voltage – I/O:
1.65 V – 5.5 V
Grade:
Industrial
Graphics Acceleration:
No
1,515
N/ARPIXP2400BATIntelIC MPU INTEL 600MHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2400
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR SDRAM, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Grade:
Industrial
189
N/ARPIXP2800BAIntelIC MPU IXP2800 1GHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2800
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
3DES, AES, SHA-1
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Grade:
Industrial
139
N/ARPIXP2800BBIntelIC MPU IXP2800 1.4GHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2800
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
3DES, AES, SHA-1
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Grade:
Industrial
192
N/ART4G150-1CBG1657PROTOMicrochip TechnologyRT4G150-1CBG1657PROTOFPGAs1657-CBGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
1,003

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