Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/ASTM32MP135FAF7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors320-TFBGA (11x11)N/A-40 °C – 105 °C
Speed:
1 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
471
N/ASTM32MP135FAF7TSTMicroelectronicsLinear IC'sMicroprocessors320-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
320-TFBGA
Supplier Device Package:
320-TFBGA (11×11)
Grade:
Industrial
1,823
N/ASTM32MP135FAG7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors289-TFBGA (9x9)N/A-40 °C – 105 °C
Speed:
1 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
964
N/ASTM32MP135FAG7TSTMicroelectronicsLinear IC'sMicroprocessors289-TFBGA (9x9)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-TFBGA
Supplier Device Package:
289-TFBGA (9×9)
Grade:
Industrial
40
STM32MP151AAA3STM32MP151AAA3STMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Grade:
Automotive
645
STM32MP151AAA3TSTM32MP151AAA3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Grade:
Automotive
1,098
STM32MP151AAB3STM32MP151AAB3STMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Grade:
Automotive
1,434
STM32MP151AAB3TSTM32MP151AAB3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Grade:
Automotive
457
STM32MP151AAC3STM32MP151AAC3STMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Grade:
Automotive
201
STM32MP151AAC3TSTM32MP151AAC3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Grade:
Automotive
1,749
STM32MP151AAD3STM32MP151AAD3STMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Grade:
Automotive
1,257
STM32MP151AAD3TSTM32MP151AAD3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Grade:
Automotive
1,130
STM32MP151CAA3STM32MP151CAA3STMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Grade:
Automotive
651
STM32MP151CAA3TSTM32MP151CAA3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Grade:
Automotive
1,992
STM32MP151CAB3STM32MP151CAB3STMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Grade:
Automotive
877
STM32MP151CAB3TSTM32MP151CAB3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Grade:
Automotive
236
STM32MP151CAC3STM32MP151CAC3STMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Grade:
Automotive
1,504
STM32MP151CAC3TSTM32MP151CAC3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Grade:
Automotive
270
STM32MP151CAD3STM32MP151CAD3STMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Grade:
Automotive
880
STM32MP151CAD3TSTM32MP151CAD3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Grade:
Automotive
821

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