Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/ASTM32MP133DAE7TSTMicroelectronicsLinear IC'sMicroprocessors289-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-LFBGA (14×14)
Grade:
Industrial
485
N/ASTM32MP133DAF7STMicroelectronicsLinear IC'sMicroprocessors320-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
320-TFBGA
Supplier Device Package:
320-TFBGA (11×11)
Grade:
Industrial
379
N/ASTM32MP133DAG7STMicroelectronicsLinear IC'sMicroprocessors289-TFBGA (9x9)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-TFBGA
Supplier Device Package:
289-TFBGA (9×9)
Grade:
Industrial
966
N/ASTM32MP133DAG7TSTMicroelectronicsLinear IC'sMicroprocessors289-TFBGA (9x9)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-TFBGA
Supplier Device Package:
289-TFBGA (9×9)
Grade:
Industrial
929
N/ASTM32MP133FAE7STMicroelectronicsLinear IC'sMicroprocessors289-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-LFBGA (14×14)
Grade:
Industrial
331
N/ASTM32MP133FAF7STMicroelectronicsLinear IC'sMicroprocessors320-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
320-TFBGA
Supplier Device Package:
320-TFBGA (11×11)
Grade:
Industrial
1,037
N/ASTM32MP133FAG7STMicroelectronicsLinear IC'sMicroprocessors289-TFBGA (9x9)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-TFBGA
Supplier Device Package:
289-TFBGA (9×9)
Grade:
Industrial
886
N/ASTM32MP135AAE3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors289-LFBGA (14x14)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
717
N/ASTM32MP135AAF3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors320-TFBGA (11x11)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
1,876
N/ASTM32MP135AAG3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors289-TFBGA (9x9)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
311
N/ASTM32MP135CAE3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors289-LFBGA (14x14)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
1,328
N/ASTM32MP135CAF3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors320-TFBGA (11x11)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
1,176
N/ASTM32MP135CAF3TSTMicroelectronicsLinear IC'sMicroprocessors320-TFBGA (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
320-TFBGA
Supplier Device Package:
320-TFBGA (11×11)
Grade:
Automotive
473
N/ASTM32MP135CAG3STMicroelectronics32-BIT ARM CORTEX-A7 650MHZ MPUMicroprocessors289-TFBGA (9x9)N/A-40 °C – 125 °C
Speed:
650 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Automotive
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
1,263
N/ASTM32MP135DAE7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors289-LFBGA (14x14)N/A-40 °C – 105 °C
Speed:
1 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
1,944
N/ASTM32MP135DAF7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors320-TFBGA (11x11)N/A-40 °C – 105 °C
Speed:
1 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
214
N/ASTM32MP135DAF7TSTMicroelectronicsLinear IC'sMicroprocessors320-TFBGA (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
320-TFBGA
Supplier Device Package:
320-TFBGA (11×11)
Grade:
Industrial
1,482
N/ASTM32MP135DAG7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors289-TFBGA (9x9)N/A-40 °C – 105 °C
Speed:
1 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
NEON™ SIMD
Display & Interface Controllers:
LCD
569
N/ASTM32MP135FAE7STMicroelectronics32-BIT ARM CORTEX-A7 900MHZ MPUMicroprocessors289-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-LFBGA (14×14)
Grade:
Industrial
446
N/ASTM32MP135FAE7TSTMicroelectronicsLinear IC'sMicroprocessors289-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-LFBGA (14×14)
Grade:
Industrial
789

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