STM32MP135CAF3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 650MHz 320-TFBGA (11x11) |
|---|---|
| Quantity | 683 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP135 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 320-TFBGA (11x11) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 320-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | Speed | 650MHz | Supplier Device Package | 320-TFBGA (11×11) | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of STM32MP135CAF3T – ARM® Cortex®-A7 Microprocessor, 650 MHz
The STM32MP135CAF3T is an ARM® Cortex®-A7 microprocessor IC delivering a single 32‑bit core at 650 MHz in a compact 320‑TFBGA (11×11) package. It targets embedded applications that require integrated connectivity, multimedia acceleration and a broad set of security features.
With on‑chip support for multiple memory types, high‑speed Ethernet, USB and CANbus interfaces, this device provides a highly integrated foundation for embedded systems that combine networking, display and secure processing.
Key Features
- Core – ARM® Cortex®‑A7 single core, 32‑bit, 650 MHz processing for general embedded application workloads.
- Memory Controllers – Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match application memory performance and power profiles.
- Multimedia Acceleration – Includes multimedia co‑processors and NEON™ SIMD support for media and signal processing tasks.
- Display – Integrated LCD display controller for driving user interfaces and on‑device displays.
- High‑Speed Networking – Dual 10/100/1000 Mbps Ethernet controllers for robust wired connectivity and networking applications.
- USB Connectivity – Two USB 2.0 ports to support peripheral and host connectivity options.
- Automotive Grade Listing – Device grade is listed as Automotive in the product data.
- Security – Comprehensive security feature set including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA‑1/2, tamper detection, TRNG and volatile key storage.
- Additional Interfaces – CANbus interface for control‑oriented networking and integration with vehicle or industrial buses.
- Package & Mounting – 320‑TFBGA package (11×11 mm) with surface‑mount mounting type for compact board integration.
- Operating Temperature – Rated for operation from −40 °C to 125 °C.
Typical Applications
- Embedded Networking – Devices requiring dual Gigabit Ethernet and USB connectivity for industrial or connectivity‑centric systems.
- Human‑Machine Interfaces – Systems combining LCD display control and multimedia acceleration for responsive user interfaces.
- Control and Telemetry – Embedded controllers utilizing CANbus alongside general processing and security features for secure data handling.
Unique Advantages
- Integrated Connectivity: Dual Gigabit Ethernet, two USB 2.0 ports and CANbus reduce the need for external controllers and simplify system architecture.
- Memory Flexibility: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables designers to choose the optimal memory type for cost, performance and power tradeoffs.
- Security‑Rich Platform: Built‑in AES, TrustZone, secure boot, cryptography and TRNG capabilities help protect firmware, keys and runtime data.
- Compact Packaging: 320‑TFBGA (11×11) surface‑mount package enables space‑constrained board designs while providing a high pin count.
- Wide Operating Range: −40 °C to 125 °C rating supports deployment in demanding temperature environments.
Why Choose STM32MP135CAF3T?
The STM32MP135CAF3T combines a 650 MHz ARM® Cortex®‑A7 core with a broad mix of connectivity, memory support and security building blocks to address embedded designs that need integrated networking, display and secure processing. Its package density and peripheral set make it suitable for compact, feature‑rich products.
Designers seeking a single‑chip foundation for connected, multimedia‑enabled embedded devices will find the STM32MP135CAF3T offers a balance of performance, interfaces and on‑chip security to simplify integration and accelerate time to market.
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