STM32MP135AAF3
| Part Description |
32-BIT ARM CORTEX-A7 650MHZ MPU |
|---|---|
| Quantity | 1,915 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP135 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 320-TFBGA (11x11) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Automotive | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40 °C – 125 °C | Package / Case | 320-TFBGA | RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Speed | 650 MHz | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of STM32MP135AAF3 – 32-BIT ARM CORTEX-A7 650MHZ MPU
The STM32MP135AAF3 is a microprocessor IC based on a single ARM® Cortex®-A7 core running at 650 MHz, designed for embedded applications. It integrates a range of peripheral interfaces and on-chip security features to support connected, secure embedded designs that require moderate application processing and system integration.
With multi-standard memory controller support and wired networking interfaces, this device targets embedded systems that need Ethernet connectivity, peripheral I/O, and hardware security primitives while operating across a wide temperature range.
Key Features
- Core – ARM® Cortex®-A7 single 32-bit core at 650 MHz with NEON™ SIMD for DSP acceleration.
- Memory Controllers – Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible DRAM choices.
- Connectivity – Dual Gigabit Ethernet interfaces (10/100/1000 Mbps) and two USB 2.0 ports provide wired networking and host/device connectivity; additional CANbus interface is available.
- Display – Integrated LCD display interface controller for basic display subsystem integration.
- Security – On-chip security features including AES, ARM TrustZone, boot security, cryptography, secure debug protections, SHA-1/2, tamper detection, a true random number generator (TRNG) and volatile key storage.
- Package & Mounting – 320-TFBGA (11×11) package for surface-mount assembly.
- Environmental & Reliability – Operating temperature range from −40 °C to 125 °C and RoHS-compliant status.
- Other Characteristics – Grade listed as Automotive and graphics acceleration: No.
Typical Applications
- Embedded control systems – Single-core Cortex-A7 performance with NEON SIMD and multiple memory options supports control and application tasks in embedded products.
- Networked devices – Dual 10/100/1000 Mbps Ethernet ports enable wired networking functions for gateways, controllers or industrial communication modules.
- Human-machine interfaces – LCD display controller and USB interfaces allow creation of basic user interfaces and peripheral connectivity.
- Secure edge processing – Integrated AES, TrustZone and hardware cryptography features support secure boot and data protection in connected devices.
Unique Advantages
- Balanced compute and DSP acceleration: 650 MHz Cortex-A7 core with NEON SIMD provides application processing plus SIMD acceleration for signal processing tasks.
- Flexible memory support: Native controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 give design flexibility across performance and power targets.
- Integrated wired connectivity: Two Gigabit Ethernet ports plus USB 2.0 and CANbus reduce external components for networked embedded systems.
- Comprehensive on-chip security: A broad set of security features (AES, TrustZone, SHA-1/2, TRNG, secure debug and boot security) helps protect platform integrity and keys.
- Wide operating temperature: −40 °C to 125 °C range supports deployment in thermally demanding environments.
- Compact, surface-mount package: 320-TFBGA (11×11) simplifies board-level integration in space-constrained designs.
Why Choose STM32MP135AAF3?
The STM32MP135AAF3 positions itself as a single-core embedded microprocessor offering a mix of application performance, integrated connectivity and extensive on-chip security primitives. Its support for multiple DRAM standards and dual Gigabit Ethernet interfaces makes it suitable for designs that require flexible memory choices and robust wired networking options.
Designers seeking a compact, surface-mount solution with a wide operating temperature range and hardware security capabilities will find the STM32MP135AAF3 a practical option for embedded and connected applications where these specific feature sets are required.
Request a quote or submit an inquiry to start procurement for the STM32MP135AAF3 and evaluate it for your next embedded design.

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