STM32MP135AAG3
| Part Description |
32-BIT ARM CORTEX-A7 650MHZ MPU |
|---|---|
| Quantity | 497 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP135 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-TFBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Automotive | Graphics Acceleration | No | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40 °C – 125 °C | Package / Case | 289-TFBGA | RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Speed | 650 MHz | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of STM32MP135AAG3 – 32-BIT ARM CORTEX-A7 650MHZ MPU
The STM32MP135AAG3 is a 32-bit microprocessor IC based on a single ARM® Cortex®-A7 core running at 650 MHz. It targets embedded applications that require a balance of processing capability, flexible memory support and integrated connectivity.
Designed for embedded systems, this device combines a Cortex-A7 core with NEON™ SIMD support, multiple memory controller options, wired networking and a comprehensive set of security features to address connectivity and system protection requirements.
Key Features
- Core Single ARM® Cortex®-A7 core operating at 650 MHz with 32-bit bus width for general-purpose embedded processing.
- Data Processing Acceleration NEON™ SIMD co-processor support for accelerated media and signal processing workloads.
- Memory Controllers Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types, providing flexibility for different memory performance and power trade-offs.
- Connectivity Two 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 interfaces for high-bandwidth wired networking and peripheral connectivity. Additional CANbus interface for automotive or industrial networks.
- Display Interface Integrated LCD display interface controller for driving panel-based user interfaces.
- Security Features Built-in AES, ARM TrustZone (TZ), boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG and volatile key storage to help protect code and data.
- Package and Mounting 289-TFBGA (9×9) package in a surface-mount form factor for compact board designs.
- Operating Range Specified operating temperature range from −40 °C to 125 °C for deployment across wide-temperature environments.
- Grade Specified grade: Automotive.
- Environmental Compliance RoHS status: Compliant.
- Graphics No graphics acceleration.
Typical Applications
- Industrial Networking Dual Gigabit Ethernet and CANbus support enable robust wired communication for industrial gateways and controllers.
- Embedded Control Systems Single-core Cortex-A7 processing with NEON™ SIMD and multiple memory options supports control, signal processing and local data handling tasks.
- Human–Machine Interfaces Integrated LCD controller provides a platform for panel-based interfaces in equipment and appliances.
- Secure Edge Devices Extensive security feature set (AES, TrustZone, secure boot, TRNG, SHA) helps protect firmware and sensitive data in connected devices.
Unique Advantages
- Balanced processing performance: 650 MHz Cortex-A7 core provides efficient general-purpose performance for embedded workloads.
- Flexible memory support: Compatibility with DDR3, DDR3L, LPDDR2 and LPDDR3 allows designers to choose memory optimized for cost, speed or power.
- Rich wired connectivity: Two Gigabit Ethernet interfaces plus USB 2.0 and CANbus support enable high-throughput networking and fieldbus integration.
- Comprehensive security suite: Multiple hardware security primitives including AES, TrustZone, secure boot and TRNG reduce integration effort for protected applications.
- Wide operating temperature: −40 °C to 125 °C range supports deployment in demanding thermal environments.
- Compact BGA package: 289-TFBGA (9×9) provides a small footprint for dense board layouts.
Why Choose STM32MP135AAG3?
The STM32MP135AAG3 positions itself as a versatile embedded microprocessor combining an ARM® Cortex®-A7 core, NEON™ SIMD support and broad connectivity options. Its integrated security features and flexible memory controller choices make it suitable for designs that require connected, protected processing in a compact package.
This device is well suited for engineers building embedded systems that need wired networking, secure boot and cryptographic capabilities, and a compact surface-mount package. RoHS compliance and a wide operating temperature range support deployment across a variety of environmental conditions.
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