STM32MP135AAG3

32-BIT ARM CORTEX-A7 650MHZ MPU
Part Description

32-BIT ARM CORTEX-A7 650MHZ MPU

Quantity 497 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP135
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPNEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-TFBGA (9x9)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationNoHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40 °C – 125 °CPackage / Case289-TFBGARAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSpeed650 MHz
USBUSB 2.0 (2)Voltage – I/O1.8 V – 3.3 V

Overview of STM32MP135AAG3 – 32-BIT ARM CORTEX-A7 650MHZ MPU

The STM32MP135AAG3 is a 32-bit microprocessor IC based on a single ARM® Cortex®-A7 core running at 650 MHz. It targets embedded applications that require a balance of processing capability, flexible memory support and integrated connectivity.

Designed for embedded systems, this device combines a Cortex-A7 core with NEON™ SIMD support, multiple memory controller options, wired networking and a comprehensive set of security features to address connectivity and system protection requirements.

Key Features

  • Core  Single ARM® Cortex®-A7 core operating at 650 MHz with 32-bit bus width for general-purpose embedded processing.
  • Data Processing Acceleration  NEON™ SIMD co-processor support for accelerated media and signal processing workloads.
  • Memory Controllers  Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types, providing flexibility for different memory performance and power trade-offs.
  • Connectivity  Two 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 interfaces for high-bandwidth wired networking and peripheral connectivity. Additional CANbus interface for automotive or industrial networks.
  • Display Interface  Integrated LCD display interface controller for driving panel-based user interfaces.
  • Security Features  Built-in AES, ARM TrustZone (TZ), boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG and volatile key storage to help protect code and data.
  • Package and Mounting  289-TFBGA (9×9) package in a surface-mount form factor for compact board designs.
  • Operating Range  Specified operating temperature range from −40 °C to 125 °C for deployment across wide-temperature environments.
  • Grade  Specified grade: Automotive.
  • Environmental Compliance  RoHS status: Compliant.
  • Graphics  No graphics acceleration.

Typical Applications

  • Industrial Networking  Dual Gigabit Ethernet and CANbus support enable robust wired communication for industrial gateways and controllers.
  • Embedded Control Systems  Single-core Cortex-A7 processing with NEON™ SIMD and multiple memory options supports control, signal processing and local data handling tasks.
  • Human–Machine Interfaces  Integrated LCD controller provides a platform for panel-based interfaces in equipment and appliances.
  • Secure Edge Devices  Extensive security feature set (AES, TrustZone, secure boot, TRNG, SHA) helps protect firmware and sensitive data in connected devices.

Unique Advantages

  • Balanced processing performance: 650 MHz Cortex-A7 core provides efficient general-purpose performance for embedded workloads.
  • Flexible memory support: Compatibility with DDR3, DDR3L, LPDDR2 and LPDDR3 allows designers to choose memory optimized for cost, speed or power.
  • Rich wired connectivity: Two Gigabit Ethernet interfaces plus USB 2.0 and CANbus support enable high-throughput networking and fieldbus integration.
  • Comprehensive security suite: Multiple hardware security primitives including AES, TrustZone, secure boot and TRNG reduce integration effort for protected applications.
  • Wide operating temperature: −40 °C to 125 °C range supports deployment in demanding thermal environments.
  • Compact BGA package: 289-TFBGA (9×9) provides a small footprint for dense board layouts.

Why Choose STM32MP135AAG3?

The STM32MP135AAG3 positions itself as a versatile embedded microprocessor combining an ARM® Cortex®-A7 core, NEON™ SIMD support and broad connectivity options. Its integrated security features and flexible memory controller choices make it suitable for designs that require connected, protected processing in a compact package.

This device is well suited for engineers building embedded systems that need wired networking, secure boot and cryptographic capabilities, and a compact surface-mount package. RoHS compliance and a wide operating temperature range support deployment across a variety of environmental conditions.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the STM32MP135AAG3.

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