STM32MP135CAF3

32-BIT ARM CORTEX-A7 650MHZ MPU
Part Description

32-BIT ARM CORTEX-A7 650MHZ MPU

Quantity 1,359 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP135
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPNEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package320-TFBGA (11x11)
Display & Interface ControllersLCDECCN5A992CEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40 °C – 125 °CPackage / Case320-TFBGARAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSpeed650 MHz
USBUSB 2.0 (2)Voltage – I/O1.8 V – 3.3 V

Overview of STM32MP135CAF3 – 32-BIT ARM CORTEX-A7 650MHZ MPU

The STM32MP135CAF3 is a single-core microprocessor IC based on an ARM® Cortex®-A7 core running at 650 MHz. It integrates a 32-bit processing core with SIMD DSP (NEON™) and multiple memory and peripheral controllers aimed at embedded microprocessor applications.

Key value is in on-chip integration of memory interfaces, wired networking, USB connectivity, and a broad set of security features, presented in a 320-TFBGA surface-mount package with extended temperature capability.

Key Features

  • Core and Performance — ARM® Cortex®-A7 single core, 32-bit, operating at 650 MHz with NEON™ SIMD support for cost-effective integer and SIMD-accelerated workloads.
  • Memory Controllers — Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of external memory choices and bandwidth needs.
  • Networking and Connectivity — Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 ports provide wired networking and host/device connectivity options.
  • Additional Interfaces — CANbus interface and LCD display controller support for vehicle networks and display-driven embedded systems.
  • Security Features — Comprehensive security suite including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG, and volatile key storage to enable hardware-assisted security functions.
  • Package and Mounting — 320-TFBGA (11×11) package with surface-mount mounting for compact board-level integration.
  • Operating Temperature — Specified operating range from −40 °C to 125 °C for use in designs with extended temperature requirements.
  • Regulatory — RoHS compliant.
  • Graphics — No graphics acceleration included.

Typical Applications

  • Embedded Control Systems — Single-core 32-bit processing with NEON SIMD for control, signal processing, and application-level tasks in embedded devices.
  • Industrial Networking — Dual Gigabit Ethernet ports for high-throughput wired networking in industrial communications equipment.
  • Connected Devices — USB 2.0 ports and CANbus support enable implementation in connected sensor hubs, gateways, and device controllers.
  • Display-Driven Interfaces — Integrated LCD controller for user interfaces and local display requirements.

Unique Advantages

  • Balanced processing and SIMD acceleration: 650 MHz Cortex-A7 core with NEON™ SIMD supports compute and signal tasks without adding multiple cores.
  • Flexible memory support: Built-in controllers for DDR3/DDR3L and LPDDR2/LPDDR3 give designers options for performance and power trade-offs.
  • High-bandwidth networking: Two 10/100/1000 Mbps Ethernet ports enable redundant or dual-network configurations and high-throughput data paths.
  • Comprehensive security stack: Hardware features such as AES, TrustZone, TRNG and secure debug provide foundations for protected boot and cryptographic operations.
  • Extended temperature range: Operation from −40 °C to 125 °C supports deployment in thermal environments outside standard commercial ranges.
  • Compact package: 320-TFBGA (11×11) surface-mount package facilitates high-density board designs.

Why Choose STM32MP135CAF3?

STM32MP135CAF3 combines a 650 MHz ARM® Cortex®-A7 core with NEON™ SIMD, broad memory interface support, dual Gigabit Ethernet, USB connectivity, and a wide security feature set in a compact 320-TFBGA package. This combination positions the device for embedded designs that require integrated networking, security, and a flexible memory interface while maintaining a small board footprint.

The device suits teams building embedded microprocessor systems that need predictable single-core performance, hardware security primitives, and multiple wired connectivity options, offering a clear upgrade path in systems where these exact interfaces and temperature range are required.

Request a quote or submit an inquiry to receive pricing and availability for STM32MP135CAF3. Our sales team can provide lead-time information and support for procurement and design-in questions.

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