STM32MP135CAF3
| Part Description |
32-BIT ARM CORTEX-A7 650MHZ MPU |
|---|---|
| Quantity | 1,359 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP135 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 320-TFBGA (11x11) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Automotive | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40 °C – 125 °C | Package / Case | 320-TFBGA | RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Speed | 650 MHz | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of STM32MP135CAF3 – 32-BIT ARM CORTEX-A7 650MHZ MPU
The STM32MP135CAF3 is a single-core microprocessor IC based on an ARM® Cortex®-A7 core running at 650 MHz. It integrates a 32-bit processing core with SIMD DSP (NEON™) and multiple memory and peripheral controllers aimed at embedded microprocessor applications.
Key value is in on-chip integration of memory interfaces, wired networking, USB connectivity, and a broad set of security features, presented in a 320-TFBGA surface-mount package with extended temperature capability.
Key Features
- Core and Performance — ARM® Cortex®-A7 single core, 32-bit, operating at 650 MHz with NEON™ SIMD support for cost-effective integer and SIMD-accelerated workloads.
- Memory Controllers — Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of external memory choices and bandwidth needs.
- Networking and Connectivity — Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 ports provide wired networking and host/device connectivity options.
- Additional Interfaces — CANbus interface and LCD display controller support for vehicle networks and display-driven embedded systems.
- Security Features — Comprehensive security suite including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG, and volatile key storage to enable hardware-assisted security functions.
- Package and Mounting — 320-TFBGA (11×11) package with surface-mount mounting for compact board-level integration.
- Operating Temperature — Specified operating range from −40 °C to 125 °C for use in designs with extended temperature requirements.
- Regulatory — RoHS compliant.
- Graphics — No graphics acceleration included.
Typical Applications
- Embedded Control Systems — Single-core 32-bit processing with NEON SIMD for control, signal processing, and application-level tasks in embedded devices.
- Industrial Networking — Dual Gigabit Ethernet ports for high-throughput wired networking in industrial communications equipment.
- Connected Devices — USB 2.0 ports and CANbus support enable implementation in connected sensor hubs, gateways, and device controllers.
- Display-Driven Interfaces — Integrated LCD controller for user interfaces and local display requirements.
Unique Advantages
- Balanced processing and SIMD acceleration: 650 MHz Cortex-A7 core with NEON™ SIMD supports compute and signal tasks without adding multiple cores.
- Flexible memory support: Built-in controllers for DDR3/DDR3L and LPDDR2/LPDDR3 give designers options for performance and power trade-offs.
- High-bandwidth networking: Two 10/100/1000 Mbps Ethernet ports enable redundant or dual-network configurations and high-throughput data paths.
- Comprehensive security stack: Hardware features such as AES, TrustZone, TRNG and secure debug provide foundations for protected boot and cryptographic operations.
- Extended temperature range: Operation from −40 °C to 125 °C supports deployment in thermal environments outside standard commercial ranges.
- Compact package: 320-TFBGA (11×11) surface-mount package facilitates high-density board designs.
Why Choose STM32MP135CAF3?
STM32MP135CAF3 combines a 650 MHz ARM® Cortex®-A7 core with NEON™ SIMD, broad memory interface support, dual Gigabit Ethernet, USB connectivity, and a wide security feature set in a compact 320-TFBGA package. This combination positions the device for embedded designs that require integrated networking, security, and a flexible memory interface while maintaining a small board footprint.
The device suits teams building embedded microprocessor systems that need predictable single-core performance, hardware security primitives, and multiple wired connectivity options, offering a clear upgrade path in systems where these exact interfaces and temperature range are required.
Request a quote or submit an inquiry to receive pricing and availability for STM32MP135CAF3. Our sales team can provide lead-time information and support for procurement and design-in questions.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018