STM32MP135CAG3
| Part Description |
32-BIT ARM CORTEX-A7 650MHZ MPU |
|---|---|
| Quantity | 1,738 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP135 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-TFBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Automotive | Graphics Acceleration | No | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40 °C – 125 °C | Package / Case | 289-TFBGA | RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | Speed | 650 MHz | ||
| USB | USB 2.0 (2) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of STM32MP135CAG3 – 32-BIT ARM CORTEX-A7 650MHZ MPU
The STM32MP135CAG3 is a 32-bit microprocessor IC from STMicroelectronics based on an ARM® Cortex®-A7 core running at 650 MHz. It targets embedded applications that require a single 32-bit application core with integrated memory controllers, multiple wired communications interfaces and a broad set of security features.
With support for common DDR memory types, dual Gigabit Ethernet and multiple USB ports, the device is positioned for networked and secure embedded designs that operate across a wide temperature range.
Key Features
- Core Single ARM® Cortex®-A7 core, 32-bit, operating at 650 MHz for application processing.
- SIMD Acceleration NEON™ SIMD co-processor support for vector and DSP-style operations.
- Memory Controllers Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of system memory options.
- Networking Interfaces Two 10/100/1000 Mbps Ethernet controllers for high-throughput wired network connectivity.
- USB Connectivity Two USB 2.0 ports for peripheral and host connectivity.
- Display Interface LCD display controller for basic display integration.
- Additional I/O CANbus interface for controller-area-network connectivity in embedded systems.
- Security Features On-chip security capabilities including AES, ARM TrustZone, boot security, cryptography engines, secure debug, SHA-1/2, tamper detection, TRNG and volatile key storage.
- Package & Mounting Supplied in a 289-TFBGA (9×9) package for surface-mount PCB assembly.
- Operating Temperature Specified operating range from -40 °C to 125 °C for wide-temperature deployments.
- Graphics No dedicated graphics acceleration; suitable for compute- and I/O-focused embedded tasks.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Networking Dual Gigabit Ethernet and a wide operating temperature range enable robust wired network nodes and industrial communication equipment.
- Secure Embedded Gateways Integrated cryptography, TrustZone and TRNG support secure boot and runtime security for gateway and edge devices.
- Human Machine Interfaces (HMI) LCD display controller combined with application processing provides a platform for basic operator interfaces and control panels.
- Control and CAN Connectivity CANbus plus USB and general I/O make the device suitable for embedded controllers requiring fieldbus or vehicle-style connectivity.
Unique Advantages
- Balanced single-core compute: Single ARM® Cortex®-A7 core at 650 MHz provides deterministic 32-bit application processing for control-centric designs.
- Flexible memory support: Built-in controllers for DDR3/DDR3L/LPDDR2/LPDDR3 simplify BOM choices across performance and power trade-offs.
- Dual high-speed networking: Two Gigabit Ethernet interfaces enable high-throughput networking and redundant link architectures.
- Comprehensive on-chip security: AES, SHA-1/2, TrustZone, TRNG and secure debug features help address device and data protection requirements.
- Wide thermal range: Rated from -40 °C to 125 °C to support deployment in temperature-challenging environments.
- Compact BGA package: 289-TFBGA (9×9) package for space-efficient surface-mount integration.
Why Choose STM32MP135CAG3?
The STM32MP135CAG3 combines a 650 MHz ARM® Cortex®-A7 core with extensive I/O and security features to deliver a compact, connected and secure processing node for embedded applications. Its memory flexibility, dual Gigabit Ethernet and multiple USB ports make it well suited for networked devices that require on-device security and reliable operation across a wide temperature range.
Designed and manufactured by STMicroelectronics, the STM32MP135CAG3 offers an integrated platform for engineers seeking a single-core embedded MPU that balances processing capability, connectivity and security in a compact BGA package.
Request a quote or submit a purchase inquiry to receive pricing and availability for the STM32MP135CAG3. Our team can assist with lead times and volume pricing to support your design and production schedules.

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