STM32MP135CAE3

The STM32MP135CAE3 is a microprocessor IC built around a single ARM® Cortex®-A7 32-bit core running at 650 MHz with NEON™ SIMD support. It targets embedded designs that require general-purpose processing combined with integrated memory interfaces, connectivity and hardware security features.

With support for multiple DRAM types, dual Gigabit Ethernet, USB ports and an LCD controller, the device delivers a compact, connectivity-focused platform in a 289-LFBGA surface-mount package and operates across a wide temperature range.

Key Features

• Core and DSP  Single ARM® Cortex®-A7 32-bit core at 650 MHz with NEON™ SIMD for SIMD acceleration of signal and media tasks.
• Memory  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of system memory configurations.
• Connectivity  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 interfaces provide multiple high-speed I/O options for networked and peripheral-rich applications.
• Display and I/O  Built-in LCD display interface controller for driving user interfaces and display panels.
• Additional Interfaces  CANbus support for controller-area-network connectivity in distributed control systems.
• Security  Hardware security primitives including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG and volatile key storage for layered device protection.
• Package and Mounting  289-LFBGA package (14 × 14 mm) designed for surface-mount assembly.
• Operating Range and Compliance  Rated for an operating temperature range of −40 °C to 125 °C and RoHS compliant.
• Grade  Specified grade: Automotive.

Typical Applications

• Embedded Systems  General embedded control and processing tasks that benefit from a 32-bit ARM core and NEON SIMD acceleration.
• Industrial Automation  Networked control nodes and automation devices using Ethernet and CANbus connectivity within extended temperature environments.
• Network Gateways and Controllers  Small gateways and controllers that require dual Gigabit Ethernet ports and USB connectivity for peripheral integration.
• Human-Machine Interfaces (HMI)  Operator panels and display-driven interfaces using the integrated LCD controller alongside USB for input devices.

Unique Advantages

• Single-core, SIMD-accelerated processing: Compact processing footprint with NEON™ SIMD support for media and signal tasks.
• Versatile memory support: On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 accommodate a range of memory performance and power targets.
• Rich wired connectivity: Dual Gigabit Ethernet and two USB 2.0 ports provide multiple high-speed interfaces for networking and peripherals.
• Comprehensive hardware security: A suite of cryptographic and secure-boot features including AES, ARM TrustZone, TRNG and tamper detection for layered system protection.
• Wide operating range: Rated from −40 °C to 125 °C for deployment in temperature-challenging environments.
• Compact, production-ready package: 289-LFBGA surface-mount package suitable for board-level integration.

Why Choose STM32MP135CAE3?

The STM32MP135CAE3 combines a 650 MHz ARM® Cortex®-A7 core with NEON™ SIMD, broad memory compatibility and a comprehensive set of connectivity and security features in a single 289-LFBGA device. This balance of processing capability, interface density and hardware security makes it well suited to embedded designs that require integrated networking, peripheral support and protected boot/cryptography functions.

As part of the STM32MP135 series, the device offers a compact hardware foundation for developers and procurement teams building connected, secure embedded products that must operate across a wide temperature range.

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