STM32MP133DAF7

Linear IC's
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 1GHz 320-TFBGA (11x11)

Quantity 730 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP133
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package320-TFBGA (11x11)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case320-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key StorageSpeed1GHzSupplier Device Package320-TFBGA (11×11)
USBUSB 2.0 (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of STM32MP133DAF7 – Linear IC's

The STM32MP133DAF7 is an ARM® Cortex®-A7 microprocessor IC featuring a single 32-bit core running at 1 GHz in a 320-TFBGA (11×11) package. Designed for embedded applications, this industrial-grade device combines single-core processing, multimedia acceleration and broad connectivity to address communication, display and secure processing needs.

With multi-standard memory controllers, dual Gigabit Ethernet, USB 2.0 ports and a range of hardware security features, the STM32MP133DAF7 delivers integrated functionality for compact, rugged embedded systems.

Key Features

  • Core  ARM® Cortex®-A7 single 32-bit core operating at 1 GHz for general-purpose embedded processing.
  • Multimedia Acceleration  Includes multimedia DSP capabilities and NEON™ SIMD to accelerate media and signal-processing tasks.
  • Memory Controllers  Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory design.
  • Display  Integrated LCD display interface for driving graphical user interfaces.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports plus CANbus support for industrial and networking connectivity.
  • Security  Hardware security suite including AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG and volatile key storage.
  • Graphics  Graphics acceleration capability to support UI and visualization tasks.
  • Package & Mounting  320-TFBGA (11×11) supplier device package; surface-mount mounting type for compact board designs.
  • Operating Range  Industrial operating temperature from −40 °C to 105 °C for deployment in demanding environments.
  • Environmental  RoHS compliant.

Typical Applications

  • Industrial Control  Embedded controllers and automation equipment benefitting from industrial temperature rating, CANbus and dual Ethernet connectivity.
  • Human–Machine Interfaces (HMI)  Devices with LCD displays and graphical interfaces that use on-chip graphics acceleration and multimedia support.
  • Networking & Communication  Networked embedded systems that require dual Gigabit Ethernet ports and USB 2.0 connectivity.
  • Secure Embedded Systems  Applications needing hardware-backed security features such as AES, secure boot and TRNG for protected data and boot integrity.

Unique Advantages

  • Single 1 GHz ARM Cortex‑A7 Core: Delivers straightforward, deterministic processing for embedded workloads while keeping system complexity low.
  • Broad Connectivity Suite: Dual Gigabit Ethernet, two USB 2.0 ports and CANbus provide versatile wired interfaces for networking and fieldbus integration.
  • Flexible Memory Support: DDR3/DDR3L/LPDDR2/LPDDR3 controller compatibility simplifies memory selection across design variants.
  • Comprehensive Hardware Security: On-chip AES, ARM TZ, secure boot, cryptography, SHA-1/2, TRNG and tamper detection enable robust device-level security.
  • Industrial-Grade Operation: Rated for −40 °C to 105 °C, supporting deployment in harsh or temperature-variable environments.
  • Compact BGA Package: 320-TFBGA (11×11) surface-mount package supports high-density PCB layouts for space-constrained designs.

Why Choose STM32MP133DAF7?

The STM32MP133DAF7 is positioned for embedded and industrial designs that require a compact, single-core 1 GHz processor with integrated multimedia acceleration, rich connectivity and strong hardware security. Its flexible memory support and dual Ethernet ports make it suitable for connected systems that also demand secure boot and cryptographic capabilities.

With industrial temperature rating and RoHS compliance, this device offers a reliable building block for long-life embedded products where thermal range, connectivity and on-chip security are priorities.

Request a quote or contact sales to discuss availability, pricing and how the STM32MP133DAF7 can fit your next embedded or industrial design.

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