STM32MP151AAC3T
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 1,781 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP151 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | PENDING ECCN | Ethernet | 10/100Mbps, GbE | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | 0000.00.0000 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TA) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 650MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP151AAC3T – IC MPU STM32MP1 650MHZ 361TFBGA
The STM32MP151AAC3T is an ARM® Cortex®-A7 microprocessor IC in a 361-TFBGA (12×12) surface-mount package. Specifications list a single 32‑bit Cortex‑A7 core at 209 MHz and an ARM® Cortex®‑M4 co‑processor for real‑time processing.
Targeted for embedded applications, the device integrates display controllers, graphics acceleration, multiple connectivity options and a range of memory-controller support to deliver a compact, feature-rich processing building block for embedded designs.
Key Features
- Core and Co‑processor — ARM® Cortex®‑A7 single 32‑bit core (209 MHz listed) with an ARM® Cortex®‑M4 co‑processor for dedicated real‑time tasks.
- Memory Controllers — Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory interfaces for flexible memory choices.
- Display and Graphics — HDMI‑CEC and LCD display interface controllers plus graphics acceleration for user interfaces and visual workloads.
- Connectivity — Integrated 10/100Mbps and Gigabit Ethernet, multiple USB 2.0 ports and USB 2.0 OTG with PHY, plus CAN interface for vehicle and industrial bus integration.
- Security — ARM TrustZone (ARM TZ) security feature for hardware-assisted security partitioning.
- Package and Mounting — 361‑TFBGA (12×12) package, surface‑mount mounting type for high‑density boards.
- Operating Range — Specified operating temperature range of −40 °C to 125 °C for deployment in thermally demanding environments.
- Environmental — RoHS compliant.
Typical Applications
- Embedded user interfaces — HDMI‑CEC and LCD controllers with graphics acceleration enable responsive HMI and display applications.
- Networked embedded devices — GbE and 10/100Mbps Ethernet plus multiple USB ports provide the connectivity needed for networked systems and edge appliances.
- Real‑time control with application processing — The Cortex‑A7 application core paired with a Cortex‑M4 co‑processor lets designs separate high‑level processing from deterministic control tasks.
Unique Advantages
- Integrated application and control processors: Combines an ARM Cortex‑A7 core with an ARM Cortex‑M4 co‑processor to simplify system partitioning between application and real‑time workloads.
- Broad memory support: DDR3/DDR3L and LPDDR2/LPDDR3 controller support eases selection of memory types to match performance and power targets.
- Comprehensive I/O and connectivity: Built‑in Ethernet, USB (including OTG+PHY) and CAN reduce the need for external interface components.
- Display‑ready integration: HDMI‑CEC and LCD controllers plus graphics acceleration enable advanced UI capabilities without separate display controllers.
- Robust thermal range: −40 °C to 125 °C operation supports deployment in challenging temperature environments.
- Compact SMD package: 361‑TFBGA (12×12) supports compact, high‑density PCB layouts.
Why Choose STM32MP151AAC3T?
The STM32MP151AAC3T delivers a combination of application processing, real‑time control, graphics and extensive I/O in a single 361‑TFBGA device. Its mix of connectivity (Ethernet, USB, CAN), display capabilities and memory controller flexibility make it a practical choice for embedded systems that require integrated functionality in a compact package.
Manufactured by STMicroelectronics and RoHS compliant, the part is suited to designs that need a tightly integrated processor solution with security support via ARM TrustZone and a wide operating temperature range for deployment in demanding environments.
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