STM32MP151CAC3T

The STM32MP151CAC3T is an STM32MP1-series microprocessor IC featuring an ARM® Cortex®-A7 application core and an ARM® Cortex®-M4 coprocessor. The primary application core is specified as a single 32-bit core running at 209 MHz and the device integrates multiple memory, display and connectivity controllers suited for embedded designs.

Targeted at embedded applications that require integration of application processing, real-time control and connectivity, the device provides on-chip support for DDR3/DDR3L/LPDDR2/LPDDR3 memory, display interfaces, Ethernet, USB and CAN, along with hardware security features and a compact 361-TFBGA package.

Key Features

• Processor cores — ARM® Cortex®-A7 application core (1 core, 32-bit, 209 MHz) with an ARM® Cortex®-M4 coprocessor for real-time tasks.
• Memory controllers — Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory configurations.
• Display — Integrated display interface controllers including HDMI-CEC and LCD support plus graphics acceleration for GUI and video applications.
• Connectivity — Ethernet support (10/100 Mbps and GbE), USB 2.0 ports and USB 2.0 OTG with PHY, and CAN interface for broad peripheral and network integration.
• Security — ARM TZ (TrustZone) security feature for hardware-assisted security partitioning.
• Package & mounting — 361-TFBGA package (12×12 mm) designed for surface-mount assembly.
• Operating range — Rated operating temperature from −40 °C to 125 °C for deployment across wide temperature conditions.
• Environmental compliance — RoHS compliant.

Typical Applications

• Embedded controllers and gateways — Integrated Ethernet, USB and CAN interfaces with an application core plus M4 coprocessor enable networked control and protocol handling in embedded gateway devices.
• Human–machine interfaces — HDMI-CEC and LCD controllers combined with graphics acceleration support display-driven interfaces and graphical UIs.
• Memory-centric processing — Support for multiple DRAM standards (DDR3/DDR3L/LPDDR2/LPDDR3) suits designs that require varied memory performance and density.

Unique Advantages

• Integrated dual-core model: Combines a Cortex‑A7 application core with a Cortex‑M4 coprocessor to separate high-level processing and real-time control without additional components.
• Flexible memory options: On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 allow designers to choose memory technology that fits performance and cost targets.
• Comprehensive connectivity: Built-in Ethernet (10/100 and GbE), multiple USB 2.0 ports including OTG with PHY, and CAN reduce external interface components.
• Hardware security support: ARM TrustZone (ARM TZ) provides a foundation for implementing secure execution environments and isolating sensitive functions.
• Wide thermal tolerance: Specified −40 °C to 125 °C operation supports deployment in systems exposed to harsh temperature ranges.
• Compact surface-mount footprint: 361‑TFBGA (12×12) package enables high-density board designs.

Why Choose STM32MP151CAC3T?

The STM32MP151CAC3T positions itself as a compact, integrated microprocessor option within the STM32MP1 series, combining an ARM® Cortex®-A7 application core with an ARM® Cortex®-M4 coprocessor and a broad set of on-chip controllers for memory, display and connectivity. Its combination of processing, real-time control and peripheral interfaces simplifies system architecture for embedded designs that require both application-level processing and deterministic control.

With support for multiple DRAM types, hardware security via ARM TZ, wide operating temperature range and a space-efficient 361‑TFBGA package, this device is suitable for engineers seeking a scalable, well-integrated MPU building block backed by the STM32MP1-series feature set.

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