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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | JM80532PH0992M | Intel | IC MPU INTEL PENT 3.46GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 66°C (TC) | Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 3.46GHz Voltage – I/O: 1.287V, 1.4V Operating Temperature: 66°C (TC) Mounting Type: Surface Mount Package / Case: 775-LGA Supplier Device Package: 775-LGA (37.5×37.5) | 969 | ||
| N/A | JM80547PE0831M | Intel | PENTIUM 4 PROCESSOR 519K | Microprocessors | N/A | N/A | N/A | N/A | 1,385 | ||
| N/A | JM80547PG0961M | Intel | IC MPU INTEL CELER 3.4GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 72.8°C (TC) | Core Processor: Intel® Celeron® Processor 550 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 3.4GHz Voltage – I/O: 1.2V, 1.425V Operating Temperature: 72.8°C (TC) Mounting Type: Surface Mount Package / Case: 775-BLGA Supplier Device Package: 775-LGA (37.5×37.5) | 1,686 | ||
| N/A | JM80547PG0961MM | Intel | IC MPU INTEL PENT 3.4GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 67.7°C (TC) | Core Processor: Intel® Pentium® 4 Processor 551 supporting HT Technology Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 3.4GHz Voltage – I/O: 1.2V, 1.425V Operating Temperature: 67.7°C (TC) Mounting Type: Surface Mount Package / Case: 775-LGA Supplier Device Package: 775-LGA (37.5×37.5) | 871 | ||
| N/A | KC13213 | NXP Semiconductors | MC13213 - Microprocessor Circuit | Microprocessors | N/A | N/A | N/A | N/A | 1,272 | ||
| N/A | KC80524KX266256 | Intel | IC MPU INTEL PENT 266MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 0°C ~ 100°C (TC) | Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 1.6V Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA | 245 | ||
| N/A | KC80524KX333256 | Intel | IC MPU MOBL PENT 333MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | – | Core Processor: Mobile Intel® Pentium® II Number of Cores/Bus Width: 1 Core Speed: 333MHz Voltage – I/O: 1.6V Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA | 1,200 | ||
| N/A | KC80524KX366128 | Intel | IC MPU MOBILE CEL 366MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core Speed: 366MHz Voltage – I/O: 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA | 258 | ||
 | KC80524KX366128SL3C7 | Intel | IC MPU MOBILE CEL 366MHZ 615BGA | Microprocessors | 615-BGA (35.15x31.15) | N/A | 0°C ~ 100°C (TJ) | Speed: 366MHz Graphics Acceleration: No Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 615-BBGA Supplier Device Package: 615-BGA (35.15×31.15) | 846 | ||
| N/A | KC80526GY650256 | Intel | IC MPU MOBIL PENT 650MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Voltage – I/O: 1.35V, 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-PBGA | 343 | ||
| N/A | KC80526GY6504JY | Intel | RISC MPU, 32-BIT, 600MHZ | Microprocessors | N/A | N/A | N/A | N/A | 226 | ||
| N/A | KC80526LY400128 | Intel | IC MPU MOBIL PENT 400MHZ 495BGA | Microprocessors | 495-BGA (31x27) | N/A | – | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Voltage – I/O: 1.35V Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-BGA (31×27) | 1,243 | ||
| N/A | KC80526LY500256 | Intel | IC MPU MOBIL PENT 500MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 500MHz Voltage – I/O: 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-PBGA | 41 | ||
 | KMC68302EH25C | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 1,451 | ||
 | KMC68360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 478 | ||
 | KMC68360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 853 | ||
 | KMC68EN302AG25BT | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20×20) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 494 | ||
 | KMC68EN360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 1,573 | ||
 | KMC68EN360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 1,227 | ||
| N/A | KMC68EN360RC33L | NXP Semiconductors | IC MPU M683XX 33MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 241-BEPGA Supplier Device Package: 241-PGA (47.24×47.24) Additional Interfaces: SCC, SMC, SPI | 1,263 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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