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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | JM80532PH0992M | Intel | IC MPU INTEL PENT 3.46GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 66°C (TC) | Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 3.46GHz Voltage – I/O: 1.287V, 1.4V Operating Temperature: 66°C (TC) Mounting Type: Surface Mount Package / Case: 775-LGA Supplier Device Package: 775-LGA (37.5×37.5) Grade: Commercial | 1,892 | ||
| N/A | JM80547PE0831M | Intel | PENTIUM 4 PROCESSOR 519K | Microprocessors | 775-LGA (37.5x37.5) | N/A | 0 °C – 100 °C | Speed: 3.066 GHz Voltage – I/O: 1.325 V Core Processor: Mobile Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 64-Bit Grade: Commercial Graphics Acceleration: No Co-Processors/DSP: MMX | 1,194 | ||
| N/A | JM80547PG0961M | Intel | IC MPU INTEL CELER 3.4GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 72.8°C (TC) | Core Processor: Intel® Celeron® Processor 550 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 3.4GHz Voltage – I/O: 1.2V, 1.425V Operating Temperature: 72.8°C (TC) Mounting Type: Surface Mount Package / Case: 775-BLGA Supplier Device Package: 775-LGA (37.5×37.5) Grade: Commercial | 750 | ||
| N/A | JM80547PG0961MM | Intel | IC MPU INTEL PENT 3.4GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 67.7°C (TC) | Core Processor: Intel® Pentium® 4 Processor 551 supporting HT Technology Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 3.4GHz Voltage – I/O: 1.2V, 1.425V Operating Temperature: 67.7°C (TC) Mounting Type: Surface Mount Package / Case: 775-LGA Supplier Device Package: 775-LGA (37.5×37.5) Grade: Commercial | 1,153 | ||
| N/A | KC13213 | NXP Semiconductors | 2.4GHz 802.15.4 ZigBee SoC, HCS08, 60KB Flash | Microprocessors | 71-LGA (9x9) | N/A | -40 °C – 85 °C (TA) | Speed: 40 MHz Voltage – I/O: 2.0 V – 3.4 V Core Processor: HCS08 Number of Cores/Bus Width: 1 Core, 8-Bit Grade: Industrial Graphics Acceleration: No | 678 | ||
| N/A | KC80524KX266256 | Intel | IC MPU INTEL PENT 266MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 0°C ~ 100°C (TC) | Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 1.6V Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA Grade: Commercial | 3 | ||
| N/A | KC80524KX333256 | Intel | IC MPU MOBL PENT 333MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | – | Core Processor: Mobile Intel® Pentium® II Number of Cores/Bus Width: 1 Core Speed: 333MHz Voltage – I/O: 1.6V Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA Grade: Commercial | 45 | ||
| N/A | KC80524KX366128 | Intel | IC MPU MOBILE CEL 366MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core Speed: 366MHz Voltage – I/O: 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 615-BGA Supplier Device Package: 615-PBGA Grade: Commercial | 1,477 | ||
 | KC80524KX366128SL3C7 | Intel | IC MPU MOBILE CEL 366MHZ 615BGA | Microprocessors | 615-BGA (35.15x31.15) | N/A | 0°C ~ 100°C (TJ) | Speed: 366MHz Graphics Acceleration: No Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 615-BBGA Supplier Device Package: 615-BGA (35.15×31.15) Grade: Commercial | 30 | ||
| N/A | KC80526GY650256 | Intel | IC MPU MOBIL PENT 650MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Voltage – I/O: 1.35V, 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-PBGA Grade: Commercial | 194 | ||
| N/A | KC80526GY6504JY | Intel | RISC MPU, 32-BIT, 600MHZ | Microprocessors | 495-BGA | N/A | 0 °C – 80 °C | Speed: 650 MHz Voltage – I/O: 1.542 V Core Processor: Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit Grade: Commercial Graphics Acceleration: No Co-Processors/DSP: MMX | 580 | ||
| N/A | KC80526LY400128 | Intel | IC MPU MOBIL PENT 400MHZ 495BGA | Microprocessors | 495-BGA (31x27) | N/A | – | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Voltage – I/O: 1.35V Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-BGA (31×27) Grade: Commercial | 1,300 | ||
| N/A | KC80526LY500256 | Intel | IC MPU MOBIL PENT 500MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 500MHz Voltage – I/O: 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Package / Case: 495-BGA Supplier Device Package: 495-PBGA Grade: Commercial | 1,363 | ||
 | KMC68302EH25C | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 1,008 | ||
 | KMC68360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) | 484 | ||
 | KMC68360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) | 943 | ||
 | KMC68EN302AG25BT | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20×20) | 1,342 | ||
 | KMC68EN360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) | 120 | ||
 | KMC68EN360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) | 1,036 | ||
| N/A | KMC68EN360RC33L | NXP Semiconductors | IC MPU M683XX 33MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 241-BEPGA Supplier Device Package: 241-PGA (47.24×47.24) | 188 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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