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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | KMC68EN360VR25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: SCC, SMC, SPI | 155 | ||
 | KMC68LC302AF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 1,994 | ||
 | KMC68LC302AF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 984 | ||
 | KMC68LC302AF25CT | NXP Semiconductors | IC MPU M683XX 25MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 1,555 | ||
 | KMC68MH360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 152 | ||
 | KMC68MH360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32×32) Additional Interfaces: SCC, SMC, SPI | 814 | ||
 | KMC7447AHX1167NB | NXP Semiconductors | IC MPU MPC74XX 1.167GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.167GHZ Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,116 | ||
 | KMC7448HX1267ND | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Mounting Type: Surface Mount | 1,495 | ||
 | KMC7448HX1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Mounting Type: Surface Mount | 4 | ||
 | KMC7448THX1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | -40°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Mounting Type: Surface Mount | 1,548 | ||
 | KMC7448VS1400NC | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCLGA | Microprocessors | 360-FCCLGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25×25) | 1,337 | ||
 | KMC7448VU1267ND | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Mounting Type: Surface Mount | 888 | ||
 | KMC7448VU1400NC | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 221 | ||
 | KMC7448VU1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Mounting Type: Surface Mount | 1,103 | ||
 | KMC7457RX1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 51 | ||
 | KMC7457RX1267LC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 483BGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 594 | ||
 | KMC7457VG1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,321 | ||
 | KMC7457VG1267LC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 483BGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 90 | ||
 | KMPC823VR66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 111 | ||
 | KMPC823VR81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 81MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 771 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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