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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | KMPC8245LVV266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 849 | ||
 | KMPC8245LVV350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 299 | ||
 | KMPC8245LZU350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 880 | ||
 | KMPC8245TZU350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 89 | ||
 | KMPC8247CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 176 | ||
 | KMPC8247VRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 1,044 | ||
 | KMPC8247VRTMFA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 921 | ||
 | KMPC8248CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 405 | ||
 | KMPC8248CZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 437 | ||
 | KMPC8248VRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 714 | ||
 | KMPC8248VRTMFA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 1,119 | ||
 | KMPC8250ACVVMHBC | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 1,124 | ||
 | KMPC8250ACZUMHBC | NXP Semiconductors | IC MPU MPC82XX 266MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 851 | ||
 | KMPC8250AVVPIBC | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 302 | ||
 | KMPC8260ACZUMIBB | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 312 | ||
 | KMPC8265ACVVMIBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 1,163 | ||
 | KMPC8265ACZUMIBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 536 | ||
 | KMPC8265AZUPJDC | NXP Semiconductors | IC MPU MPC82XX 300MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 877 | ||
 | KMPC8270CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 849 | ||
 | KMPC8270CVVQLDA | NXP Semiconductors | IC MPU MPC82XX 333MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART | 462 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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