KMPC8270CVVQLDA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,175 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 2A (4 Weeks) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 333MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8270CVVQLDA – IC MPU MPC82XX 333MHZ 480TBGA
The KMPC8270CVVQLDA is a PowerPC G2_LE microprocessor in the MPC8270 series, supplied by NXP Semiconductors. It is a single-core, 32-bit embedded MPU rated at 333 MHz and qualified for industrial use.
Designed for embedded communications and industrial applications, this device integrates on-chip communications co-processors and a range of peripheral interfaces to support networked and control-focused designs, with a 480-TBGA package and extended operating temperature range for deployment in robust environments.
Key Features
- Core and Performance PowerPC G2_LE single 32-bit core running at 333 MHz, providing embedded processing for communications and control tasks.
- Cache Architecture Separate instruction and data caches (16 KB each) as indicated in the MPC8280 family documentation to support instruction throughput and data locality.
- Memory Controllers Integrated DRAM and SDRAM controllers for external memory interfacing.
- Communications Co-processors On-chip communications and RISC CPM co-processors to offload protocol and data-path tasks.
- Ethernet and USB Three 10/100 Mbps Ethernet ports and one USB 2.0 interface for network and peripheral connectivity.
- Serial and Control Interfaces I2C support plus multiple serial communications controllers and fast communication controllers as defined for the MPC8280 family.
- Package and Mounting 480-LBGA exposed pad; supplier device package listed as 480-TBGA (37.5x37.5); surface-mount for high-density board designs.
- Power and I/O 3.3 V I/O voltage to match common industrial signaling levels.
- Industrial Qualification & Thermal Range Industrial qualification and rated for operation from −40 °C to 105 °C.
- Environmental RoHS compliant.
Typical Applications
- Industrial Networking Equipment Multi-port 10/100 Ethernet and integrated communications engines make this MPU suitable for switches, gateways, and protocol converters in industrial networks.
- Embedded Communications Controllers On-chip communications co-processors and multiple serial controllers support protocol handling and packet processing tasks.
- Industrial Control Systems The industrial temperature range and robust package support deployment in motor control, PLC interfacing, and factory automation controllers.
- Peripheral Interface and I/O Hubs USB 2.0, I2C, and external memory controller support make it applicable for embedded hubs that bridge sensors and user interfaces.
Unique Advantages
- Integrated Communications Peripherals: Three 10/100 Mbps Ethernet ports, USB 2.0, and serial controllers reduce external components and simplify board-level design.
- Embedded Offload Engines: Communications and RISC CPM co-processors lower CPU load for protocol processing and real-time data handling.
- Industrial-Grade Operation: Qualification for industrial use and an operating range from −40 °C to 105 °C support reliable deployment in harsh environments.
- Compact, High-Density Package: 480-TBGA (37.5x37.5) with exposed pad enables thermal management and dense PCB layouts.
- Standard 3.3 V I/O: Compatible with common industrial logic levels for straightforward integration.
- RoHS Compliant: Conforms to environmental regulations for lead-free manufacturing requirements.
Why Choose KMPC8270CVVQLDA?
The KMPC8270CVVQLDA combines a PowerPC G2_LE single 32-bit core at 333 MHz with integrated communications peripherals and co-processors to deliver a focused solution for embedded and industrial communications applications. Its industrial qualification, wide operating temperature range, and compact 480-TBGA package make it suitable for rugged, space-constrained designs.
As a member of the MPC8270 family from NXP Semiconductors, this device offers a balance of processing capability, peripheral integration, and environmental robustness for engineers building networked controllers, gateways, and industrial control systems.
Request a quote or submit an RFQ to receive pricing and lead-time information for the KMPC8270CVVQLDA.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016