KMPC8270CVVUPEA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 528 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 2A (4 Weeks) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 450MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8270CVVUPEA – IC MPU MPC82XX 450MHz 480TBGA
The KMPC8270CVVUPEA is a single-core, 32-bit PowerPC G2_LE microprocessor running at 450 MHz, offered in a 480-TBGA (37.5 × 37.5 mm) package. Designed for embedded systems, this industrial-qualified device combines a high-performance core with integrated communications and memory controller resources for compact, reliable system designs.
Targeted at embedded communications and industrial applications, the MPC8270 provides integrated I/O and peripheral support to simplify board design while meeting extended temperature requirements.
Key Features
- Core & Performance Dual-issue PowerPC G2_LE integer core, single 32-bit core operating at up to 450 MHz; supports the MPC8280 family performance range noted in the device documentation.
- Cache Architecture Separate 16 KB instruction cache and 16 KB data cache; four-way set associative with LRU replacement to improve instruction and data throughput.
- Memory Controllers On-chip DRAM and SDRAM controller support to interface with common external memory types.
- Communications & Offload Multiple serial communications resources including 4 SCCs and 3 Fast Communication Controllers (FCCs) as described for the MPC8280 family, plus on-chip communications/RISC CPM co-processor functionality.
- Ethernet & USB Three 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low-rate port provide direct network and peripheral connectivity.
- Additional Interfaces I2C support for system management and peripheral control.
- System Integration Integrated PCI bridge functionality as provided in the MPC8280 family documentation to simplify expansion and system architectures.
- Power & I/O 3.3 V I/O voltage support and RoHS-compliant manufacturing.
- Package & Thermal 480-TBGA (37.5 × 37.5 mm) supplier package with 480-LBGA exposed pad option; surface-mount mounting and an operating temperature range of −40 °C to 105 °C for industrial use.
Typical Applications
- Embedded Networking Equipment Multi-port Ethernet and serial controllers make the device suitable for routers, switches, and communications modules requiring integrated network interfaces.
- Industrial Control Systems Industrial qualification and an extended operating temperature range support controllers and automation platforms used in harsh environments.
- Protocol Gateways & Bridges On-chip communications co-processors and PCI bridge support enable protocol conversion and bridging applications with reduced external logic.
- Appliance and Platform Controllers Compact BGA packaging and integrated peripherals simplify board-level processor selection for embedded appliances and system platforms.
Unique Advantages
- Integrated communications peripherals: Multiple Ethernet ports, SCCs, FCCs, USB and I2C reduce external interface components and simplify BOM.
- Deterministic processor performance: PowerPC G2_LE core at up to 450 MHz with dedicated instruction and data caches for improved processing efficiency.
- Industrial-ready thermal range: −40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
- Compact thermal-capable package: 480-TBGA with exposed pad and surface-mount mounting provides a small footprint while facilitating thermal management on board.
- Standards-aligned I/O voltage: 3.3 V I/O compatibility simplifies integration with common legacy and modern peripherals.
- Vendor-supported family documentation: Detailed MPC8270/MPC8280 family hardware specifications and datasheet material support design and validation activities.
Why Choose KMPC8270CVVUPEA?
The KMPC8270CVVUPEA positions itself as a well-integrated embedded processor for applications that require a PowerPC architecture, robust communications interfaces, and industrial temperature operation. Its combination of a 450 MHz G2_LE core, on-chip communications controllers, memory interfaces, and PCI capabilities makes it suitable for compact networking and industrial designs where integration and reliable operation matter.
Backed by NXP Semiconductors' MPC8270 family documentation, this device offers a clear specification set for engineering teams seeking a documented, industrial-qualified microprocessor platform with extensive peripheral integration.
Request a quote or submit an inquiry to purchase KMPC8270CVVUPEA for your next embedded or industrial communications project.

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