KMPC8270CVVUPEA

IC MPU MPC82XX 450MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5)

Quantity 528 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level2A (4 Weeks)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed450MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of KMPC8270CVVUPEA – IC MPU MPC82XX 450MHz 480TBGA

The KMPC8270CVVUPEA is a single-core, 32-bit PowerPC G2_LE microprocessor running at 450 MHz, offered in a 480-TBGA (37.5 × 37.5 mm) package. Designed for embedded systems, this industrial-qualified device combines a high-performance core with integrated communications and memory controller resources for compact, reliable system designs.

Targeted at embedded communications and industrial applications, the MPC8270 provides integrated I/O and peripheral support to simplify board design while meeting extended temperature requirements.

Key Features

  • Core & Performance  Dual-issue PowerPC G2_LE integer core, single 32-bit core operating at up to 450 MHz; supports the MPC8280 family performance range noted in the device documentation.
  • Cache Architecture  Separate 16 KB instruction cache and 16 KB data cache; four-way set associative with LRU replacement to improve instruction and data throughput.
  • Memory Controllers  On-chip DRAM and SDRAM controller support to interface with common external memory types.
  • Communications & Offload  Multiple serial communications resources including 4 SCCs and 3 Fast Communication Controllers (FCCs) as described for the MPC8280 family, plus on-chip communications/RISC CPM co-processor functionality.
  • Ethernet & USB  Three 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low-rate port provide direct network and peripheral connectivity.
  • Additional Interfaces  I2C support for system management and peripheral control.
  • System Integration  Integrated PCI bridge functionality as provided in the MPC8280 family documentation to simplify expansion and system architectures.
  • Power & I/O  3.3 V I/O voltage support and RoHS-compliant manufacturing.
  • Package & Thermal  480-TBGA (37.5 × 37.5 mm) supplier package with 480-LBGA exposed pad option; surface-mount mounting and an operating temperature range of −40 °C to 105 °C for industrial use.

Typical Applications

  • Embedded Networking Equipment  Multi-port Ethernet and serial controllers make the device suitable for routers, switches, and communications modules requiring integrated network interfaces.
  • Industrial Control Systems  Industrial qualification and an extended operating temperature range support controllers and automation platforms used in harsh environments.
  • Protocol Gateways & Bridges  On-chip communications co-processors and PCI bridge support enable protocol conversion and bridging applications with reduced external logic.
  • Appliance and Platform Controllers  Compact BGA packaging and integrated peripherals simplify board-level processor selection for embedded appliances and system platforms.

Unique Advantages

  • Integrated communications peripherals: Multiple Ethernet ports, SCCs, FCCs, USB and I2C reduce external interface components and simplify BOM.
  • Deterministic processor performance: PowerPC G2_LE core at up to 450 MHz with dedicated instruction and data caches for improved processing efficiency.
  • Industrial-ready thermal range: −40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
  • Compact thermal-capable package: 480-TBGA with exposed pad and surface-mount mounting provides a small footprint while facilitating thermal management on board.
  • Standards-aligned I/O voltage: 3.3 V I/O compatibility simplifies integration with common legacy and modern peripherals.
  • Vendor-supported family documentation: Detailed MPC8270/MPC8280 family hardware specifications and datasheet material support design and validation activities.

Why Choose KMPC8270CVVUPEA?

The KMPC8270CVVUPEA positions itself as a well-integrated embedded processor for applications that require a PowerPC architecture, robust communications interfaces, and industrial temperature operation. Its combination of a 450 MHz G2_LE core, on-chip communications controllers, memory interfaces, and PCI capabilities makes it suitable for compact networking and industrial designs where integration and reliable operation matter.

Backed by NXP Semiconductors' MPC8270 family documentation, this device offers a clear specification set for engineering teams seeking a documented, industrial-qualified microprocessor platform with extensive peripheral integration.

Request a quote or submit an inquiry to purchase KMPC8270CVVUPEA for your next embedded or industrial communications project.

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