KMPC8270CZUQLDA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 333MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,433 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 2A (4 Weeks) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 333MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8270CZUQLDA – IC MPU MPC82XX 333MHZ 480TBGA
The KMPC8270CZUQLDA is a PowerPC G2_LE microprocessor in the MPC8270 family, featuring a single 32‑bit core running at 333 MHz. It combines an integrated communications‑focused architecture with on‑chip controllers and interfaces to address embedded and industrial applications.
Designed for systems requiring multiple wired interfaces and on‑chip memory controllers, this device delivers balanced processing and peripheral integration—ideal for communications, networking, and industrial embedded platforms where temperature range and packaging density are important.
Key Features
- Core & Performance Dual‑issue integer PowerPC G2_LE core; this device is specified at 333 MHz. The MPC8280 family documentation also describes separate 16 KB instruction and 16 KB data caches (four‑way set associative with LRU replacement).
- Memory & Controllers Integrated DRAM and SDRAM controllers to support system memory needs for embedded applications.
- Communications Co‑processors On‑chip communications and RISC CPM co‑processors to assist protocol handling and I/O tasks.
- Network & Peripheral Interfaces Three 10/100 Mbps Ethernet ports and one USB 2.0 port, plus I2C for system management and peripheral control.
- Power & I/O 3.3 V I/O signaling for common embedded system compatibility.
- Package & Mounting 480‑TBGA supplier package (37.5 × 37.5 mm) with 480‑LBGA exposed pad option; surface‑mount device suitable for high‑density designs.
- Qualification & Operating Range Industrial qualification with an operating temperature range of −40 °C to 105 °C.
- Environmental Compliance RoHS‑compliant.
Typical Applications
- Network and Communications Equipment Multiport Ethernet and on‑chip communications processors make this device suitable for routers, switches, and protocol gateways.
- Industrial Automation Industrial qualification and a −40 °C to 105 °C operating range support controllers and embedded machines in industrial environments.
- Embedded Gateways Integrated DRAM/SDRAM controllers, USB 2.0, and I2C simplify gateway designs that bridge field devices to wired networks.
- Security and Telecom Appliances On‑chip communications co‑processors and multiple Ethernet interfaces enable offload of protocol processing in appliances and telecom modules.
Unique Advantages
- Highly integrated communications interfaces: Three 10/100 Mbps Ethernet ports, USB 2.0, and I2C reduce external PHY and bridge requirements for multiport designs.
- On‑chip memory controllers: DRAM and SDRAM controllers simplify memory subsystem design and speed time to market.
- Industrial operating range: Rated from −40 °C to 105 °C to meet demanding environmental conditions common in industrial deployments.
- Compact, high‑density packaging: 480‑TBGA (37.5 × 37.5 mm) with exposed pad option supports dense board layouts while providing thermal path options.
- PowerPC G2_LE architecture: Dual‑issue integer core and dedicated caches provide deterministic embedded processing for communications workloads.
- RoHS compliant: Meets environmental regulatory requirements for modern electronics manufacturing.
Why Choose KMPC8270CZUQLDA?
The KMPC8270CZUQLDA positions performance and integration for embedded communications and industrial systems. With a PowerPC G2_LE core at 333 MHz, on‑chip DRAM/SDRAM controllers, multiple Ethernet ports, USB 2.0, and communications co‑processors, it consolidates key system functions to reduce external components and simplify board design.
As a member of the MPC8280/PowerQUICC II family, this device benefits from documented architecture details—including cache organization and multi‑port communications capabilities—making it a suitable choice for engineers building robust, industrially qualified networked appliances and embedded gateways.
Request a quote or submit a purchase inquiry to evaluate KMPC8270CZUQLDA for your next embedded communications or industrial design.

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