KMPC8270VVUPEA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,173 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 2A (4 Weeks) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 450MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8270VVUPEA – IC MPU MPC82XX 450MHZ 480TBGA
The KMPC8270VVUPEA is a PowerPC G2_LE microprocessor from the MPC8270 family, delivering a single 32‑bit core running at up to 450 MHz in a 480‑TBGA package. It is designed for embedded applications that require integrated communications support and deterministic processing in a compact surface‑mount form factor.
Built for embedded and communications markets, this device combines a dual‑issue integer G2_LE core implementation with on‑chip memory controllers and multiple peripheral interfaces to simplify system design and reduce external component count.
Key Features
- Core Dual‑issue integer PowerPC G2_LE core, single 32‑bit core running up to 450 MHz with separate 16 KB instruction and 16 KB data caches (four‑way set associative).
- Memory Integrated DRAM and SDRAM controllers to support system memory interfaces directly.
- Communications Co‑processors On‑chip communications co‑processors including a RISC CPM and communications engines to accelerate protocol handling.
- Networking and Peripherals Triple 10/100 Mbps Ethernet controllers and one USB 2.0 full/low‑rate port plus I2C for peripheral control and connectivity.
- Package and Mounting 480‑TBGA supply package (37.5 × 37.5 mm) with surface‑mount assembly; package case referenced as 480‑LBGA with exposed pad options for thermal dissipation.
- Power and I/O 3.3 V I/O voltage for standard embedded I/O compatibility.
- Operating Range and Qualification Consumer‑qualified device with an operating temperature range of 0 °C to 105 °C and RoHS compliance.
Typical Applications
- Embedded Networking Equipment Use as the host processor in routers, switches or gateways where multiple 10/100 Ethernet interfaces and integrated communications engines are required.
- Industrial Control Systems Integration into control platforms that benefit from on‑chip DRAM/SDRAM controllers and deterministic processing at up to 450 MHz.
- Consumer Embedded Devices Deployment in consumer‑grade embedded products needing a compact BGA package, standard 3.3 V I/O and common peripheral interfaces such as USB and I2C.
- Communications Appliances Ideal for appliances that require serial communications controllers, protocol offload via the CPM, and multiple Ethernet/FCC resources.
Unique Advantages
- High single‑core performance: 450 MHz PowerPC G2_LE core delivers predictable integer performance for control and packet‑processing tasks.
- Integrated communications interfaces: Three 10/100 Ethernet ports, USB 2.0 and I2C reduce the need for discrete interface chips.
- On‑chip memory support: Built‑in DRAM and SDRAM controllers simplify board design and memory subsystem integration.
- Compact BGA packaging: 480‑TBGA (37.5 × 37.5 mm) surface‑mount package with exposed pad option for thermal management in space‑constrained designs.
- Documented family support: The MPC8280/MPC8270 family datasheet provides detailed electrical, timing and package information to support system design and validation.
- RoHS compliance: Meets lead‑free manufacturing requirements for modern supply chains.
Why Choose KMPC8270VVUPEA?
The KMPC8270VVUPEA positions itself as a compact, communications‑focused embedded processor that balances single‑core PowerPC performance with a rich set of on‑chip interfaces and memory controllers. Its combination of Ethernet ports, USB, CPM co‑processing and integrated DRAM/SDRAM support helps reduce total system BOM and simplifies board layout for embedded designs.
This device is suitable for designers targeting consumer and embedded communications products that require documented hardware specifications, predictable performance up to 450 MHz, and a surface‑mount BGA package with thermal management options.
Request a quote or submit a procurement inquiry for KMPC8270VVUPEA to receive pricing and availability details tailored to your project needs.

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