KMPC8270ZUUPEA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,711 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8270 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 2A (4 Weeks) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 450MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8270ZUUPEA – IC MPU MPC82XX 450MHz 480TBGA
The KMPC8270ZUUPEA is a single-core PowerPC G2_LE microprocessor operating at up to 450 MHz, designed for embedded communications applications. It combines a dual-issue integer core with integrated memory controllers and multiple on-chip interfaces to support networked and protocol-driven designs in consumer-grade embedded products.
With integrated Ethernet MACs, USB 2.0 support and a rich set of serial controllers, this device delivers a compact, highly integrated processing solution for embedded networking and communications equipment that require deterministic protocol handling and board-level consolidation.
Key Features
- Core & Architecture Dual-issue PowerPC G2_LE integer core (EC603e family) running up to 450 MHz; single 32-bit core suitable for embedded control and communications tasks.
- Caches Separate 16 KB instruction and 16 KB data caches for improved code and data throughput and reduced external memory access.
- Memory Subsystem On-chip controllers for DRAM and SDRAM to support system memory needs and board-level memory integration.
- Connectivity Three 10/100 Mbps Ethernet MACs and one USB 2.0 controller provide multi-port network and peripheral connectivity for embedded applications.
- Serial and Control Interfaces Multiple serial communications controllers (SCCs) and additional interfaces including I²C enable versatile protocol handling and peripheral control.
- Co-processors & Offload Communications-focused co-processors including RISC CPM and DSP-oriented resources to offload protocol processing and packet handling.
- System Integration On-chip PCI bridge and a suite of communications peripherals simplify board-level integration and reduce external component count.
- Power & Temperature 3.3 V I/O signaling with an operating temperature range of 0 °C to 105 °C for consumer-grade embedded use.
- Package & Mounting 480-lead TBGA (37.5 × 37.5 mm) surface-mount package with exposed pad for thermal dissipation and high-density board layouts.
- Compliance RoHS compliant and marked as Consumer qualification in supplier data.
Typical Applications
- Consumer Networking Equipment Multi-port Ethernet and USB support make this MPU suitable for consumer gateways, home routers and similar networked appliances.
- Embedded Communications Appliances Integrated SCCs, CPM and Ethernet MACs enable protocol-heavy embedded systems and communications controllers.
- Board-Level Integrated Systems On-chip PCI bridge and memory controllers allow compact board designs where reducing external components and simplify BOM is a priority.
Unique Advantages
- Integrated Communications Peripherals: Three 10/100 Ethernet MACs, SCCs and USB 2.0 provide multiple connectivity options without requiring extensive external logic.
- Deterministic Core Performance: Dual-issue PowerPC G2_LE core at up to 450 MHz with 16 KB instruction and data caches supports predictable embedded processing for protocol and control tasks.
- Offload and Acceleration: Dedicated communications co-processors (RISC CPM and DSP-oriented resources) reduce CPU load for packet and protocol processing.
- Compact, Thermally Attuned Package: 480-TBGA (37.5 × 37.5 mm) with exposed pad enables high-density designs while addressing thermal management at board level.
- Design-Ready Memory Interface: Built-in DRAM/SDRAM controllers streamline memory subsystem design and shorten development cycles.
- Regulatory and Assembly Friendly: RoHS compliance and surface-mount package simplify modern manufacturing and environmental requirements.
Why Choose KMPC8270ZUUPEA?
The KMPC8270ZUUPEA positions itself as a highly integrated embedded communications MPU combining a dual-issue PowerPC G2_LE core with extensive on-chip peripherals focused on networking and protocol handling. Its mix of Ethernet ports, serial controllers, USB 2.0, memory controllers and communications co-processors reduces external component count and simplifies board-level design for consumer-grade embedded systems.
This part is well suited to designers seeking a compact, connectivity-rich processor for consumer networking appliances and embedded communications products that require reliable protocol processing, reduced BOM complexity and a clear upgrade path within the MPC8270 family.
Request a quote or submit an inquiry to discuss availability, lead times, and volume pricing for KMPC8270ZUUPEA.

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