KMPC8270ZUUPEA

IC MPU MPC82XX 450MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5)

Quantity 1,711 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level2A (4 Weeks)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed450MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of KMPC8270ZUUPEA – IC MPU MPC82XX 450MHz 480TBGA

The KMPC8270ZUUPEA is a single-core PowerPC G2_LE microprocessor operating at up to 450 MHz, designed for embedded communications applications. It combines a dual-issue integer core with integrated memory controllers and multiple on-chip interfaces to support networked and protocol-driven designs in consumer-grade embedded products.

With integrated Ethernet MACs, USB 2.0 support and a rich set of serial controllers, this device delivers a compact, highly integrated processing solution for embedded networking and communications equipment that require deterministic protocol handling and board-level consolidation.

Key Features

  • Core & Architecture Dual-issue PowerPC G2_LE integer core (EC603e family) running up to 450 MHz; single 32-bit core suitable for embedded control and communications tasks.
  • Caches Separate 16 KB instruction and 16 KB data caches for improved code and data throughput and reduced external memory access.
  • Memory Subsystem On-chip controllers for DRAM and SDRAM to support system memory needs and board-level memory integration.
  • Connectivity Three 10/100 Mbps Ethernet MACs and one USB 2.0 controller provide multi-port network and peripheral connectivity for embedded applications.
  • Serial and Control Interfaces Multiple serial communications controllers (SCCs) and additional interfaces including I²C enable versatile protocol handling and peripheral control.
  • Co-processors & Offload Communications-focused co-processors including RISC CPM and DSP-oriented resources to offload protocol processing and packet handling.
  • System Integration On-chip PCI bridge and a suite of communications peripherals simplify board-level integration and reduce external component count.
  • Power & Temperature 3.3 V I/O signaling with an operating temperature range of 0 °C to 105 °C for consumer-grade embedded use.
  • Package & Mounting 480-lead TBGA (37.5 × 37.5 mm) surface-mount package with exposed pad for thermal dissipation and high-density board layouts.
  • Compliance RoHS compliant and marked as Consumer qualification in supplier data.

Typical Applications

  • Consumer Networking Equipment Multi-port Ethernet and USB support make this MPU suitable for consumer gateways, home routers and similar networked appliances.
  • Embedded Communications Appliances Integrated SCCs, CPM and Ethernet MACs enable protocol-heavy embedded systems and communications controllers.
  • Board-Level Integrated Systems On-chip PCI bridge and memory controllers allow compact board designs where reducing external components and simplify BOM is a priority.

Unique Advantages

  • Integrated Communications Peripherals: Three 10/100 Ethernet MACs, SCCs and USB 2.0 provide multiple connectivity options without requiring extensive external logic.
  • Deterministic Core Performance: Dual-issue PowerPC G2_LE core at up to 450 MHz with 16 KB instruction and data caches supports predictable embedded processing for protocol and control tasks.
  • Offload and Acceleration: Dedicated communications co-processors (RISC CPM and DSP-oriented resources) reduce CPU load for packet and protocol processing.
  • Compact, Thermally Attuned Package: 480-TBGA (37.5 × 37.5 mm) with exposed pad enables high-density designs while addressing thermal management at board level.
  • Design-Ready Memory Interface: Built-in DRAM/SDRAM controllers streamline memory subsystem design and shorten development cycles.
  • Regulatory and Assembly Friendly: RoHS compliance and surface-mount package simplify modern manufacturing and environmental requirements.

Why Choose KMPC8270ZUUPEA?

The KMPC8270ZUUPEA positions itself as a highly integrated embedded communications MPU combining a dual-issue PowerPC G2_LE core with extensive on-chip peripherals focused on networking and protocol handling. Its mix of Ethernet ports, serial controllers, USB 2.0, memory controllers and communications co-processors reduces external component count and simplifies board-level design for consumer-grade embedded systems.

This part is well suited to designers seeking a compact, connectivity-rich processor for consumer networking appliances and embedded communications products that require reliable protocol processing, reduced BOM complexity and a clear upgrade path within the MPC8270 family.

Request a quote or submit an inquiry to discuss availability, lead times, and volume pricing for KMPC8270ZUUPEA.

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